Zeng; Xiaoguang
Patent Applications and Registrations
Patent applications and USPTO patent grants for Zeng; Xiaoguang.The latest application filed is for "molded intelligent power module for motors".
- Zeng; Xiaoguang - Shanghai CN
- Zeng; Xiaoguang - Sunnyvale CA
- Zeng; Xiaoguang - Songjiang N/A SG
| Patent | Date |
|---|---|
| Molded intelligent power module for motors Grant 10,600,727 - Niu , et al. | 2020-03-24 |
| Molded Intelligent Power Module For Motors App 20190006270 - Niu; Zhiqiang ; et al. | 2019-01-03 |
| Flip chip semiconductor device Grant 9,437,587 - Zhang , et al. September 6, 2 | 2016-09-06 |
| Flip Chip Semiconductor Device App 20150206868 - Zhang; Xiaotian ; et al. | 2015-07-23 |
| Flip chip semiconductor device Grant 8,669,650 - Zhang , et al. March 11, 2 | 2014-03-11 |
| Flip Chip Semiconductor Device App 20120248539 - Zhang; Xiaotian ; et al. | 2012-10-04 |
| Chemical-enhanced package singulation process Grant 7,553,700 - Yilmaz , et al. June 30, 2 | 2009-06-30 |
| Semiconductor device package diepad having features formed by electroplating App 20080142936 - Yilmaz; Hamza ; et al. | 2008-06-19 |
| Semiconductor device package diepad having features formed by electroplating Grant 7,382,044 - Yilmaz , et al. June 3, 2 | 2008-06-03 |
| Semiconductor device package diepad having features formed by electroplating Grant 7,122,406 - Yilmaz , et al. October 17, 2 | 2006-10-17 |
| Chemical-enhanced package singulation process App 20050255634 - Yilmaz, Hamza ; et al. | 2005-11-17 |
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