| Patent | Date |
|---|
Multi-chip assembly with optically coupled die
Grant 8,189,361 - Zhou , et al. May 29, 2 | 2012-05-29 |
Integrated capacitors in package-level structures, processes of making same, and systems containing same
Grant 7,989,916 - Tang , et al. August 2, 2 | 2011-08-02 |
Copper plating connection for multi-die stack in substrate package
Grant 7,981,726 - Tang , et al. July 19, 2 | 2011-07-19 |
Multi-chip Assembly With Optically Coupled Die
App 20110058419 - Zhou; Qing A. ; et al. | 2011-03-10 |
Multi-chip assembly with optically coupled die
Grant 7,851,809 - Zhou , et al. December 14, 2 | 2010-12-14 |
Packaged spiral inductor structures, processes of making same, and systems containing same
Grant 7,852,189 - He , et al. December 14, 2 | 2010-12-14 |
Dual heat spreader panel assembly method for bumpless die-attach packages, packages containing same, and systems containing same
Grant 7,723,164 - Lu , et al. May 25, 2 | 2010-05-25 |
Substrate with lossy material insert
Grant 7,714,430 - Zeng , et al. May 11, 2 | 2010-05-11 |
Package level noise isolation
Grant 7,709,934 - Zeng , et al. May 4, 2 | 2010-05-04 |
Integrated capacitors in package-level structures, processes of making same, and systems containing same
App 20100059858 - Tang; John J. ; et al. | 2010-03-11 |
Integrated capacitors in package-level structures, processes of making same, and systems containing same
Grant 7,670,919 - Tang , et al. March 2, 2 | 2010-03-02 |
Dual-chip integrated heat spreader assembly, packages containing same, and systems containing same
Grant 7,659,143 - Tang , et al. February 9, 2 | 2010-02-09 |
Multi-chip assembly with optically coupled die
App 20090250707 - Zhou; Qing A. ; et al. | 2009-10-08 |
Multi-chip assembly with optically coupled die
Grant 7,564,066 - Zhou , et al. July 21, 2 | 2009-07-21 |
Reducing parasitic mutual capacitances
Grant 7,535,080 - Zeng , et al. May 19, 2 | 2009-05-19 |
Reducing input capacitance of high speed integrated circuits
Grant 7,535,689 - Zeng , et al. May 19, 2 | 2009-05-19 |
Dual die package with high-speed interconnect
Grant 7,511,359 - Tang , et al. March 31, 2 | 2009-03-31 |
Package Including a Microprocessor & Fourth Level Cache
App 20090039482 - He; Jiangqi ; et al. | 2009-02-12 |
Package level integration of antenna and RF front-end module
Grant 7,477,197 - Zeng , et al. January 13, 2 | 2009-01-13 |
Reducing input capacitance for high speed integrated circuits
App 20080316662 - Zeng; Xiang Yin ; et al. | 2008-12-25 |
Package level noise isolation
App 20080157294 - Zeng; Xiang Yin ; et al. | 2008-07-03 |
Package Level Integration Of Antenna And Rf Front-end Module
App 20080158063 - ZENG; Xiang Yin ; et al. | 2008-07-03 |
Double side stacked die package
App 20080157322 - Tang; Jia Miao ; et al. | 2008-07-03 |
Stacked die package with die interconnects
App 20080157324 - Tang; Jia Miao ; et al. | 2008-07-03 |
Strip patterned transmission line
App 20080157335 - Tang; Jia Miao ; et al. | 2008-07-03 |
Increasing the resistance of a high frequency input/output power delivery decoupling path
App 20080145977 - Zeng; Xiang Yin ; et al. | 2008-06-19 |
Substrate with lossy material insert
App 20080102565 - Zeng; Xiang Yin ; et al. | 2008-05-01 |
Dual-chip Integrated Heat Spreader Assembly, Packages Containing Same, And Systems Containing Same
App 20080079144 - Tang; Jiamiao ; et al. | 2008-04-03 |
Array capacitor apparatuses to filter input/output signal
Grant 7,348,661 - Kim , et al. March 25, 2 | 2008-03-25 |
Data signal interconnection with reduced crosstalk
Grant 7,255,573 - He , et al. August 14, 2 | 2007-08-14 |
Integrated capacitors in package-level structures, processes of making same, and systems containing same
App 20070158818 - Tang; John J. ; et al. | 2007-07-12 |
Data Signal Interconnection With Reduced Crosstalk
App 20070155195 - He; Jiangqi ; et al. | 2007-07-05 |
Dual die package with high-speed interconnect
App 20070152312 - Tang; John J. ; et al. | 2007-07-05 |
Packaged spiral inductor structures, processes of making same, and systems containing same
App 20070152796 - He; Jiangqi ; et al. | 2007-07-05 |
Plating bar design for high speed package design
App 20070145543 - Zeng; Xiang Yin ; et al. | 2007-06-28 |
Complementary inductor structures
App 20070146105 - Zeng; Xiang Yin ; et al. | 2007-06-28 |
Copper plating connection for multi-die stack in substrate package
App 20070132082 - Tang; John J. ; et al. | 2007-06-14 |
IC package with signal land pads
Grant 7,227,247 - Zeng , et al. June 5, 2 | 2007-06-05 |
Multi-chip assembly with optically coupled die
App 20070102733 - Zhou; Qing A. ; et al. | 2007-05-10 |
Reducing parasitic mutual capacitances
App 20070001260 - Zeng; Xiang Yin ; et al. | 2007-01-04 |
Extended thin film capacitor (TFC)
Grant 7,123,466 - He , et al. October 17, 2 | 2006-10-17 |
IC package with signal land pads
App 20060180905 - Zeng; Xiang Yin ; et al. | 2006-08-17 |
Methods of forming in package integrated capacitors and structures formed thereby
App 20060124985 - Zeng; Xiang Yin ; et al. | 2006-06-15 |
Methods of forming in package integrated capacitors and structures formed thereby
App 20060081998 - Zeng; Xiang Yin ; et al. | 2006-04-20 |
Extended thin film capacitor (TFC)
Grant 7,027,289 - He , et al. April 11, 2 | 2006-04-11 |
Array capacitor apparatuses to filter input/output signal
App 20060071341 - Kim; Hyunjun ; et al. | 2006-04-06 |
Extended thin film capacitor (TFC)
App 20050281008 - He, Jiangqi ; et al. | 2005-12-22 |
Extended Thin Film Capacitor (tfc)
App 20050213281 - He, Jiangqi ; et al. | 2005-09-29 |
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