loadpatents
Patent applications and USPTO patent grants for ZENG; Qijun.The latest application filed is for "method for measuring rheological property of drilling fluid by using curved pipe on site".
Patent | Date |
---|---|
Method For Measuring Rheological Property Of Drilling Fluid By Using Curved Pipe On Site App 20220228961 - XIE; Dengpan ;   et al. | 2022-07-21 |
Wet connector for trident rigless electrical submersible pump (ESP) technology Grant 11,359,441 - Zhang , et al. June 14, 2 | 2022-06-14 |
Spiral deployed isolation tool Grant 11,326,416 - Zheng , et al. May 10, 2 | 2022-05-10 |
Integrated coupling and downhole plugging system and plugging method Grant 11,261,691 - Zeng March 1, 2 | 2022-03-01 |
Wet Connector For Trident Rigless Electrical Submersible Pump (esp) Technology App 20220056768 - ZHANG; Qiang ;   et al. | 2022-02-24 |
Integrated Coupling And Downhole Plugging System And Plugging Method App 20220018210 - Zeng; Qijun | 2022-01-20 |
Ball seat Grant 10,934,803 - Zeng March 2, 2 | 2021-03-02 |
Ball Seat App 20200291739 - ZENG; Qijun | 2020-09-17 |
uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.
While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.
All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.