Zeng; Juan
Patent Applications and Registrations
Patent applications and USPTO patent grants for Zeng; Juan.The latest application filed is for "clock phase management for die-to-die (d2d) interconnect".
- Zeng; Juan - San Jose CA
- Zeng; Juan - Hillsboro OR
- Zeng; Juan - Guangdong CN
- Zeng; Juan - West Lafayette IN
- ZENG; Juan - Shenzhen CN
| Patent | Date |
|---|---|
| Clock Phase Management For Die-to-die (d2d) Interconnect App 20220271912 - Pasdast; Gerald ; et al. | 2022-08-25 |
| Scalable And Interoperable Phyless Die-to-die Io Solution App 20210398906 - QIAN; Zhiguo ; et al. | 2021-12-23 |
| Nonuniform Corrugated Diaphragm For Mems Tuners And Actuators App 20180198185 - Zeng; Juan ; et al. | 2018-07-12 |
| Shell, method of preparing the shell and electronic product comprising the shell Grant 9,956,744 - Sun , et al. May 1, 2 | 2018-05-01 |
| Nonuniform corrugated diaphragm for MEMS tuners and actuators Grant 9,917,344 - Zeng , et al. March 13, 2 | 2018-03-13 |
| Nonuniform Corrugated Diaphragm For Mems Tuners And Actuators App 20160336922 - Zeng; Juan ; et al. | 2016-11-17 |
| Shell, Method Of Preparing The Shell And Electronic Product Comprising The Shell App 20140363623 - SUN; Jian ; et al. | 2014-12-11 |
| Aluminum Alloy, Aluminum Alloy Resin Composite And Method Of Preparing The Same App 20140363658 - SUN; Jian ; et al. | 2014-12-11 |
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