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name:-0.015768051147461
name:-0.012233018875122
Zeisel; Roland Patent Filings

Zeisel; Roland

Patent Applications and Registrations

Patent applications and USPTO patent grants for Zeisel; Roland.The latest application filed is for "method and device for electrically contacting components in a semiconductor wafer".

Company Profile
8.11.13
  • Zeisel; Roland - Tegernheim DE
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Device and method for processing a multiplicity of semiconductor chips
Grant 11,378,590 - Bergler , et al. July 5, 2
2022-07-05
Method And Device For Electrically Contacting Components In A Semiconductor Wafer
App 20220163564 - BERGLER; Michael ;   et al.
2022-05-26
Device And Method For Processing A Multiplicity Of Semiconductor Chips
App 20210356496 - BERGLER; Michael ;   et al.
2021-11-18
Radiation-emitting component
Grant 11,011,573 - Zeisel May 18, 2
2021-05-18
Method for structuring a nitride layer, structured dielectric layer, optoelectronic component, etching method for etching layers, and an environment sensor
Grant 10,872,783 - Rueckerl , et al. December 22, 2
2020-12-22
Method and device for measurement of a plurality of semiconductor chips in a wafer array
Grant 10,867,873 - Specht , et al. December 15, 2
2020-12-15
Radiation-emitting Component
App 20200203421 - Zeisel; Roland
2020-06-25
Method For Structuring A Nitride Layer, Structured Dielectric Layer, Optoelectronic Component, Etching Method For Etching Layers
App 20200168472 - RUECKERL; Andreas ;   et al.
2020-05-28
Optoelectronic semiconductor chip
Grant 10,651,342 - Zeisel , et al.
2020-05-12
Light-emitting diode chip, and method for manufacturing a light-emitting diode chip
Grant 10,580,938 - Ebbecke , et al.
2020-03-03
Method for structuring a nitride layer, structured dielectric layer, optoelectronic component, etching method for etching layers, and an environment sensor
Grant 10,566,210 - Rueckerl , et al. Feb
2020-02-18
Optoelectronic Semiconductor Chip
App 20190259911 - Zeisel; Roland ;   et al.
2019-08-22
Method and Device for Measurement of a Plurality of Semiconductor Chips in a Wafer Array
App 20190189527 - Specht; Holger ;   et al.
2019-06-20
Method and device for inspecting an optoelectronic component arranged on a connection board
Grant 10,288,671 - Schulz , et al.
2019-05-14
Light-Emitting Diode Chip, and Method for Manufacturing a Light-Emitting Diode Chip
App 20180374994 - Ebbecke; Jens ;   et al.
2018-12-27
Method and device for measuring and optimizing an optoelectronic component
Grant 10,132,855 - Schulz , et al. November 20, 2
2018-11-20
Method For Structuring A Nitride Layer, Structured Dielectric Layer, Optoelectronic Component, Etching Method For Etching Layers, And An Environment Sensor
App 20180040485 - RUECKERL; Andreas ;   et al.
2018-02-08
Method and Device for Inspecting an Optoelectronic Component
App 20180024185 - Schulz; Robert ;   et al.
2018-01-25
Optoelectronic semiconductor chip and optoelectronic component
Grant 9,853,018 - Leirer , et al. December 26, 2
2017-12-26
Optoelectronic Semiconductor Chip and Optoelectronic Component
App 20160225749 - Leirer; Christian ;   et al.
2016-08-04
Method and Device for Measuring and Optimizing an Optoelectronic Component
App 20160003890 - Schulz; Robert ;   et al.
2016-01-07
Process for structuring at least one year as well as electrical component with structures from the layer
Grant 7,741,227 - Hackenberger , et al. June 22, 2
2010-06-22
Process for Structuring at Least One Layer as Well as Electrical Component with Structures From the Layer
App 20080001162 - Hackenberger; Maja ;   et al.
2008-01-03
Radiation-emitting semiconductor chip and method for the production thereof
App 20050233484 - Stein, Wilhelm ;   et al.
2005-10-20

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