Zegzula; Dennis
Patent Applications and Registrations
Patent applications and USPTO patent grants for Zegzula; Dennis.The latest application filed is for "method of joining a surface-mount component to a substrate with solder that has been temporarily secured".
- Zegzula; Dennis - East Patchogue NY
| Patent | Date |
|---|---|
| Method Of Joining A Surface-mount Component To A Substrate With Solder That Has Been Temporarily Secured App 20210082868 - Conte; Robert ; et al. | 2021-03-18 |
| Method of joining a surface-mount component to a substrate with solder that has been temporarily secured Grant 10,879,211 - Conte , et al. December 29, 2 | 2020-12-29 |
| Method Of Joining A Surface-mount Component To A Substrate With Solder That Has Been Temporarily Secured App 20180082975 - Conte; Robert ; et al. | 2018-03-22 |
| Surface mount device Grant D803,795 - Au , et al. November 28, 2 | 2017-11-28 |
| Surface mount device Grant D803,798 - Au , et al. November 28, 2 | 2017-11-28 |
| Surface mount device Grant D803,796 - Au , et al. November 28, 2 | 2017-11-28 |
| Surface mount device Grant D803,797 - Au , et al. November 28, 2 | 2017-11-28 |
| Low cost high strength surface mount package Grant 9,392,713 - Au , et al. July 12, 2 | 2016-07-12 |
| Low Cost High Strength Surface Mount Package App 20160113138 - Au; Ching ; et al. | 2016-04-21 |
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