Zeblisky; Rudolph J.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Zeblisky; Rudolph J..The latest application filed is for "method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures".
- Zeblisky; Rudolph J. - Hauppauge NY
| Patent | Date |
|---|---|
| Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures Grant 4,908,242 - Hughes , et al. March 13, 1 | 1990-03-13 |
| Method for electroplating non-metallic surfaces Grant 4,683,036 - Morrissey , et al. July 28, 1 | 1987-07-28 |
| Novel precious metal sensitizing solutions Grant 4,187,198 - Zeblisky * February 5, 1 | 1980-02-05 |
| Treatment of liquids containing complexed heavy metals and complexing agents Grant 4,076,618 - Zeblisky February 28, 1 | 1978-02-28 |
| Sensitizers and process for electroless metal deposition Grant 3,961,109 - Kremer , et al. June 1, 1 | 1976-06-01 |
| Novel precious metal sensitizing solutions Grant 3,960,573 - Zeblisky June 1, 1 | 1976-06-01 |
| Improvements in electroless metal plating Grant 3,959,531 - Schneble, Jr. , et al. May 25, 1 | 1976-05-25 |
| Electroless Copper Plating Grant 3,650,777 - Schneble, Jr. , et al. March 21, 1 | 1972-03-21 |
| Electroless Metal Deposition Grant 3,635,758 - Schneble, Jr. , et al. January 18, 1 | 1972-01-18 |
| Plated Through Hole Printed Circuit Boards Grant 3,628,999 - Schneble, Jr. , et al. December 21, 1 | 1971-12-21 |
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