Zeb; Gul
Patent Applications and Registrations
Patent applications and USPTO patent grants for Zeb; Gul.The latest application filed is for "method of integrating a copper plating process in a through-substrate-via (tsv) on cmos wafer".
- Zeb; Gul - Montreal CA
| Patent | Date |
|---|---|
| Method of integrating a copper plating process in a through-substrate-via (TSV) on CMOS wafer Grant 10,347,564 - Lagouge , et al. July 9, 2 | 2019-07-09 |
| Integrated capacitive humidity sensor Grant 10,336,606 - Zhang , et al. | 2019-07-02 |
| Method Of Integrating A Copper Plating Process In A Through-substrate-via (tsv) On Cmos Wafer App 20180019187 - Lagouge; Matthieu ; et al. | 2018-01-18 |
| Integrated Capacitive Humidity Sensor App 20170247247 - Zhang; Qing ; et al. | 2017-08-31 |
| Method of integrating a copper plating process in a through-substrate-via (TSV) on CMOS wafer Grant 9,704,784 - Lagouge , et al. July 11, 2 | 2017-07-11 |
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