Zbrzezny; Adam
Patent Applications and Registrations
Patent applications and USPTO patent grants for Zbrzezny; Adam.The latest application filed is for "wafer level packaging of semiconductor chips".
- Zbrzezny; Adam - Warsaw N/A PL
- Zbrzezny; Adam - Scarborough CA
| Patent | Date |
|---|---|
| Die substrate with reinforcement structure Grant 8,927,344 - Topacio , et al. January 6, 2 | 2015-01-06 |
| Wafer level packaging of semiconductor chips Grant 8,785,317 - Mclellan , et al. July 22, 2 | 2014-07-22 |
| Wafer Level Packaging Of Semiconductor Chips App 20130095614 - Mclellan; Neil ; et al. | 2013-04-18 |
| Die Substrate With Reinforcement Structure App 20130069250 - Topacio; Roden ; et al. | 2013-03-21 |
| Wafer level packaging of semiconductor chips Grant 8,344,505 - Mclellan , et al. January 1, 2 | 2013-01-01 |
| Die substrate with reinforcement structure Grant 8,313,984 - Topacio , et al. November 20, 2 | 2012-11-20 |
| Die substrate with reinforcement structure App 20090236730 - Topacio; Roden ; et al. | 2009-09-24 |
| Wafer Level Packaging Of Semiconductor Chips App 20090057887 - Mclellan; Neil ; et al. | 2009-03-05 |
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