ZARBOCK; Edward A.

Patent Applications and Registrations

Patent applications and USPTO patent grants for ZARBOCK; Edward A..The latest application filed is for "photonic package architecture".

Company Profile

0.11.18

ZARBOCK; Edward A. - Gilbert AZ
Zarbock; Edward A. - Gilbery AZ US
Zarbock; Edward A - Gilbert AZ

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Photonic Package Architecture App 20170108655 - ZARBOCK; Edward A. ; et al.	2017-04-20
Photonic package architecture Grant 9,570,883 - Zarbock , et al. February 14, 2	2017-02-14
Interposer for hermetic sealing of sensor chips and for their integration with integrated circuit chips Grant 9,368,429 - Ma , et al. June 14, 2	2016-06-14
Using an optically transparent solid material as a support structure for attachment of a semiconductor material to a substrate Grant 9,190,388 - Sankman , et al. November 17, 2	2015-11-17
Ball Placement In A Photo-patterned Template For Fine Pitch Interconnect App 20140206185 - Lei; Ming ; et al.	2014-07-24
Photonic Package Architecture App 20140029639 - Zarbock; Edward A. ; et al.	2014-01-30
Using An Optically Transparent Solid Material As A Support Structure For Attachment Of A Semiconductor Material To A Substrate App 20140024174 - Sankman; Robert L. ; et al.	2014-01-23
Interposer For Hermetic Sealing Of Sensor Chips And For Their Integration With Integrated Circuit Chips App 20130249109 - MA; Qing ; et al.	2013-09-26
Microelectronic package with carbon nanotubes interconnect and method of making same Grant 8,004,076 - Zarbock , et al. August 23, 2	2011-08-23
Method, Apparatus, And System For Thin Die Thin Thermal Interface Material In Integrated Circuit Packages App 20100246138 - Shi; Wei ; et al.	2010-09-30
Microelectronic Package With Carbon Nanotubes Interconnect And Method Of Making Same App 20100078799 - Zarbock; Edward A. ; et al.	2010-04-01
Thermal interface material for combined reflow Grant 7,629,203 - Suh , et al. December 8, 2	2009-12-08
Linked Chip Attach And Underfill App 20090293266 - Zarbock; Edward A. ; et al.	2009-12-03
Linked Chip Attach And Underfill App 20090246917 - Zarbock; Edward A. ; et al.	2009-10-01
Thermal Interface Material For Combined Reflow App 20090244850 - Suh; Daewoong ; et al.	2009-10-01
Linked chip attach and underfill Grant 7,588,968 - Zarbock , et al. September 15, 2	2009-09-15
Chip-to-chip optical interconnect Grant 7,373,033 - Lu , et al. May 13, 2	2008-05-13
Chip-to-chip Optical Interconnect App 20070297713 - Lu; Daoqiang ; et al.	2007-12-27
Method, Apparatus, And System For Thin Die Thin Thermal Interface Material In Integrated Circuit Packages App 20070284730 - Shi; Wei ; et al.	2007-12-13
Locking mechanism for die assembly App 20060273454 - Lu; Daogiang ; et al.	2006-12-07
Through silicon via, folded flex microelectronic package Grant 6,924,551 - Rumer , et al. August 2, 2	2005-08-02
Through silicon via, folded flex microelectronic package App 20040238936 - Rumer, Christopher L. ; et al.	2004-12-02

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