Zang; Yuan
Patent Applications and Registrations
Patent applications and USPTO patent grants for Zang; Yuan.The latest application filed is for "substrate interconnections for packaged semiconductor device".
- Zang; Yuan - Tianjin CN
| Patent | Date |
|---|---|
| Lead frame with dummy leads for burr mitigation during encapsulation Grant 10,037,935 - Pang , et al. July 31, 2 | 2018-07-31 |
| Substrate interconnections for packaged semiconductor device Grant 9,997,445 - Yow , et al. June 12, 2 | 2018-06-12 |
| Substrate Interconnections For Packaged Semiconductor Device App 20180114748 - Yow; Kai Yun ; et al. | 2018-04-26 |
| Lead Frame Based Semiconductor Die Package App 20140361421 - Bai; Zhigang ; et al. | 2014-12-11 |
| Lead frame based semiconductor die package Grant 8,901,721 - Bai , et al. December 2, 2 | 2014-12-02 |
| Semiconductor Device And Method Of Assembling Same App 20130249071 - Yao; Jinzhong ; et al. | 2013-09-26 |
| Lead Frame For Semiconductor Package App 20080283980 - Gao; Wei ; et al. | 2008-11-20 |
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