loadpatents
name:-0.1833279132843
name:-0.013581037521362
name:-0.00057196617126465
Zama; Satoru Patent Filings

Zama; Satoru

Patent Applications and Registrations

Patent applications and USPTO patent grants for Zama; Satoru.The latest application filed is for "lead frame for optical semiconductor device, method of producing the same, and optical semiconductor device".

Company Profile
0.10.12
  • Zama; Satoru - Tokyo N/A JP
  • Zama; Satoru - Chiyoda-ku JP
  • Zama; Satoru - Nikko JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Silver-coated composite material for a movable contact part, method of producing the same, and movable contact part
Grant 8,637,164 - Kobayashi , et al. January 28, 2
2014-01-28
Multilayer printed board and method for manufacturing the same
Grant 8,476,534 - Zama , et al. July 2, 2
2013-07-02
Lead Frame For Optical Semiconductor Device, Method Of Producing The Same, And Optical Semiconductor Device
App 20130099270 - KOBAYASHI; Yoshiaki ;   et al.
2013-04-25
Composite material for electrical/electronic part and electrical/electronic part using the same
Grant 8,337,997 - Sugahara , et al. December 25, 2
2012-12-25
Silver-coated Composite Material For A Movable Contact Part, Method Of Producing The Same, And Movable Contact Part
App 20120301745 - KOBAYASHI; Yoshiaki ;   et al.
2012-11-29
Composite material for electrical/electronic part and electrical/electronic part using the same
Grant 8,158,269 - Sugahara , et al. April 17, 2
2012-04-17
Metal clad laminate and method for manufacturing metal clad laminate
Grant 8,147,904 - Zama , et al. April 3, 2
2012-04-03
Laminated circuit board
Grant 7,976,956 - Suzuki , et al. July 12, 2
2011-07-12
Composite Material For Electrical/electronic Part And Electrical/electronic Part Using The Same
App 20110091739 - SUGAHARA; Chikahito ;   et al.
2011-04-21
Composite Material For Electrical/electronic Part And Electrical/electronic Part Using The Same
App 20110091740 - Sugahara; Chikahito ;   et al.
2011-04-21
Multilayer Printed Board And Method For Manufacturing The Same
App 20100276184 - Zama; Satoru ;   et al.
2010-11-04
Process For Producing Metal Clad Laminate
App 20100092680 - Ohga; Kenichi ;   et al.
2010-04-15
Metal Clad Laminate And Method For Manufacturing Metal Clad Laminate
App 20100047517 - Zama; Satoru ;   et al.
2010-02-25
Composite material for electric and electronic components, electric and electronic components, and method for manufacturing composite material for electric and electronic components
App 20090291318 - Sugahara; Chikahito ;   et al.
2009-11-26
Conductive Base Material With Thin Film Resistance Layer, Method Of Production Of Conductive Base Material With Thin Film Resistance Layer, And Circuit Board With Thin Film Resistance Layer
App 20070228443 - KIKUCHI; Yuuki ;   et al.
2007-10-04
Laminated circuit board
App 20070110969 - Suzuki; Yuuji ;   et al.
2007-05-17
Laminated Circuit Board
App 20070048507 - SUZUKI; Yuuji ;   et al.
2007-03-01
Optical module and method of assembling the optical module
Grant 6,963,676 - Zama , et al. November 8, 2
2005-11-08
Optical module and method of assembling the optical module
App 20050041934 - Zama, Satoru ;   et al.
2005-02-24
IC socket
Grant 6,123,552 - Sakata , et al. September 26, 2
2000-09-26

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