Zalesinski; Jerzy Maria

Patent Applications and Registrations

Patent applications and USPTO patent grants for Zalesinski; Jerzy Maria.The latest application filed is for "coaxial wiring within soi semiconductor, pcb to system for high speed operation and signal quality".

Company Profile

0.9.2

Zalesinski; Jerzy Maria - Essex Junction VT

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Coaxial wiring within SOI semiconductor, PCB to system for high speed operation and signal quality Grant 6,943,452 - Bertin , et al. September 13, 2	2005-09-13
Coaxial wiring within SOI semiconductor, PCB to system for high speed operation and signal quality App 20020101723 - Bertin, Claude Louis ; et al.	2002-08-01
Through-chip conductors for low inductance chip-to-chip integration and off-chip connections Grant 6,410,431 - Bertin , et al. June 25, 2	2002-06-25
Coaxial wiring within SOI semiconductor, PCB to system for high speed operation and signal quality Grant 6,388,198 - Bertin , et al. May 14, 2	2002-05-14
High density integrated circuit packaging with chip stacking and via interconnections Grant 6,236,115 - Gaynes , et al. May 22, 2	2001-05-22
Through-chip conductors for low inductance chip-to-chip integration and off-chip connections App 20010001292 - Bertin, Claude Louis ; et al.	2001-05-17
Through-chip conductors for low inductance chip-to-chip integration and off-chip connections Grant 6,222,276 - Bertin , et al. April 24, 2	2001-04-24
High density integrated circuit packaging with chip stacking and via interconnections Grant 6,187,678 - Gaynes , et al. February 13, 2	2001-02-13
Integrated heat exchanger for memory module Grant 6,025,992 - Dodge , et al. February 15, 2	2000-02-15
High density integrated circuit packaging with chip stacking and via interconnections Grant 6,002,177 - Gaynes , et al. December 14, 1	1999-12-14
Electrolytic method of depositing gold connectors on a printed circuit board Grant 5,733,466 - Benebo , et al. March 31, 1	1998-03-31

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