Zalesinski; Jerzy M.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Zalesinski; Jerzy M..The latest application filed is for "carrier for test, burn-in, and first level packaging".
- Zalesinski; Jerzy M. - Essex Junction VT
- Zalesinski, Jerzy M. - Essex Junetion VT
- Zalesinski; Jerzy M. - Crittenden County VT
| Patent | Date |
|---|---|
| Carrier for test, burn-in, and first level packaging Grant 7,394,268 - Bertin , et al. July 1, 2 | 2008-07-01 |
| Dual pitch contact pad footprint for flip-chip chips and modules Grant 7,196,908 - Budell , et al. March 27, 2 | 2007-03-27 |
| Carrier For Test, Burn-in, And First Level Packaging App 20070001708 - Bertin; Claude L. ; et al. | 2007-01-04 |
| Carrier for test, burn-in, and first level packaging Grant 7,132,841 - Bertin , et al. November 7, 2 | 2006-11-07 |
| Dual pitch contact pad footprint for flip-chip chips and modules App 20040246691 - Budell, Timothy W. ; et al. | 2004-12-09 |
| High efficiency heat sink/air cooler system for heat-generating components Grant 6,816,374 - Patel , et al. November 9, 2 | 2004-11-09 |
| High Efficiency Heat Sink/air Cooler System For Heat-generating Components App 20040190248 - Patel, Janak G. ; et al. | 2004-09-30 |
| Radial contact pad footprint and wiring for electrical components Grant 6,793,500 - Budell , et al. September 21, 2 | 2004-09-21 |
| Charge-coupled device wafer cover plate with compact interconnect wiring App 20020110949 - Tonti, William R. ; et al. | 2002-08-15 |
| Rolling ball connector Grant 6,358,627 - Benenati , et al. March 19, 2 | 2002-03-19 |
| Formation of charge-coupled-device with image pick-up array Grant 6,319,745 - Bertin , et al. November 20, 2 | 2001-11-20 |
| Rolling ball connector App 20010002330 - Benenati, Joseph A. ; et al. | 2001-05-31 |
| Enhanced heat-dissipating printed circuit board package Grant 6,212,076 - MacQuarrie , et al. April 3, 2 | 2001-04-03 |
| Rolling ball connector Grant 6,177,729 - Benenati , et al. January 23, 2 | 2001-01-23 |
| Method of manufacturing an integrated ULSI heatsink Grant 5,773,362 - Tonti , et al. June 30, 1 | 1998-06-30 |
| Direct chip attachment (DCA) with electrically conductive adhesives Grant 5,747,101 - Booth , et al. May 5, 1 | 1998-05-05 |
| Integrated ULSI heatsink Grant 5,729,052 - Tonti , et al. March 17, 1 | 1998-03-17 |
| Non-destructive target marking for image stitching Grant 5,663,806 - Grise , et al. September 2, 1 | 1997-09-02 |
| Process for fabricating an electronic circuit package Grant 5,567,984 - Zalesinski , et al. October 22, 1 | 1996-10-22 |
| Direct chip attachment (DCA) with electrically conductive adhesives Grant 5,543,585 - Booth , et al. August 6, 1 | 1996-08-06 |
| Universal frame for data card Grant 5,499,162 - Bartuska , et al. March 12, 1 | 1996-03-12 |
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