| Patent | Date |
|---|
Adhesive composition, circuit connecting material, connection structure of circuit member, and semiconductor device
Grant 8,696,942 - Katogi , et al. April 15, 2 | 2014-04-15 |
Adhesive composition, circuit connecting material, connection structure of circuit member, and semiconductor device
Grant 8,518,303 - Katogi , et al. August 27, 2 | 2013-08-27 |
Adhesive composition, circuit connecting material, connecting structure for circuit member, and semiconductor device
Grant 8,309,658 - Katogi , et al. November 13, 2 | 2012-11-13 |
Adhesive Composition, Circuit Connecting Material, Connection Structure Of Circuit Member, And Semiconductor Device
App 20120273974 - Katogi; Shigeki ; et al. | 2012-11-01 |
Film-like adhesive, adhesive sheet, and semiconductor device using same
Grant 8,293,847 - Masuko , et al. October 23, 2 | 2012-10-23 |
Adhesive composition, circuit connecting material, connecting structure for circuit member, and semiconductor device
Grant 8,138,268 - Katogi , et al. March 20, 2 | 2012-03-20 |
Adhesive Composition, Circuit Connecting Material, Connecting Structure For Circuit Member, And Semiconductor Device
App 20120063109 - KATOGI; Shigeki ; et al. | 2012-03-15 |
Adhesive for circuit connection, circuit connection method using the same, and circuit connected structure
Grant 8,029,911 - Nomura , et al. October 4, 2 | 2011-10-04 |
Adhesive Film And Process For Preparing The Same As Well As Adhesive Sheet And Semiconductor Device
App 20110193244 - MASUKO; Takashi ; et al. | 2011-08-11 |
Adhesive Composition, Circuit Connecting Material, Connecting Structure For Circuit Member, And Semiconductor Device
App 20110176288 - Katogi; Shigeki ; et al. | 2011-07-21 |
Adhesive For Circuit Connection, Circuit Connection Method Using The Same, And Circuit Connected Structure
App 20100294551 - Nomura; Satoyuki ; et al. | 2010-11-25 |
Wiring-connecting Material And Wiring-connected Board Production Process Using The Same
App 20100265685 - Fujinawa; Tohru ; et al. | 2010-10-21 |
Film-like Adhesive, Adhesive Sheet, And Semiconductor Device Using Same
App 20100239858 - Masuko; Takashi ; et al. | 2010-09-23 |
Adhesive composition, adhesive composition for circuit connection, connected body semiconductor device
Grant 7,795,325 - Katogi , et al. September 14, 2 | 2010-09-14 |
Semiconductor device and process for fabrication thereof
Grant 7,781,896 - Takeda , et al. August 24, 2 | 2010-08-24 |
Method for connecting electrodes, surface-treated wiring board and adhesive film used in the method, and electrode-connected structure
Grant 7,771,559 - Tsukagoshi , et al. August 10, 2 | 2010-08-10 |
Adhesive Composition, Circuit Connecting Material, Connection Structure Of Circuit Member, And Semiconductor Device
App 20090309220 - Katogi; Shigeki ; et al. | 2009-12-17 |
Adhesive Composition, Adhesive Composition For Circuit Connection, Connected Body Semiconductor Device
App 20090261483 - KATOGI; Shigeki ; et al. | 2009-10-22 |
Adhesive composition, adhesive composition for circuit connection, connected body semiconductor device
Grant 7,576,141 - Katogi , et al. August 18, 2 | 2009-08-18 |
Method for connecting electrodes, surface-treated wiring board and adhesive film used in the method, and electrode-connected structure
Grant 7,528,488 - Tsukagoshi , et al. May 5, 2 | 2009-05-05 |
Semiconductor Device And Process For Fabrication Thereof
App 20080290529 - TAKEDA; Shinji ; et al. | 2008-11-27 |
Semiconductor device and process for fabrication thereof
Grant 7,387,914 - Takeda , et al. June 17, 2 | 2008-06-17 |
Method for connecting electrodes, surface-treated wiring board and adhesive film used in the method, and electrode-connected structure
Grant 7,258,918 - Tsukagoshi , et al. August 21, 2 | 2007-08-21 |
Adhesive for circuit connection, circuit connection method using the same, and circuit connected structure
App 20070166549 - Nomura; Satoyuki ; et al. | 2007-07-19 |
Adhesive film and process for preparing the same as well as adhesive sheet and semiconductor device
App 20070098995 - Masuko; Takashi ; et al. | 2007-05-03 |
Adhesive for circuit connection, circuit connection method using the same, and circuit connection structure
Grant 7,208,105 - Nomura , et al. April 24, 2 | 2007-04-24 |
Wiring-connecting material and wiring-connected board production process using the same
Grant 7,141,645 - Fujinawa , et al. November 28, 2 | 2006-11-28 |
Method for connecting electrodes, surface-treated wiring board and adhesive film used in the method, and electrode-connected structure
App 20060263599 - Tsukagoshi; Isao ; et al. | 2006-11-23 |
Method for connecting electrodes, surface-treated wiring board and adhesive film used in the method, and electrode-connected structure
App 20060260744 - Tsukagoshi; Isao ; et al. | 2006-11-23 |
Wiring-connecting material and wiring-connected board production process using the same
App 20060252843 - Fujinawa; Tohru ; et al. | 2006-11-09 |
Semiconductor Device And Process For Fabrication Thereof
App 20060180903 - Takeda; Shinji ; et al. | 2006-08-17 |
Semiconductor device and process for fabrication thereof
Grant 7,078,094 - Takeda , et al. July 18, 2 | 2006-07-18 |
Semiconductor device and process for fabrication thereof
Grant 7,057,265 - Takeda , et al. June 6, 2 | 2006-06-06 |
Semiconductor device and process for fabrication thereof
Grant 7,012,320 - Takeda , et al. March 14, 2 | 2006-03-14 |
Adhesive composition, adhesive composition for circuit connection, connected body semiconductor device
App 20050282924 - Katogi, Shigeki ; et al. | 2005-12-22 |
Semiconductor device and process for fabrication thereof
Grant 6,855,579 - Takeda , et al. February 15, 2 | 2005-02-15 |
Resin composition, adhesives prepared therewith for bonding circuit members, and circuit boards
Grant 6,841,628 - Oota , et al. January 11, 2 | 2005-01-11 |
Semiconductor device and process for fabrication thereof
App 20040253770 - Takeda, Shinji ; et al. | 2004-12-16 |
Laminating method of film-shaped organic die-bonding material, die-bonding method, laminating machine and die-bonding apparatus, semiconductor device, and fabrication process of semiconductor device
Grant 6,825,249 - Takeda , et al. November 30, 2 | 2004-11-30 |
Wiring-connecting material and wiring-connected board production process using the same
App 20040214979 - Fujinawa, Tohru ; et al. | 2004-10-28 |
Wiring-connecting material and process for producing circuit board with the same
Grant 6,762,249 - Fujinawa , et al. July 13, 2 | 2004-07-13 |
Semiconductor device and process for fabrication thereof
Grant 6,717,242 - Takeda , et al. April 6, 2 | 2004-04-06 |
Method for connecting electrodes, surface-treated wiring board and adhesive film used in the method, and electrode-connected structure
App 20030178138 - Tsukagoshi, Isao ; et al. | 2003-09-25 |
Semiconductor device and process for fabrication thereof
App 20030160337 - Takeda, Shinji ; et al. | 2003-08-28 |
Adhesive for circuit connection , circuit connection method using the same, and circuit connection structure
App 20030141014 - Satoyuki, Nomura ; et al. | 2003-07-31 |
Resin composition , adhesive prepared therewith for bonding circuit members,and circuit boards
App 20030027942 - Oota, Satoru ; et al. | 2003-02-06 |
Chip supporting substrate for semiconductor package, semiconductor device, and method for manufacturing them
Grant 6,331,729 - Yusa , et al. December 18, 2 | 2001-12-18 |
Semiconductor device and process for fabrication thereof
App 20010035533 - Takeda, Shinji ; et al. | 2001-11-01 |
Semiconductor device and process for fabrication thereof
App 20010016384 - Takeda, Shinji ; et al. | 2001-08-23 |
Semiconductor device and process for fabrication thereof
App 20010009780 - Takeda, Shinji ; et al. | 2001-07-26 |
Substrate for holding a chip of semi-conductor package, semi-conductor package, and fabrication process of semi-conductor package
Grant 6,236,108 - Sota , et al. May 22, 2 | 2001-05-22 |
Laminating method of film-shaped organic die-bonding material, die-bonding method, laminating machine and die-bonding apparatus, semiconductor device, and fabrication process of semiconductor device
Grant 6,099,678 - Kotato , et al. August 8, 2 | 2000-08-08 |
Substrate for holding a chip of semi-conductor package, semi-conductor package, and fabrication process of semi-conductor package
Grant 6,064,111 - Sota , et al. May 16, 2 | 2000-05-16 |
Electrically conductive bonding films
Grant 5,667,899 - Yusa , et al. September 16, 1 | 1997-09-16 |
Alignment film for liquid crystal, liquid crystal-sandwiched panel, liquid crystal display module and material for liquid crystal alignment film
Grant 5,571,579 - Kato , et al. November 5, 1 | 1996-11-05 |
Alkenyl-fluorine-containing aromatic polyamide
Grant 5,243,019 - Takeda , et al. September 7, 1 | 1993-09-07 |
Processes for preparation of polyimide-isoindroquinazolinedione and precursor thereof
Grant 5,115,089 - Yoshida , et al. May 19, 1 | 1992-05-19 |
| 