Patent | Date |
---|
Method of manufacture of semiconductor integrated circuit device and semiconductor integrated circuit device Grant 7,737,023 - Uno , et al. June 15, 2 | 2010-06-15 |
Method Of Manufacture Of Semiconductor Integrated Circuit Device And Semiconductor Integrated Circuit Device App 20090011592 - Uno; Shouichi ;   et al. | 2009-01-08 |
Method of manufacture of semiconductor integrated circuit Grant 7,419,902 - Uno , et al. September 2, 2 | 2008-09-02 |
Process for treating solid surface and substrate surface Grant 7,264,677 - Nakahara , et al. September 4, 2 | 2007-09-04 |
Process for treating solid surface and substrate surface Grant 7,025,896 - Nakahara , et al. April 11, 2 | 2006-04-11 |
Process for treating solid surface and substrate surface App 20060037627 - Nakahara; Miwako ;   et al. | 2006-02-23 |
Method for manufacturing semiconductor device Grant 6,998,325 - Yunogami , et al. February 14, 2 | 2006-02-14 |
Method of manufacture of semiconductor integrated circuit App 20050186801 - Uno, Shouochi ;   et al. | 2005-08-25 |
Method for manufacturing semiconductor device App 20050101157 - Yunogami, Takashi ;   et al. | 2005-05-12 |
Semiconductor device and method of manufacturing the same Grant 6,774,020 - Fukada , et al. August 10, 2 | 2004-08-10 |
Semiconductor integrated circuit device having spaced-apart electrodes and the method thereof Grant 6,756,262 - Nakamura , et al. June 29, 2 | 2004-06-29 |
Process for treating solid surface and substrate surface App 20030205553 - Nakahara, Miwako ;   et al. | 2003-11-06 |
Process for treating solid surface and substrate surface Grant 6,613,242 - Nakahara , et al. September 2, 2 | 2003-09-02 |
Manufacturing method of semiconductor integrated circuit device Grant 6,607,988 - Yunogami , et al. August 19, 2 | 2003-08-19 |
Semiconductor device and method of manufacturing the same App 20030139031 - Fukada, Shinichi ;   et al. | 2003-07-24 |
Semiconductor device and method of manufacturing the same Grant 6,555,464 - Fukada , et al. April 29, 2 | 2003-04-29 |
Process for treating solid surface and substrate surface Grant 6,537,461 - Nakahara , et al. March 25, 2 | 2003-03-25 |
Method of manufacturing a semiconductor integrated circuit device Grant 6,506,674 - Ikeda , et al. January 14, 2 | 2003-01-14 |
Process for manufacturing semiconductor integrated circuit device Grant 6,497,992 - Yunogami , et al. December 24, 2 | 2002-12-24 |
Method of manufacturing a semiconductor integrated circuit Grant 6,451,665 - Yunogami , et al. September 17, 2 | 2002-09-17 |
Semiconductor device and method of manufacturing the same App 20020127848 - Fukada, Shinichi ;   et al. | 2002-09-12 |
Process for fabricating an integrated circuit device having a capacitor with an electrode formed at a high aspect ratio Grant 6,432,835 - Yunogami , et al. August 13, 2 | 2002-08-13 |
Method of manufacturing a semiconductor device App 20020076921 - Fukada, Shinichi ;   et al. | 2002-06-20 |
Process for treating solid surface and substrate surface App 20020070194 - Nakahara, Miwako ;   et al. | 2002-06-13 |
Method of manufacturing a semiconductor integrated circuit device App 20020039843 - Ikeda, Takenobu ;   et al. | 2002-04-04 |
Method of manufacturing a semiconductor device Grant 6,340,632 - Fukada , et al. January 22, 2 | 2002-01-22 |
Manufacturing method of semiconductor integrated circuit device App 20010006245 - Yunogami, Takashi ;   et al. | 2001-07-05 |
Process for manufacturing semiconductor integrated circuit device Grant 6,057,081 - Yunogami , et al. May 2, 2 | 2000-05-02 |
Solid state device fabrication method including a surface treatment step with a neutral particle beam with an energy between 10ev and 100ev Grant 5,314,839 - Mizutani , et al. May 24, 1 | 1994-05-24 |
Apparatus for and method of surface treatment for microelectronic devices Grant 5,284,544 - Mizutani , et al. February 8, 1 | 1994-02-08 |
Surface measuring method and apparatus Grant 5,115,130 - Suzuki , et al. May 19, 1 | 1992-05-19 |