Yun; Kyoung Ja
Patent Applications and Registrations
Patent applications and USPTO patent grants for Yun; Kyoung Ja.The latest application filed is for "chip substrate".
- Yun; Kyoung Ja - Cheonan-si KR
| Patent | Date |
|---|---|
| Base substrate which prevents burrs generated during the cutting process and method for manufacturing the same Grant 9,913,381 - Ahn , et al. March 6, 2 | 2018-03-06 |
| Chip substrate Grant 9,818,913 - Nam , et al. November 14, 2 | 2017-11-14 |
| Chip Substrate App 20170141274 - Nam; Ki Myung ; et al. | 2017-05-18 |
| Chip substrate comprising a plated layer and chip package using the same Grant 9,595,642 - Nam , et al. March 14, 2 | 2017-03-14 |
| Chip Substrate Comprising A Plated Layer And Chip Package Using The Same App 20160380159 - NAM; Ki Myung ; et al. | 2016-12-29 |
| Base Substrate Which Prevents Burrs Generated During the Cutting Process and Method for Manufacturing the Same App 20150049447 - Ahn; Bum Mo ; et al. | 2015-02-19 |
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