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Patent applications and USPTO patent grants for Yun; Hyun Joo.The latest application filed is for "chemical mechanical polishing apparatus and methods using a polishing surface with non-uniform rigidity".
Patent | Date |
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Chemical mechanical polishing apparatus and methods using a polishing surface with non-uniform rigidity Grant 7,491,118 - Yun , et al. February 17, 2 | 2009-02-17 |
Chemical Mechanical Polishing Apparatus and Methods Using a Polishing Surface with Non-Uniform Rigidity App 20060240749 - Yun; Hyun Joo ;   et al. | 2006-10-26 |
Chemical mechanical polishing apparatus and methods using a polishing surface with non-uniform rigidity Grant 7,090,570 - Yun , et al. August 15, 2 | 2006-08-15 |
Apparatus for transporting and polishing wafers Grant 7,044,833 - Yun , et al. May 16, 2 | 2006-05-16 |
Apparatus for transporting for polishing wafers App 20050164604 - Yun, Hyun-Joo ;   et al. | 2005-07-28 |
Chemical mechanical polishing apparatus and methods using a polishing surface with non-uniform rigidity App 20050095958 - Yun, Hyun Joo ;   et al. | 2005-05-05 |
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