Yun; Geum Hee

Patent Applications and Registrations

Patent applications and USPTO patent grants for Yun; Geum Hee.The latest application filed is for "capacitor component".

Company Profile

4.6.23

Yun; Geum Hee - Suwon-si KR
YUN; Geum-Hee - Hwaseong-si KR
Yun; Geum Hee - Suwon KR
Yun; Geum Hee - Gyunggi-do KR
Yun; Geum-Hee - Yongin-si KR
Yun; Geum-Hee - Kyunggi-Do KR
Yun; Geum Hee - Gyeonggi-do KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Capacitor component Grant 10,923,284 - Yun , et al. February 16, 2	2021-02-16
Capacitor Component App 20200185153 - YUN; Geum Hee ; et al.	2020-06-11
Fan-out semiconductor package and photosensitive resin composition Grant 10,283,426 - Yun , et al.	2019-05-07
Photo-curable And Thermo-curable Resin Composition And Cured Product Thereof App 20190121235 - YUN; Geum-Hee ; et al.	2019-04-25
Light Shielding Resin Compositions App 20180305509 - YUN; Geum-Hee ; et al.	2018-10-25
Fan-out Semiconductor Package And Photosensitive Resin Composition App 20180102297 - YUN; Geum Hee ; et al.	2018-04-12
Resin Composition For Printed Circuit Board, Insulating Film, And Printed Circuit Board Using The Same App 20160237303 - YUN; Geum-Hee ; et al.	2016-08-18
Resin Composition For Printed Circuit Board And Printed Circuit Board Comprising The Same App 20150147542 - MOON; Jin Seok ; et al.	2015-05-28
Multilayer inductor and method for manufacturing the same Grant 9,035,738 - Lee , et al. May 19, 2	2015-05-19
Insulating Resin Composition For Printed Circuit Board And Products Manufactured By Using The Same App 20150114693 - Moon; Jin Seok ; et al.	2015-04-30
Insulating Resin Composition For Printed Circuit Board And Products Manufactured By Using The Same App 20150065608 - Yun; Geum Hee ; et al.	2015-03-05
Insulating Resin Composition For Printed Circuit Board And Products Manufactured By Using The Same App 20150057393 - Moon; Jin Seok ; et al.	2015-02-26
Inorganic Filler, And Insulating Resin Composition, Insulating Film, Prepreg And Printed Circuit Board Including The Same App 20150027763 - HONG; Jin Ho ; et al.	2015-01-29
Insulating Resin Composition For Printed Circuit Board, Insulating Film, Prepreg And Printed Circuit Board App 20140367147 - Moon; Jin Seok ; et al.	2014-12-18
Resin Composition For Printed Circuit Board, Insulating Film, Prepreg And Printed Circuit Board App 20140154479 - Yun; Geum Hee ; et al.	2014-06-05
Multilayer Inductor And Method For Manufacturing The Same App 20140145812 - LEE; Sa Yong ; et al.	2014-05-29
Epoxy Resin Composition For Insulation, Insulating Film, Prepreg, And Printed Circuit Board App 20140076198 - Kim; Jin Young ; et al.	2014-03-20
Composition for forming substrate, and prepreg and substrate using the same Grant 8,101,248 - Yun , et al. January 24, 2	2012-01-24
Light emitting diode package and manufacturing method thereof Grant 8,043,876 - Lee , et al. October 25, 2	2011-10-25
Composition For Forming Substrate, And Prepreg And Substrate Using The Same App 20110121233 - Yun; Geum Hee ; et al.	2011-05-26
Heat Radiation Substrate and Illumination Module Substrate Having Hybrid Layer App 20100255742 - YUN; Geum Hee ; et al.	2010-10-07
Backlight unit using a thermoplastic resin board App 20090262520 - Park; Ho-Joon ; et al.	2009-10-22
Light emitting diode package and manufacturing method thereof App 20090189177 - Lee; Hwa-Young ; et al.	2009-07-30
Array light source using led and backlight unit including the same App 20090141481 - PARK; Ho-Joon ; et al.	2009-06-04
Eucryptite ceramic filler and insulating composite material containing the same App 20080242787 - Kim; Jin-Cheol ; et al.	2008-10-02
Parallel multi-layer printed circuit board having improved interconnection and method for manufacturing the same Grant 7,279,412 - Mok , et al. October 9, 2	2007-10-09
Laminate for printed circuit board and method of manufacturing the same App 20060257622 - Shin; Joon Sik ; et al.	2006-11-16
Apparatus and method for manufacturing copper clad laminate with improved peel strength App 20060124228 - Lee; Sang Youp ; et al.	2006-06-15
Parallel multi-layer printed circuit board having improved interconnection and method for manufacturing the same App 20050085065 - Mok, Jee-Soo ; et al.	2005-04-21

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