| Patent | Date |
|---|
Stacked Inductor Having A Discrete Metal-stack Pattern
App 20220285080 - KIM; Jonghae ; et al. | 2022-09-08 |
Chip Modules Employing Conductive Pillars To Couple A Passive Component Device To Conductive Traces In A Metallization Structure To Form A Passive Component
App 20220246552 - Yun; Changhan Hobie ; et al. | 2022-08-04 |
System In Package (sip) Socket Connector Interface
App 20220248541 - KIM; Daniel Daeik ; et al. | 2022-08-04 |
Capacitance Fine Tuning By Fin Capacitor Design
App 20220223516 - PARK; Nosun ; et al. | 2022-07-14 |
Tunable Circuit Including Integrated Filter Circuit Coupled To Variable Capacitance, And Related Integrated Circuit (ic) Packages And Fabrication Methods
App 20220123735 - Yun; Changhan Hobie ; et al. | 2022-04-21 |
Package Comprising An Integrated Passive Device Configured As A Cap For A Filter
App 20220069193 - YUN; Changhan Hobie ; et al. | 2022-03-03 |
Device, Package And/or Substrate Comprising Curved Antenna
App 20220069453 - YUN; Changhan Hobie ; et al. | 2022-03-03 |
Wire bond inductor structures for flip chip dies
Grant 11,239,158 - Thadesar , et al. February 1, 2 | 2022-02-01 |
Substrate Comprising Capacitor Configured For Power Amplifier Output Match
App 20210351750 - KIM; Daniel Daeik ; et al. | 2021-11-11 |
Wideband filter with resonators and inductors
Grant 11,121,699 - Liu , et al. September 14, 2 | 2021-09-14 |
Wideband Filter With Resonators And Inductors
App 20210257989 - LIU; Kai ; et al. | 2021-08-19 |
High performance inductors
Grant 11,024,454 - Kim , et al. June 1, 2 | 2021-06-01 |
Hybrid passive-on-glass (POG) acoustic filter
Grant 10,944,379 - Berdy , et al. March 9, 2 | 2021-03-09 |
Integrated circuits (ICs) on a glass substrate
Grant 10,903,240 - Gu , et al. January 26, 2 | 2021-01-26 |
Multi-die Interconnect
App 20200388604 - LEE; Byoungyong ; et al. | 2020-12-10 |
Wideband Filter With Resonators And Inductors
App 20200266512 - LIU; Kai ; et al. | 2020-08-20 |
Solenoid structure with conductive pillar technology
Grant 10,693,432 - Park , et al. | 2020-06-23 |
Inductors formed with through glass vias
Grant 10,614,942 - Yun , et al. | 2020-04-07 |
Passive-on-glass (POG) device and method
Grant 10,607,980 - Lan , et al. | 2020-03-31 |
Integrated Filter Technology With Embedded Devices
App 20200091094 - YUN; Changhan Hobie ; et al. | 2020-03-19 |
Integration of through glass via (TGV) filter and acoustic filter
Grant 10,582,609 - Yun , et al. | 2020-03-03 |
3D pillar inductor
Grant 10,553,671 - Zuo , et al. Fe | 2020-02-04 |
Inductors Formed With Through Glass Vias
App 20200020473 - YUN; Changhan Hobie ; et al. | 2020-01-16 |
Integrated device comprising a capacitor and inductor structure comprising a shared interconnect for a capacitor and an inductor
Grant 10,498,307 - Velez , et al. De | 2019-12-03 |
Two-dimensional structure to form an embedded three-dimensional structure
Grant 10,490,348 - Velez , et al. Nov | 2019-11-26 |
Close proximity tunable inductive elements
Grant 10,490,621 - Thadesar , et al. Nov | 2019-11-26 |
Solenoid Structure With Conductive Pillar Technology
App 20190356294 - PARK; Nosun ; et al. | 2019-11-21 |
Three-dimensional high quality passive structure with conductive pillar technology
Grant 10,433,425 - Liu , et al. O | 2019-10-01 |
Integrated Circuits (ics) On A Glass Substrate
App 20190259780 - GU; Shiqun ; et al. | 2019-08-22 |
Land grid array (LGA) packaging of passive-on-glass (POG) structure
Grant 10,361,149 - Zuo , et al. | 2019-07-23 |
Varying thickness inductor
Grant 10,354,795 - Kim , et al. July 16, 2 | 2019-07-16 |
Solenoid inductor
Grant 10,332,671 - Velez , et al. | 2019-06-25 |
Integrated circuits (ICs) on a glass substrate
Grant 10,332,911 - Gu , et al. | 2019-06-25 |
Semiconductor assembly and method of making same
Grant 10,319,694 - Kim , et al. | 2019-06-11 |
Substrate comprising an embedded inductor and a thin film magnetic core
Grant 10,290,414 - Yun , et al. | 2019-05-14 |
Inductor with metal-insulator-metal (MIM) capacitor
Grant 10,292,269 - Mudakatte , et al. | 2019-05-14 |
Skewed co-spiral inductor structure
Grant 10,283,257 - Kim , et al. | 2019-05-07 |
Integration Of Through Glass Via (tgv) Filter And Acoustic Filter
App 20190132942 - YUN; Changhan Hobie ; et al. | 2019-05-02 |
Stacked substrate inductor
Grant 10,249,580 - Kim , et al. | 2019-04-02 |
Compartment shielding in flip-chip (FC) module
Grant 10,242,957 - Kim , et al. | 2019-03-26 |
Integrated Device Comprising A Capacitor And Inductor Structure Comprising A Shared Interconnect For A Capacitor And An Inductor
App 20190081607 - VELEZ; Mario Francisco ; et al. | 2019-03-14 |
Shaped Circuit Wafers
App 20190035621 - YUN; Changhan Hobie ; et al. | 2019-01-31 |
Tunable matching network
Grant 10,187,031 - Ma , et al. Ja | 2019-01-22 |
Interposer device including at least one transistor and at least one through-substrate via
Grant 10,163,771 - Zuo , et al. Dec | 2018-12-25 |
Passive device assembly for accurate ground plane control
Grant 10,154,591 - Zuo , et al. Dec | 2018-12-11 |
Multi-density MIM capacitor for improved passive on glass (POG) multiplexer performance
Grant 10,141,908 - Mudakatte , et al. Nov | 2018-11-27 |
Passive components implemented on a plurality of stacked insulators
Grant 10,141,353 - Yun , et al. Nov | 2018-11-27 |
Open-passivation ball grid array pads
Grant 10,103,116 - Kim , et al. October 16, 2 | 2018-10-16 |
Double-sided circuit
Grant 10,103,703 - Yun , et al. October 16, 2 | 2018-10-16 |
Backside ground plane for integrated circuit
Grant 10,103,135 - Zuo , et al. October 16, 2 | 2018-10-16 |
Wafer level package (WLP) ball support using cavity structure
Grant 10,074,625 - Velez , et al. September 11, 2 | 2018-09-11 |
Encapsulation of acoustic resonator devices
Grant 10,069,474 - Yun , et al. September 4, 2 | 2018-09-04 |
Nested through glass via transformer
Grant 10,049,815 - Kim , et al. August 14, 2 | 2018-08-14 |
Single-chip multi-frequency film bulk acoustic-wave resonators
Grant 10,038,422 - Yun , et al. July 31, 2 | 2018-07-31 |
Apparatus with 3D wirewound inductor integrated within a substrate
Grant 10,026,546 - Yun , et al. July 17, 2 | 2018-07-17 |
Passive Device Assembly For Accurate Ground Plane Control
App 20180177052 - Zuo; Chengjie ; et al. | 2018-06-21 |
Hybrid Passive-on-glass (pog) Acoustic Filter
App 20180167054 - BERDY; David Francis ; et al. | 2018-06-14 |
Passive-on-glass (pog) Device And Method
App 20180145062 - Lan; Je-Hsiung Jeffrey ; et al. | 2018-05-24 |
Augmented capacitor structure for high quality (Q)-factor radio frequency (RF) applications
Grant 9,966,426 - Mudakatte , et al. May 8, 2 | 2018-05-08 |
Thin film magnet inductor structure for high quality (Q)-factor radio frequency (RF) applications
Grant 9,959,964 - Yun , et al. May 1, 2 | 2018-05-01 |
Multiplexer design using a 2D passive on glass filter integrated with a 3D through glass via filter
Grant 9,954,267 - Yun , et al. April 24, 2 | 2018-04-24 |
Backside Ground Plane For Integrated Circuit
App 20180090475 - ZUO; Chengjie ; et al. | 2018-03-29 |
Passive device assembly for accurate ground plane control
Grant 9,930,783 - Zuo , et al. March 27, 2 | 2018-03-27 |
Electrode Wrap-around Capacitors For Radio Frequency (rf) Applications
App 20180083588 - YUN; Changhan Hobie ; et al. | 2018-03-22 |
Face-to-face Multiplexer Circuit Layout
App 20180083589 - YUN; Changhan Hobie ; et al. | 2018-03-22 |
Passives In Thin Film
App 20180077803 - YUN; Changhan Hobie ; et al. | 2018-03-15 |
Single-chip Multi-frequency Film Bulk Acoustic-wave Resonators
App 20180062617 - Yun; Changhan Hobie ; et al. | 2018-03-01 |
Frequency multiplexer
Grant 9,906,318 - Zuo , et al. February 27, 2 | 2018-02-27 |
Multi-density Mim Capacitor For Improved Passive On Glass (pog) Multiplexer Performance
App 20180054177 - MUDAKATTE; Niranjan Sunil ; et al. | 2018-02-22 |
Semiconductor Assembly And Method Of Making Same
App 20180047687 - KIM; Daeik Daniel ; et al. | 2018-02-15 |
Land Grid Array (lga) Packaging Of Passive-on-glass (pog) Structure
App 20180047660 - ZUO; Chengjie ; et al. | 2018-02-15 |
Passive-on-glass (POG) device and method
Grant 9,893,048 - Lan , et al. February 13, 2 | 2018-02-13 |
Interposer Device Including At Least One Transistor And At Least One Through-substrate Via
App 20180040547 - Zuo; Chengjie ; et al. | 2018-02-08 |
LC filter layer stacking by layer transfer to make 3D multiplexer structures
Grant 9,876,513 - Yun , et al. January 23, 2 | 2018-01-23 |
MIM capacitor and method of making the same
Grant 9,875,848 - Berdy , et al. January 23, 2 | 2018-01-23 |
Stacked Substrate Inductor
App 20170373025 - KIM; Daeik Daniel ; et al. | 2017-12-28 |
Two-dimensional Structure To Form An Embedded Three-dimensional Structure
App 20170372831 - VELEZ; Mario Francisco ; et al. | 2017-12-28 |
Inline Kerf Probing Of Passive Devices
App 20170372975 - KIM; Daeik Daniel ; et al. | 2017-12-28 |
Exposed Side-wall And Lga Assembly
App 20170372989 - KIM; Daeik Daniel ; et al. | 2017-12-28 |
Double-sided Circuit
App 20170338788 - YUN; Changhan Hobie ; et al. | 2017-11-23 |
Apparatus With 3d Wirewound Inductor Integrated Within A Substrate
App 20170338034 - Yun; Changhan Hobie ; et al. | 2017-11-23 |
Passive Components Implemented On A Plurality Of Stacked Insulators
App 20170338255 - YUN; Changhan Hobie ; et al. | 2017-11-23 |
Tunable Matching Network
App 20170331445 - Ma; Yunfei ; et al. | 2017-11-16 |
Density-optimized module-level inductor ground structure
Grant 9,807,882 - Berdy , et al. October 31, 2 | 2017-10-31 |
Lc Filter Layer Stacking By Layer Transfer To Make 3d Multiplexer Structures
App 20170288707 - YUN; Changhan Hobie ; et al. | 2017-10-05 |
Side-assembled passive devices
Grant 9,780,048 - Berdy , et al. October 3, 2 | 2017-10-03 |
Passive Device Assembly For Accurate Ground Plane Control
App 20170280562 - Zuo; Chengjie ; et al. | 2017-09-28 |
High quality factor capacitors and methods for fabricating high quality factor capacitors
Grant 9,773,862 - Yun , et al. September 26, 2 | 2017-09-26 |
Integrated circuits (ICS) on a glass substrate
Grant 9,768,109 - Gu , et al. September 19, 2 | 2017-09-19 |
Open-passivation Ball Grid Array Pads
App 20170221846 - KIM; Daeik Daniel ; et al. | 2017-08-03 |
Backside coupled symmetric varactor structure
Grant 9,721,946 - Kim , et al. August 1, 2 | 2017-08-01 |
Skewed Co-spiral Inductor Structure
App 20170200550 - KIM; Daeik Daniel ; et al. | 2017-07-13 |
Multiplexer Design Using A 2d Passive On Glass Filter Integrated With A 3d Through Glass Via Filter
App 20170187345 - YUN; Changhan Hobie ; et al. | 2017-06-29 |
Three-dimensional wire bond inductor
Grant 9,692,386 - Zuo , et al. June 27, 2 | 2017-06-27 |
Mim Capacitor And Method Of Making The Same
App 20170178810 - BERDY; David Francis ; et al. | 2017-06-22 |
Isolated complementary metal-oxide semiconductor (CMOS) devices for radio-frequency (RF) circuits
Grant 9,673,275 - Kim , et al. June 6, 2 | 2017-06-06 |
Superposed structure 3D orthogonal through substrate inductor
Grant 9,666,362 - Berdy , et al. May 30, 2 | 2017-05-30 |
Thin Film Magnet Inductor Structure For High Quality (q)-factor Radio Frequency (rf) Applications
App 20170140862 - YUN; Changhan Hobie ; et al. | 2017-05-18 |
Acoustic Resonator Devices
App 20170141756 - Yun; Changhan Hobie ; et al. | 2017-05-18 |
Metal-insulator-metal (mim) Array For Integrated Radio Frequency (rf) Filter
App 20170133996 - Kim; Daeik Daniel ; et al. | 2017-05-11 |
Solenoid Inductor
App 20170133148 - VELEZ; Mario Francisco ; et al. | 2017-05-11 |
High Quality Factor Capacitors And Methods For Fabricating High Quality Factor Capacitors
App 20170125512 - YUN; Changhan Hobie ; et al. | 2017-05-04 |
Isolated Complementary Metal-oxide Semiconductor (cmos) Devices For Radio-frequency (rf) Circuits
App 20170117358 - Kim; Daeik Daniel ; et al. | 2017-04-27 |
High Performance Inductors
App 20170110237 - KIM; Daeik Daniel ; et al. | 2017-04-20 |
Radio-frequency (RF) shielding in fan-out wafer level package (FOWLP)
Grant 9,620,463 - Kim , et al. April 11, 2 | 2017-04-11 |
Integrated Circuits (ics) On A Glass Substrate
App 20170098663 - Gu; Shiqun ; et al. | 2017-04-06 |
Integrated Circuits (ics) On A Glass Substrate
App 20170084531 - Gu; Shiqun ; et al. | 2017-03-23 |
Substrate-transferred, Deep Trench Isolation Silicon-on-insulator (soi) Semiconductor Devices Formed From Bulk Semiconductor Wafers
App 20170084628 - Kim; Daeik Daniel ; et al. | 2017-03-23 |
Wafer Level Package (wlp) Ball Support Using Cavity Structure
App 20170084565 - VELEZ; Mario Francisco ; et al. | 2017-03-23 |
Backside Coupled Symmetric Varactor Structure
App 20170077093 - KIM; Daeik Daniel ; et al. | 2017-03-16 |
Augmented Capacitor Structure For High Quality (q)-factor Radio Frequency (rf) Applications
App 20170077214 - MUDAKATTE; Niranjan Sunil ; et al. | 2017-03-16 |
Passive-on-glass (pog) Device And Method
App 20170077079 - Lan; Je-Hsiung Jeffrey ; et al. | 2017-03-16 |
Substrate Comprising An Embedded Inductor And A Thin Film Magnetic Core
App 20170062120 - Yun; Changhan Hobie ; et al. | 2017-03-02 |
Tunable Cavity Resonator
App 20170033429 - Berdy; David Francis ; et al. | 2017-02-02 |
Devices and methods to reduce stress in an electronic device
Grant 9,560,745 - Kim , et al. January 31, 2 | 2017-01-31 |
High quality factor capacitors and methods for fabricating high quality factor capacitors
Grant 9,548,350 - Yun , et al. January 17, 2 | 2017-01-17 |
Face-up Substrate Integration With Solder Ball Connection In Semiconductor Package
App 20160381809 - KIM; Daeik Daniel ; et al. | 2016-12-29 |
Varying Thickness Inductor
App 20160358709 - Kim; Daeik Daniel ; et al. | 2016-12-08 |
Embedded sheet capacitor
Grant 9,502,491 - Song , et al. November 22, 2 | 2016-11-22 |
Backside coupled symmetric varactor structure
Grant 9,502,586 - Kim , et al. November 22, 2 | 2016-11-22 |
Vertical spiral inductor
Grant 9,478,348 - Kim , et al. October 25, 2 | 2016-10-25 |
Face-up substrate integration with solder ball connection in semiconductor package
Grant 9,468,098 - Kim , et al. October 11, 2 | 2016-10-11 |
Silicon-on-insulator (soi) Wafers Employing Molded Substrates To Improve Insulation And Reduce Current Leakage
App 20160293477 - Kim; Daeik Daniel ; et al. | 2016-10-06 |
Asymmetric unbalanced acoustically coupled resonators for spurious mode suppression
Grant 9,461,614 - Yun , et al. October 4, 2 | 2016-10-04 |
3d Pillar Inductor
App 20160284789 - ZUO; Chengjie ; et al. | 2016-09-29 |
Nested Through Glass Via Transformer
App 20160276101 - KIM; Daeik Daniel ; et al. | 2016-09-22 |
Varying thickness inductor
Grant 9,449,753 - Kim , et al. September 20, 2 | 2016-09-20 |
Radio-frequency (rf) Shielding In Fan-out Wafer Level Package (fowlp)
App 20160254237 - KIM; Daeik Daniel ; et al. | 2016-09-01 |
Compartment Shielding In Flip-chip (fc) Module
App 20160254236 - KIM; Daeik Daniel ; et al. | 2016-09-01 |
Three Dimensional (3d) Antenna Structure
App 20160248149 - Kim; Daeik Daniel ; et al. | 2016-08-25 |
High pass filters and low pass filters using through glass via technology
Grant 9,425,761 - Zuo , et al. August 23, 2 | 2016-08-23 |
Composite piezoelectric laterally vibrating resonator
Grant 9,406,865 - Zuo , et al. August 2, 2 | 2016-08-02 |
Nested through glass via transformer
Grant 9,384,883 - Kim , et al. July 5, 2 | 2016-07-05 |
Resonator with a staggered electrode configuration
Grant 9,379,686 - Yun , et al. June 28, 2 | 2016-06-28 |
Metal-insulator-metal (mim) Capacitors Arranged In A Pattern To Reduce Inductance, And Related Methods
App 20160181233 - Yun; Changhan Hobie ; et al. | 2016-06-23 |
3D pillar inductor
Grant 9,368,564 - Zuo , et al. June 14, 2 | 2016-06-14 |
Low package parasitic inductance using a thru-substrate interposer
Grant 9,370,103 - Yun , et al. June 14, 2 | 2016-06-14 |
Superposed Structure 3d Orthogonal Through Substrate Inductor
App 20160163450 - BERDY; David Francis ; et al. | 2016-06-09 |
Integrated passive device (IPD) on substrate
Grant 9,362,218 - Kim , et al. June 7, 2 | 2016-06-07 |
Three-dimensional multilayer solenoid transformer
Grant 9,363,902 - Lo , et al. June 7, 2 | 2016-06-07 |
Thick conductive stack plating process with fine critical dimension feature size for compact passive on glass technology
Grant 9,343,399 - Lan , et al. May 17, 2 | 2016-05-17 |
Stress mitigation structure for wafer warpage reduction
Grant 9,343,403 - Lan , et al. May 17, 2 | 2016-05-17 |
Adjustable magnetic probe for efficient near field scanning
Grant 9,335,384 - Hwang , et al. May 10, 2 | 2016-05-10 |
Selective tuning of acoustic devices
Grant 9,337,799 - Stephanou , et al. May 10, 2 | 2016-05-10 |
Composite dilation mode resonators
Grant 9,331,666 - Zuo , et al. May 3, 2 | 2016-05-03 |
Toroid inductor in an integrated device
Grant 9,324,779 - Song , et al. April 26, 2 | 2016-04-26 |
Devices And Methods To Reduce Stress In An Electronic Device
App 20160095208 - Kim; Daeik Daniel ; et al. | 2016-03-31 |
Varactor Device With Backside Contact
App 20160093750 - Kim; Daeik Daniel ; et al. | 2016-03-31 |
Bandpass filter implementation on a single layer using spiral capacitors
Grant 9,294,064 - Song , et al. March 22, 2 | 2016-03-22 |
Dynamic Random Access Memory Cell Including A Ferroelectric Capacitor
App 20160064391 - Li; Xia ; et al. | 2016-03-03 |
Stiffener with embedded passive components
Grant 9,275,876 - Kim , et al. March 1, 2 | 2016-03-01 |
Systems for reducing magnetic coupling in integrated circuits (ICS), and related components and methods
Grant 9,264,013 - Zuo , et al. February 16, 2 | 2016-02-16 |
Superposed Structure 3d Orthogonal Through Substrate Inductor
App 20160020013 - BERDY; David Francis ; et al. | 2016-01-21 |
Vertical Spiral Inductor
App 20150371751 - KIM; Daeik Daniel ; et al. | 2015-12-24 |
Die package comprising die-to-wire connector and a wire-to-die connector configured to couple to a die package
Grant 9,202,789 - Kim , et al. December 1, 2 | 2015-12-01 |
Embedded Sheet Capacitor
App 20150311275 - Song; Young Kyu ; et al. | 2015-10-29 |
Frequency Multiplexer
App 20150304059 - Zuo; Chengjie ; et al. | 2015-10-22 |
Die Package Comprising Die-to-wire Connector And A Wire-to-die Connector Configured To Couple To A Die Package
App 20150303148 - Kim; Daeik Daniel ; et al. | 2015-10-22 |
Stress Mitigation Structure For Wafer Warpage Reduction
App 20150287677 - LAN; Je-Hsiung Jeffrey ; et al. | 2015-10-08 |
Reconfigurable electric field probe
Grant 9,151,779 - Hwang , et al. October 6, 2 | 2015-10-06 |
3d Pillar Inductor
App 20150279920 - ZUO; Chengjie ; et al. | 2015-10-01 |
Face-up Substrate Integration With Solder Ball Connection In Semiconductor Package
App 20150271920 - KIM; Daeik Daniel ; et al. | 2015-09-24 |
Compact 3-D coplanar transmission lines
Grant 9,136,574 - Kim , et al. September 15, 2 | 2015-09-15 |
Resonator With A Staggered Electrode Configuration
App 20150256143 - YUN; Changhan Hobie ; et al. | 2015-09-10 |
Low-profile Package With Passive Device
App 20150237732 - Velez; Mario Francisco ; et al. | 2015-08-20 |
High Quality Factor Capacitors And Methods For Fabricating High Quality Factor Capacitors
App 20150228712 - YUN; Changhan Hobie ; et al. | 2015-08-13 |
Radio Frequency Switch For Diversity Receiver
App 20150215026 - Zuo; Chengjie ; et al. | 2015-07-30 |
Embedded sheet capacitor
Grant 9,093,295 - Song , et al. July 28, 2 | 2015-07-28 |
Nested Through Glass Via Transformer
App 20150200049 - KIM; Daeik Daniel ; et al. | 2015-07-16 |
Lateral Metal Insulator Metal (mim) Capacitor With High-q And Reduced Area
App 20150200245 - YUN; Changhan Hobie ; et al. | 2015-07-16 |
Stacked Conductive Interconnect Inductor
App 20150201495 - KIM; Daeik Daniel ; et al. | 2015-07-16 |
Three-dimensional Wire Bond Inductor
App 20150180437 - Zuo; Chengjie ; et al. | 2015-06-25 |
Multilayer Ceramic Capacitor Including At Least One Slot
App 20150146340 - Yun; Changhan Hobie ; et al. | 2015-05-28 |
Thermal design and electrical routing for multiple stacked packages using through via insert (TVI)
Grant 9,041,212 - Kim , et al. May 26, 2 | 2015-05-26 |
Multi Spiral Inductor
App 20150130579 - Kim; Daeik Daniel ; et al. | 2015-05-14 |
Embedded Sheet Capacitor
App 20150130024 - Song; Young Kyu ; et al. | 2015-05-14 |
Metal-semiconductor Wafer Bonding For High-q Devices
App 20150118819 - YUN; Changhan Hobie ; et al. | 2015-04-30 |
Toroid Inductor In An Integrated Device
App 20150115403 - Song; Young Kyu ; et al. | 2015-04-30 |
Asymmetric Unbalanced Acoustically Coupled Resonators For Spurious Mode Suppression
App 20150115777 - YUN; Changhan Hobie ; et al. | 2015-04-30 |
Complex passive design with special via implementation
Grant 9,001,031 - Lo , et al. April 7, 2 | 2015-04-07 |
Stiffener With Embedded Passive Components
App 20150091132 - KIM; Dong Wook ; et al. | 2015-04-02 |
Connector Placement For A Substrate Integrated With A Toroidal Inductor
App 20150092314 - Kim; Daeik Daniel ; et al. | 2015-04-02 |
Adjustable Magnetic Probe For Efficient Near Field Scanning
App 20150084623 - HWANG; Kyu-Pyung ; et al. | 2015-03-26 |
Current Source Driven Measurement And Modeling
App 20150084653 - Song; Young K. ; et al. | 2015-03-26 |
Electromagnetic interference enclosure for radio frequency multi-chip integrated circuit packages
Grant 8,987,872 - Hwang , et al. March 24, 2 | 2015-03-24 |
Low Package Parasitic Inductance Using A Thru-substrate Interposer
App 20150070863 - YUN; Changhan Hobie ; et al. | 2015-03-12 |
Varying Thickness Inductor
App 20150061813 - Kim; Daeik Daniel ; et al. | 2015-03-05 |
Integrated Passive Device (ipd) On Subtrate
App 20150048480 - Kim; Daeik Daniel ; et al. | 2015-02-19 |
Thick Conductive Stack Plating Process With Fine Critical Dimension Feature Size For Compact Passive On Glass Technology
App 20150014812 - LAN; Je-Hsiung ; et al. | 2015-01-15 |
Compact 3-d Coplanar Transmission Lines
App 20140361854 - Kim; Daeik Daniel ; et al. | 2014-12-11 |
Design For High Pass Filters And Low Pass Filters Using Through Glass Via Technology
App 20140354378 - ZUO; Chengjie ; et al. | 2014-12-04 |
Three-dimensional Multilayer Solenoid Transformer
App 20140322435 - Lo; Chi Shun ; et al. | 2014-10-30 |
Bandpass Filter Implementation On A Single Layer Using Spiral Capacitors
App 20140266508 - Song; Young Kyu ; et al. | 2014-09-18 |
High Density, Low Loss 3-d Through-glass Inductor With Magnetic Core
App 20140247269 - Berdy; David Francis ; et al. | 2014-09-04 |
Three-dimensional multilayer solenoid transformer
Grant 8,803,648 - Lo , et al. August 12, 2 | 2014-08-12 |
Reconfigurable Electric Field Probe
App 20140132297 - Hwang; Kyu-Pyung ; et al. | 2014-05-15 |
Selective Tuning Of Acoustic Devices
App 20140125432 - Stephanou; Philip Jason ; et al. | 2014-05-08 |
Composite Dilation Mode Resonators
App 20140111064 - Zuo; Chengjie ; et al. | 2014-04-24 |
Widening resonator bandwidth using mechanical loading
Grant 8,704,428 - Yun , et al. April 22, 2 | 2014-04-22 |
Multi-mode Bandpass Filter
App 20140055214 - Joo; Sanghoon ; et al. | 2014-02-27 |
Hybrid Filter Including Lc- And Mems-based Resonators
App 20140035702 - Black; Justin Phelps ; et al. | 2014-02-06 |
Complex Passive Design With Special Via Implementation
App 20140028543 - Lo; Chi Shun ; et al. | 2014-01-30 |
High Quality Factor Planar Inductors
App 20130293337 - Lo; Chi Shun ; et al. | 2013-11-07 |
Three-dimensional Multilayer Solenoid Transformer
App 20130293336 - Lo; Chi Shun ; et al. | 2013-11-07 |
Piezoelectric Resonator With Airgap
App 20130235001 - YUN; Changhan Hobie ; et al. | 2013-09-12 |
Composite Piezoelectric Laterally Vibrating Resonator
App 20130214643 - Zuo; Chengjie ; et al. | 2013-08-22 |
Piezoelectric Mems Transformer
App 20130134838 - Yun; Changhan Hobie ; et al. | 2013-05-30 |
Widening Resonator Bandwidth Using Mechanical Loading
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