Yukov, Nina
Patent Applications and Registrations
Patent applications and USPTO patent grants for Yukov, Nina.The latest application filed is for "copper foil with low profile bond enhancement".
- Yukov, Nina - Orange CT
| Patent | Date |
|---|---|
| Copper foil with low profile bond enhancement App 20050123782 - Chen, Szuchain F. ; et al. | 2005-06-09 |
| Copper foil with low profile bond enhancement Grant 6,893,742 - Chen , et al. May 17, 2 | 2005-05-17 |
| Copper foil composite including a release layer Grant 6,689,268 - Chen , et al. February 10, 2 | 2004-02-10 |
| Copper foil with low profile bond enhancement App 20020192486 - Chen, Szuchain F. ; et al. | 2002-12-19 |
| Copper foil composite including a release layer Grant 6,346,335 - Chen , et al. February 12, 2 | 2002-02-12 |
| Copper foil composite including a release layer App 20010027922 - Chen, Szuchain ; et al. | 2001-10-11 |
| Nodular copper/nickel alloy treatment for copper foil Grant 5,800,930 - Chen , et al. September 1, 1 | 1998-09-01 |
| Chromium-zinc anti-tarnish coating for copper foil Grant 5,230,932 - Chen , et al. * July 27, 1 | 1993-07-27 |
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