Patent | Date |
---|
Laminated mounting structure and memory card Grant 7,875,974 - Gokan , et al. January 25, 2 | 2011-01-25 |
Semiconductor Stack Device And Mounting Method App 20090166839 - Suzuki; Naoki ;   et al. | 2009-07-02 |
Laminated Mounting Structure And Memory Card App 20090166838 - Gokan; Manabu ;   et al. | 2009-07-02 |
Method for manufacturing component built-in module, and component built-in module Grant 7,488,895 - Hayashi , et al. February 10, 2 | 2009-02-10 |
Method for manufacturing component built-in module, and component built-in module App 20070119617 - Hayashi; Yoshitake ;   et al. | 2007-05-31 |
Circuit component built-in module with embedded semiconductor chip and method of manufacturing Grant 7,018,866 - Sugaya , et al. March 28, 2 | 2006-03-28 |
Circuit component built-in module with embedded semiconductor chip and method of manufacturing Grant 6,784,530 - Sugaya , et al. August 31, 2 | 2004-08-31 |
Circuit component built-in module with embedded semiconductor chip and method of manufacturing App 20040145044 - Sugaya, Yasuhiro ;   et al. | 2004-07-29 |
Method for planarizing circuit board and method for manufacturing semiconductor device Grant 6,723,251 - Itagaki , et al. April 20, 2 | 2004-04-20 |
Method for planarizing circuit board and method for manufacturing semiconductor device Grant 6,703,262 - Itagaki , et al. March 9, 2 | 2004-03-09 |
Circuit component built-in module and method of manufacturing the same App 20030137045 - Sugaya, Yasuhiro ;   et al. | 2003-07-24 |
Metal wiring board, semiconductor device, and method for manufacturing the same App 20030127725 - Sugaya, Yasuhiro ;   et al. | 2003-07-10 |
Method for planarizing circuit board and method for manufacturing semiconductor device App 20030092327 - Itagaki, Minehiro ;   et al. | 2003-05-15 |
Method For Planarizing Circuit Board And Method For Manufacturing Semiconductor Device App 20010029066 - ITAGAKI, MINEHIRO ;   et al. | 2001-10-11 |
Method for fabricating bump electrodes with a leveling step for uniform heights Grant 6,207,550 - Hase , et al. March 27, 2 | 2001-03-27 |
Method of making multi-layered ceramic substrates Grant 5,662,755 - Miura , et al. September 2, 1 | 1997-09-02 |
Method of manufacturing a ceramic substrate Grant 5,547,530 - Nakamura , et al. August 20, 1 | 1996-08-20 |
Ceramic substrate and manufacturing method thereof Grant 5,525,402 - Nakamura , et al. June 11, 1 | 1996-06-11 |
Assembly formed from conductive paste and insulating paste Grant 5,496,619 - Itagaki , et al. March 5, 1 | 1996-03-05 |
Laminated ceramic capacitor Grant 5,014,158 - Nishimura , et al. May 7, 1 | 1991-05-07 |
Multilayered ceramic substrates and method for manufacturing the same Grant 5,004,640 - Nakatani , et al. April 2, 1 | 1991-04-02 |
Conductor paste and method of manufacturing a multilayered ceramic body using the paste Grant 4,863,683 - Nakatani , et al. September 5, 1 | 1989-09-05 |
Method of manufacturing a multilayer ceramic body Grant 4,795,512 - Nakatani , et al. January 3, 1 | 1989-01-03 |
Conductor paste and method of manufacturing a multilayered ceramic body using the paste Grant 4,714,570 - Nakatani , et al. December 22, 1 | 1987-12-22 |
Thick film conductor composition Grant 4,695,403 - Nishimura , et al. September 22, 1 | 1987-09-22 |
Mold for direct press molding of optical glass element Grant 4,606,750 - Torii , et al. August 19, 1 | 1986-08-19 |