Yuhaku; Satoru

Patent Applications and Registrations

Patent applications and USPTO patent grants for Yuhaku; Satoru.The latest application filed is for "laminated mounting structure and memory card".

Company Profile

0.18.8

Yuhaku; Satoru - Osaka JP
Yuhaku; Satoru - Kadoma JP
Yuhaku, Satoru - Osaka-shi JP
Yuhaku; Satoru - Ikuno JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Laminated mounting structure and memory card Grant 7,875,974 - Gokan , et al. January 25, 2	2011-01-25
Semiconductor Stack Device And Mounting Method App 20090166839 - Suzuki; Naoki ; et al.	2009-07-02
Laminated Mounting Structure And Memory Card App 20090166838 - Gokan; Manabu ; et al.	2009-07-02
Method for manufacturing component built-in module, and component built-in module Grant 7,488,895 - Hayashi , et al. February 10, 2	2009-02-10
Method for manufacturing component built-in module, and component built-in module App 20070119617 - Hayashi; Yoshitake ; et al.	2007-05-31
Circuit component built-in module with embedded semiconductor chip and method of manufacturing Grant 7,018,866 - Sugaya , et al. March 28, 2	2006-03-28
Circuit component built-in module with embedded semiconductor chip and method of manufacturing Grant 6,784,530 - Sugaya , et al. August 31, 2	2004-08-31
Circuit component built-in module with embedded semiconductor chip and method of manufacturing App 20040145044 - Sugaya, Yasuhiro ; et al.	2004-07-29
Method for planarizing circuit board and method for manufacturing semiconductor device Grant 6,723,251 - Itagaki , et al. April 20, 2	2004-04-20
Method for planarizing circuit board and method for manufacturing semiconductor device Grant 6,703,262 - Itagaki , et al. March 9, 2	2004-03-09
Circuit component built-in module and method of manufacturing the same App 20030137045 - Sugaya, Yasuhiro ; et al.	2003-07-24
Metal wiring board, semiconductor device, and method for manufacturing the same App 20030127725 - Sugaya, Yasuhiro ; et al.	2003-07-10
Method for planarizing circuit board and method for manufacturing semiconductor device App 20030092327 - Itagaki, Minehiro ; et al.	2003-05-15
Method For Planarizing Circuit Board And Method For Manufacturing Semiconductor Device App 20010029066 - ITAGAKI, MINEHIRO ; et al.	2001-10-11
Method for fabricating bump electrodes with a leveling step for uniform heights Grant 6,207,550 - Hase , et al. March 27, 2	2001-03-27
Method of making multi-layered ceramic substrates Grant 5,662,755 - Miura , et al. September 2, 1	1997-09-02
Method of manufacturing a ceramic substrate Grant 5,547,530 - Nakamura , et al. August 20, 1	1996-08-20
Ceramic substrate and manufacturing method thereof Grant 5,525,402 - Nakamura , et al. June 11, 1	1996-06-11
Assembly formed from conductive paste and insulating paste Grant 5,496,619 - Itagaki , et al. March 5, 1	1996-03-05
Laminated ceramic capacitor Grant 5,014,158 - Nishimura , et al. May 7, 1	1991-05-07
Multilayered ceramic substrates and method for manufacturing the same Grant 5,004,640 - Nakatani , et al. April 2, 1	1991-04-02
Conductor paste and method of manufacturing a multilayered ceramic body using the paste Grant 4,863,683 - Nakatani , et al. September 5, 1	1989-09-05
Method of manufacturing a multilayer ceramic body Grant 4,795,512 - Nakatani , et al. January 3, 1	1989-01-03
Conductor paste and method of manufacturing a multilayered ceramic body using the paste Grant 4,714,570 - Nakatani , et al. December 22, 1	1987-12-22
Thick film conductor composition Grant 4,695,403 - Nishimura , et al. September 22, 1	1987-09-22
Mold for direct press molding of optical glass element Grant 4,606,750 - Torii , et al. August 19, 1	1986-08-19

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