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name:-0.0098750591278076
name:-0.0076360702514648
name:-0.0024139881134033
Yue; Tai Man Patent Filings

Yue; Tai Man

Patent Applications and Registrations

Patent applications and USPTO patent grants for Yue; Tai Man.The latest application filed is for "method of laser joining of dissimilar materials with ultrasonic aid".

Company Profile
2.7.8
  • Yue; Tai Man - Hong Kong HK
  • Yue; Tai Man - Kowloon HK
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Method of laser joining of dissimilar materials with ultrasonic aid
Grant 10,639,744 - Chen , et al.
2020-05-05
Magnetic-aided electrospark deposition
Grant 10,610,950 - Liu , et al.
2020-04-07
Method Of Laser Joining Of Dissimilar Materials With Ultrasonic Aid
App 20170320167 - CHEN; Yujiao ;   et al.
2017-11-09
Magnetic-Aided Electrospark Deposition
App 20170304924 - LIU; Jiang Wen ;   et al.
2017-10-26
Rapid fabrication of porous metal-based biomaterial by microwave sintering
Grant 9,074,267 - Tang , et al. July 7, 2
2015-07-07
Method For Fabrication Of Silicone Composite With Antimicrobial Coating
App 20120135250 - TANG; Chak Yin ;   et al.
2012-05-31
Method for fabrication of silicone composite with antimicrobial coating
Grant 8,133,423 - Tang , et al. March 13, 2
2012-03-13
Method For Fabrication Of Silicone Composite With Antimicrobial Coating
App 20110091669 - Tang; Chak Yin ;   et al.
2011-04-21
Rapid fabrication of porous metal-based biomaterial by microwave sintering
App 20110020168 - Tang; Chak Yin ;   et al.
2011-01-27
B-stage Thermal Conductive Dielectric Coated Metal-plate And Method Of Making Same
App 20100028689 - Yung; Kam-Chuen ;   et al.
2010-02-04
Method of drilling a circuit board
Grant 6,809,289 - Yung , et al. October 26, 2
2004-10-26
Method of drilling a circuit board
App 20040173589 - Yung, Kam-Chuen ;   et al.
2004-09-09
Process for making nickel electroforms
Grant 6,620,303 - Wong , et al. September 16, 2
2003-09-16
Nickel electroforms
App 20020170826 - Wong, Kam Po ;   et al.
2002-11-21

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