loadpatents
Patent applications and USPTO patent grants for Yudate; Takahiro.The latest application filed is for "press-fit terminal and substrate assembly".
Patent | Date |
---|---|
Contact connection structure with an indent portion Grant 10,819,058 - Yudate October 27, 2 | 2020-10-27 |
Press-fit terminal and press-fit terminal connection structure of circuit board Grant 10,630,007 - Kishibata , et al. | 2020-04-21 |
Press-fit Terminal And Substrate Assembly App 20200021047 - Kishibata; Yuya ;   et al. | 2020-01-16 |
Contact Connection Structure App 20190348789 - YUDATE; Takahiro | 2019-11-14 |
Press-fit Terminal And Press-fit Terminal Connection Structure Of Circuit Board App 20190131727 - KISHIBATA; Yuya ;   et al. | 2019-05-02 |
Contact-connection structure Grant 10,056,708 - Onuma , et al. August 21, 2 | 2018-08-21 |
Contact connection structure for removing oxide buildup Grant 9,871,311 - Fukui , et al. January 16, 2 | 2018-01-16 |
Seal member and connector Grant 9,793,645 - Yudate October 17, 2 | 2017-10-17 |
Crimp terminal Grant 9,698,496 - Yudate July 4, 2 | 2017-07-04 |
Seal Member And Connector App 20170179636 - YUDATE; Takahiro | 2017-06-22 |
Contact connection structure Grant 9,673,548 - Yudate June 6, 2 | 2017-06-06 |
Contact-connection Structure App 20170033487 - ONUMA; Masanori ;   et al. | 2017-02-02 |
Contact Connection Structure App 20170033485 - FUKUI; Masayuki ;   et al. | 2017-02-02 |
Contact Connection Structure App 20160336672 - YUDATE; Takahiro | 2016-11-17 |
Crimp Terminal App 20160240936 - YUDATE; Takahiro | 2016-08-18 |
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