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Patent applications and USPTO patent grants for Yubo; Miao.The latest application filed is for "backplateless silicon microphone".
Patent | Date |
---|---|
Backplateless silicon microphone Grant 8,045,734 - Zhe , et al. October 25, 2 | 2011-10-25 |
MEMS packaging method for enhanced EMI immunity using flexible substrates Grant 7,692,288 - Zhe , et al. April 6, 2 | 2010-04-06 |
Backplateless silicon microphone App 20080123878 - Zhe; Wang ;   et al. | 2008-05-29 |
Backplateless silicon microphone Grant 7,346,178 - Zhe , et al. March 18, 2 | 2008-03-18 |
Silicon microphone with softly constrained diaphragm Grant 7,329,933 - Zhe , et al. February 12, 2 | 2008-02-12 |
MEMS package using flexible substrates, and method thereof Grant 7,202,552 - Zhe , et al. April 10, 2 | 2007-04-10 |
MEMS package using flexible substrates, and method thereof App 20070013036 - Zhe; Wang ;   et al. | 2007-01-18 |
MEMS packaging method for enhanced EMI immunity using flexible substrates App 20070013052 - Zhe; Wang ;   et al. | 2007-01-18 |
Silicon microphone with softly constrained diaphragm App 20060093171 - Zhe; Wang ;   et al. | 2006-05-04 |
Backplateless silicon microphone App 20060093170 - Zhe; Wang ;   et al. | 2006-05-04 |
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