Yube; Kunio

Patent Applications and Registrations

Patent applications and USPTO patent grants for Yube; Kunio.The latest application filed is for "liquid composition for etching oxides comprising indium, zinc, tin, and oxygen and etching method".

Company Profile

0.8.12

Yube; Kunio - Tokyo JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Liquid composition for etching oxides comprising indium, zinc, tin, and oxygen and etching method Grant 10,023,797 - Shigeta , et al. July 17, 2	2018-07-17
Etching liquid for oxide containing zinc and tin, and etching method Grant 9,824,899 - Shigeta , et al. November 21, 2	2017-11-21
Etching solution for copper or a compound comprised mainly of copper Grant 9,644,274 - Tamai , et al. May 9, 2	2017-05-09
Etching liquid for film of multilayer structure containing copper layer and molybdenum layer Grant 9,580,818 - Tamai , et al. February 28, 2	2017-02-28
Liquid Composition For Etching Oxides Comprising Indium, Zinc, Tin, And Oxygen And Etching Method App 20160348001 - SHIGETA; Mari ; et al.	2016-12-01
Etching Liquid For Oxide Containing Zinc And Tin, And Etching Method App 20160329217 - SHIGETA; Mari ; et al.	2016-11-10
Etching Liquid Composition For Multilayer Containing Copper And Molybdenum And Process For Etching Thereof App 20160186057 - YUBE; Kunio ; et al.	2016-06-30
Liquid composition used in etching copper- and titanium-containing multilayer film, etching method in which said composition is used, method for manufacturing multilayer-film wiring, and substrate Grant 9,365,934 - Adaniya , et al. June 14, 2	2016-06-14
Liquid Composition Used In Etching Copper - And Titanium - Containing Multilayer Film, Etching Method In Which Said Composition Is Used, Method For Manufacturing Multilayer-film Wiring, And Substrate App 20160053384 - ADANIYA; Tomoyuki ; et al.	2016-02-25
Liquid Composition Used In Etching Multilayer Film Containing Copper And Molybdenum, Manufacturing Method Of Substrate Using Said Liquid Composition, And Substrate Manufactured By Said Manufacturing Method App 20150380273 - TAMAI; Satoshi ; et al.	2015-12-31
Etchant and etching process for oxides containing at least indium and gallium Grant 9,217,106 - Takeuchi , et al. December 22, 2	2015-12-22
Etchant And Etching Process For Oxides Containing At Least Indium And Gallium App 20140186996 - TAKEUCHI; Hidenori ; et al.	2014-07-03
Etching Solution For Copper Or A Compound Comprised Mainly Of Copper App 20140131615 - Tamai; Satoshi ; et al.	2014-05-15
Etching Liquid Composition For Multilayer Containing Copper And Molybdenum And Process For Etching Thereof App 20140014615 - YUBE; Kunio ; et al.	2014-01-16
Etching Liquid For Film Of Multilayer Structure Containing Copper Layer And Molybdenum Layer App 20130105729 - Tamai; Satoshi ; et al.	2013-05-02
Microdevice And Method For Joining Fluids App 20090034362 - Mae; Kazuhiro ; et al.	2009-02-05

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