Yuan; Zhongfa

Patent Applications and Registrations

Patent applications and USPTO patent grants for Yuan; Zhongfa.The latest application filed is for "die package including substrate with molded device".

Company Profile

0.7.9

Yuan; Zhongfa - Jiangsu N/A CN
Yuan; Zhongfa - Suzhou CN

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Die package including substrate with molded device Grant 8,525,192 - Liu , et al. September 3, 2	2013-09-03
Thermally enhanced molded leadless package Grant 8,120,169 - Liu , et al. February 21, 2	2012-02-21
Die package including substrate with molded device Grant 8,106,406 - Liu , et al. January 31, 2	2012-01-31
Die Package Including Substrate With Molded Device App 20120012993 - Liu; Yong ; et al.	2012-01-19
Semiconductor die package including embedded flip chip Grant 7,768,108 - Liu , et al. August 3, 2	2010-08-03
Pin substrate and package Grant 7,745,244 - Yuan , et al. June 29, 2	2010-06-29
Pin Substrate And Package App 20090315171 - Yuan; Zhongfa ; et al.	2009-12-24
Stacked Micro-Module Packages, Systems Using the Same, and Methods of Making the Same App 20090256245 - Liu; Yong ; et al.	2009-10-15
Semiconductor Die Package Including Embedded Flip Chip App 20090230537 - Liu; Yong ; et al.	2009-09-17
Semiconductor die packages suitable for optoelectronic applications having clip attach structures for angled mounting of dice Grant 7,589,338 - Liu , et al. September 15, 2	2009-09-15
Stacked Die Molded Leadless Package App 20090212405 - Liu; Yong ; et al.	2009-08-27
Thermally Enhanced Molded Leadless Package App 20090212403 - Liu; Yong ; et al.	2009-08-27
Die Package Including Substrate With Molded Device App 20090174048 - Liu; Yong ; et al.	2009-07-09
Semiconductor Die Packages Suitable For Optoelectronic Applications Having Clip Attach Structures For Angled Mounting Of Dice App 20090140179 - Liu; Yong ; et al.	2009-06-04
Package Including Oriented Devices App 20090140266 - Liu; Yong ; et al.	2009-06-04

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