| Patent | Date |
|---|
Technique for determining performance characteristics of electronic devices and systems
Grant 10,782,344 - Liaw , et al. Sept | 2020-09-22 |
Technique for Determining Performance Characteristics Of Electronic Devices And Systems
App 20180335477 - Liaw; Haw-Jyh ; et al. | 2018-11-22 |
Technique for determining performance characteristics of electronic devices and systems
Grant 9,977,076 - Liaw , et al. May 22, 2 | 2018-05-22 |
Technique for Determining Performance Characteristics Of Electronic Devices And Systems
App 20170199242 - Liaw; Haw-Jyh ; et al. | 2017-07-13 |
Technique for determining performance characteristics of electronic devices and systems
Grant 9,562,934 - Liaw , et al. February 7, 2 | 2017-02-07 |
Semiconductor package with embedded spiral inductor
Grant 8,674,477 - Shi , et al. March 18, 2 | 2014-03-18 |
Technique for Determining Performance Characteristics Of Electronic Devices And Systems
App 20140070819 - Liaw; Haw-Jyh ; et al. | 2014-03-13 |
Stacked semiconductor module
Grant RE44,019 - Fox , et al. February 19, 2 | 2013-02-19 |
Semiconductor Package with Embedded Spiral Inductor
App 20120267756 - Shi; Hao ; et al. | 2012-10-25 |
Semiconductor package with embedded spiral inductor
Grant 8,222,714 - Shi , et al. July 17, 2 | 2012-07-17 |
Technique For Determining Performance Characteristics Of Electronic Devices And Systems
App 20120072153 - LIAW; Haw-Jyh ; et al. | 2012-03-22 |
Detachable Interconnect For Configurable Width Memory System
App 20110119425 - Kollipara; Ravindranath ; et al. | 2011-05-19 |
Semiconductor Package with Embedded Spiral Inductor
App 20100096725 - Shi; Hao ; et al. | 2010-04-22 |
Technique For Determining Performance Characteristics Of Electronic Devices And Systems
App 20090240448 - Liaw; Haw-Jyh ; et al. | 2009-09-24 |
Multilayer flip-chip substrate interconnect layout
Grant 7,476,813 - Shi , et al. January 13, 2 | 2009-01-13 |
Stacked semiconductor module
Grant 7,285,443 - Fox , et al. October 23, 2 | 2007-10-23 |
Reducing electrical noise during bus turnaround in signal transfer systems
Grant 7,164,292 - Schmitt , et al. January 16, 2 | 2007-01-16 |
Stacked semiconductor module
App 20060160271 - Fox; Thomas F. ; et al. | 2006-07-20 |
Stacked semiconductor module
Grant 7,037,757 - Fox , et al. May 2, 2 | 2006-05-02 |
Technique for determining performance characteristics of electronic devices and systems
Grant 7,006,932 - Liaw , et al. February 28, 2 | 2006-02-28 |
Reducing electrical noise during bus turnaround in signal transfer systems
App 20050275424 - Schmitt, Ralf ; et al. | 2005-12-15 |
Technique for determining performance characteristics of electronic devices and systems
Grant 6,920,402 - Liaw , et al. July 19, 2 | 2005-07-19 |
Multilayer flip-chip substrate interconnect layout
App 20040229396 - Shi, Hao ; et al. | 2004-11-18 |
Stacked semiconductor module
App 20040164393 - Fox, Thomas F. ; et al. | 2004-08-26 |
Stacked semiconductor module
Grant 6,720,643 - Fox , et al. April 13, 2 | 2004-04-13 |
| 