Yuan; Rui

Patent Applications and Registrations

Patent applications and USPTO patent grants for Yuan; Rui.The latest application filed is for "packaged memory device with flip chip and wire bond dies".

Company Profile

4.3.7

Yuan; Rui - Shanghai CN
Yuan; Rui - Mianyang CN
Yuan; Rui - Wuhan CN
Yuan; Rui - Champaign IL

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Trademarks

Patent Activity

Patent	Date
Packaged Memory Device With Flip Chip And Wire Bond Dies App 20220285316 - Yuan; Rui ; et al.	2022-09-08
Reducing Keep-out-zone Area For A Semiconductor Device App 20220093559 - Du; Kevin ; et al.	2022-03-24
High-performance Triple-crosslinked Polymer And Preparation Method Thereof App 20210253805 - Chang; Guanjun ; et al.	2021-08-19
Methods for adjusting height of a 3D printer nozzle Grant 11,059,218 - Cao , et al. July 13, 2	2021-07-13
Flatness Detection Device App 20210172734 - CAO; Xi ; et al.	2021-06-10
Method and apparatus for updating network RTK reference station network Grant 10,834,660 - Huang , et al. November 10, 2	2020-11-10
Poppet valve for an internal combustion engine Grant 10,760,455 - Veliz , et al. Sep	2020-09-01
Positioning Method And Apparatus App 20190324155 - HUANG; Jingsong ; et al.	2019-10-24
Method And Apparatus For Updating Network Rtk Reference Station Network App 20190166542 - HUANG; Jinsong ; et al.	2019-05-30
Poppet Valve For An Internal Combustion Engine App 20180171837 - Veliz; Mark D. ; et al.	2018-06-21

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