loadpatents
Patent applications and USPTO patent grants for YUAN; Jingli.The latest application filed is for "die package including encapsulated die and method of manufacturing the same".
Patent | Date |
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Die Package Including Encapsulated Die And Method Of Manufacturing The Same App 20130056141 - KANG; Joon Seok ;   et al. | 2013-03-07 |
Die package including encapsulated die and method of manufacturing the same Grant 8,334,602 - Kang , et al. December 18, 2 | 2012-12-18 |
Method of manufacturing a dual face package Grant 8,273,660 - Park , et al. September 25, 2 | 2012-09-25 |
Dual face package having resin insulating layer Grant 8,093,705 - Park , et al. January 10, 2 | 2012-01-10 |
Method of manufacturing a dual face package App 20110129994 - Park; Seung Wook ;   et al. | 2011-06-02 |
Die Package Including Encapsulated Die And Method Of Manufacturing The Same App 20100320624 - KANG; Joon Seok ;   et al. | 2010-12-23 |
Fluxgate sensor having conbzr magnetic core and fabrication method thereof Grant 7,737,687 - Na , et al. June 15, 2 | 2010-06-15 |
Dual face package and method of manufacturing the same App 20100102426 - Park; Seung Wook ;   et al. | 2010-04-29 |
Wafer level package fabrication method Grant 7,696,004 - Yuan , et al. April 13, 2 | 2010-04-13 |
Solder ball attachment jig and method for manufacturing semiconductor device using the same App 20090253259 - Yuan; Jingli ;   et al. | 2009-10-08 |
Method of manufacturing a micro flux gate sensor Grant 7,571,533 - Na , et al. August 11, 2 | 2009-08-11 |
Semiconductor device and method of manufacturing the same App 20090166862 - Kweon; Young Do ;   et al. | 2009-07-02 |
Semiconductor device and method of manufacturing the same App 20090166859 - Yuan; Jingli ;   et al. | 2009-07-02 |
Image sensor module at wafer level, method of manufacturing the same, and camera module App 20090014827 - Lim; Chang Hyun ;   et al. | 2009-01-15 |
Fluorescent label compounds Grant 7,465,747 - Matsumoto , et al. December 16, 2 | 2008-12-16 |
Camera module package and method of manufacturing the same App 20080304821 - Jeung; Won Kyu ;   et al. | 2008-12-11 |
Camera module package App 20080296577 - Yuan; Jingli ;   et al. | 2008-12-04 |
Wafer level package fabrication method App 20080299706 - Yuan; Jingli ;   et al. | 2008-12-04 |
Wafer level package of image sensor and method for manufacturing the same App 20080296714 - Yuan; Jingli ;   et al. | 2008-12-04 |
Method of manufacturing micro flux gate sensor Grant 7,389,576 - Na , et al. June 24, 2 | 2008-06-24 |
Micro flux gate sensor and method of manufacturing the same App 20070115585 - Na; Kyoung-won ;   et al. | 2007-05-24 |
Method of manufacturing micro flux gate sensor App 20070094861 - Na; Kyoung-won ;   et al. | 2007-05-03 |
Fluxgate sensor having conbzr magnetic core and fabrication method thereof App 20070085535 - Na; Kyung-won ;   et al. | 2007-04-19 |
Novel method of highly sensitive nucleic acid analysis App 20060029938 - Matsumoto; Kazuko ;   et al. | 2006-02-09 |
Novel fluorescent label compounds App 20050255465 - Matsumoto, Kazuko ;   et al. | 2005-11-17 |
Labeled reagents for use in immunoassays and fluorescent compounds and complexes used therein Grant 5,859,297 - Matsumoto , et al. January 12, 1 | 1999-01-12 |
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