YU; Yongsik
Patent Applications and Registrations
Patent applications and USPTO patent grants for YU; Yongsik.The latest application filed is for "metal-containing passivation for high aspect ratio etch".
- YU; Yongsik - Milpitas CA
- Yu; Yongsik - Lake Oswego OR US
| Patent | Date |
|---|---|
| Metal-containing Passivation For High Aspect Ratio Etch App 20210242032 - COLINJIVADI; Karthik S. ; et al. | 2021-08-05 |
| Metal doped carbon based hard mask removal in semiconductor fabrication Grant 11,062,897 - Yu , et al. July 13, 2 | 2021-07-13 |
| Staircase encapsulation in 3D NAND fabrication Grant 10,580,690 - Yu , et al. | 2020-03-03 |
| Metal Doped Carbon Based Hard Mask Removal In Semiconductor Fabrication App 20180358220 - Yu; Yongsik ; et al. | 2018-12-13 |
| Staircase Encapsulation In 3d Nand Fabrication App 20180330985 - Yu; Yongsik ; et al. | 2018-11-15 |
| Staircase encapsulation in 3D NAND fabrication Grant 10,002,787 - Yu , et al. June 19, 2 | 2018-06-19 |
| Staircase Encapsulation In 3d Nand Fabrication App 20180144977 - Yu; Yongsik ; et al. | 2018-05-24 |
| Diffusion barrier and etch stop films Grant 8,669,181 - Yu , et al. March 11, 2 | 2014-03-11 |
| Protective self-aligned buffer layers for damascene interconnects Grant 8,317,923 - Chattopadhyay , et al. November 27, 2 | 2012-11-27 |
| Protective self-aligned buffer layers for damascene interconnects Grant 8,021,486 - Yu , et al. September 20, 2 | 2011-09-20 |
| Methods of depositing stable and hermetic ashable hardmask films Grant 7,981,777 - Subramonium , et al. July 19, 2 | 2011-07-19 |
| Low-K SiC copper diffusion barrier films Grant 7,968,436 - Yu , et al. June 28, 2 | 2011-06-28 |
| Diffusion barrier and etch stop films Grant 7,915,166 - Yu , et al. March 29, 2 | 2011-03-29 |
| Low-k b-doped SiC copper diffusion barrier films Grant 7,842,604 - Yu , et al. November 30, 2 | 2010-11-30 |
| Protective self-aligned buffer layers for damascene interconnects Grant 7,727,880 - Chattopadhyay , et al. June 1, 2 | 2010-06-01 |
| Protective self-aligned buffer layers for damascene interconnects Grant 7,704,873 - Yu , et al. April 27, 2 | 2010-04-27 |
| Protective self-aligned buffer layers for damascene interconnects Grant 7,576,006 - Yu , et al. August 18, 2 | 2009-08-18 |
| Low-k SiC copper diffusion barrier films Grant 7,573,061 - Yu , et al. August 11, 2 | 2009-08-11 |
| Boron-doped SIC copper diffusion barrier films Grant 7,420,275 - Yu , et al. September 2, 2 | 2008-09-02 |
| Low-k SiC copper diffusion barrier films Grant 7,282,438 - Yu , et al. October 16, 2 | 2007-10-16 |
| Low-k B-doped SiC copper diffusion barrier films Grant 7,239,017 - Yu , et al. July 3, 2 | 2007-07-03 |
| Film for copper diffusion barrier Grant 7,163,889 - Yu , et al. January 16, 2 | 2007-01-16 |
| Novel film for copper diffusion barrier App 20060019486 - Yu; Yongsik ; et al. | 2006-01-26 |
| Film for copper diffusion barrier Grant 6,967,405 - Yu , et al. November 22, 2 | 2005-11-22 |
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