Yu; Xuequan

Patent Applications and Registrations

Patent applications and USPTO patent grants for Yu; Xuequan.The latest application filed is for "electronic component package structure and electronic device".

Company Profile

0.8.8

Yu; Xuequan - Shanghai CN
Yu; Xuequan - Beijing CN

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Electronic component package structure and electronic device Grant 10,091,915 - Yu , et al. October 2, 2	2018-10-02
Mask plate, method for manufacturing color film substrate and color film substrate Grant 9,989,682 - Cheng , et al. June 5, 2	2018-06-05
Method for exposure and development, system for controlling exposure and system for exposure and development Grant 9,946,170 - Yu , et al. April 17, 2	2018-04-17
Electronic Component Package Structure and Electronic Device App 20180049351 - Yu; Xuequan ; et al.	2018-02-15
Electronic component package structure and electronic device Grant 9,839,167 - Yu , et al. December 5, 2	2017-12-05
Clearance adjusting apparatus, clearance adjusting method and conveyance device Grant 9,751,709 - Li , et al. September 5, 2	2017-09-05
Alignment exposure method and method of fabricating display substrate Grant 9,715,173 - Yu , et al. July 25, 2	2017-07-25
Substrate damage inspection apparatus, production system and inspection method Grant 9,709,506 - Wang , et al. July 18, 2	2017-07-18
Method For Exposure And Development, System For Controlling Exposure And System For Exposure And Development App 20170176873 - Yu; Xuequan ; et al.	2017-06-22
Substrate Damage Inspection Apparatus, Production System And Inspection Method App 20170038306 - Wang; Zhiqiang ; et al.	2017-02-09
Clearance Adjusting Apparatus, Clearance Adjusting Method And Conveyance Device App 20160340136 - LI; Kun ; et al.	2016-11-24
Alignment Exposure Method and Method of Fabricating Display Substrate App 20160334674 - Yu; Xuequan ; et al.	2016-11-17
Chip package and packaging method Grant 9,484,311 - Yu , et al. November 1, 2	2016-11-01
Mask Plate, Method For Manufacturing Color Film Substrate And Color Film Substrate App 20160266287 - Cheng; Xuepei ; et al.	2016-09-15
Electronic Component Package Structure and Electronic Device App 20150305210 - Yu; Xuequan ; et al.	2015-10-22
Chip Package And Packaging Method App 20150102473 - Yu; Xuequan ; et al.	2015-04-16

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