Yu; Xiaoju
Patent Applications and Registrations
Patent applications and USPTO patent grants for Yu; Xiaoju.The latest application filed is for "thermal paths for glass substrates".
- Yu; Xiaoju - San Diego CA
- Yu; Xiaoju - Zhangzhou CN
| Patent | Date |
|---|---|
| Thermal paths for glass substrates Grant 11,177,065 - Liu , et al. November 16, 2 | 2021-11-16 |
| Thermal Paths For Glass Substrates App 20210304944 - LIU; Kai ; et al. | 2021-09-30 |
| Package Comprising A Solder Resist Layer Configured As A Seating Plane For A Device App 20210098320 - GARCIA; Daniel ; et al. | 2021-04-01 |
| On-die Electrostatic Discharge Protection App 20210057404 - LIU; Kai ; et al. | 2021-02-25 |
| Solenoid structure with conductive pillar technology Grant 10,693,432 - Park , et al. | 2020-06-23 |
| Inductors formed with through glass vias Grant 10,614,942 - Yun , et al. | 2020-04-07 |
| Integrated Filter Technology With Embedded Devices App 20200091094 - YUN; Changhan Hobie ; et al. | 2020-03-19 |
| Integration of through glass via (TGV) filter and acoustic filter Grant 10,582,609 - Yun , et al. | 2020-03-03 |
| Inductors Formed With Through Glass Vias App 20200020473 - YUN; Changhan Hobie ; et al. | 2020-01-16 |
| Close proximity tunable inductive elements Grant 10,490,621 - Thadesar , et al. Nov | 2019-11-26 |
| Solenoid Structure With Conductive Pillar Technology App 20190356294 - PARK; Nosun ; et al. | 2019-11-21 |
| Inductor with metal-insulator-metal (MIM) capacitor Grant 10,292,269 - Mudakatte , et al. | 2019-05-14 |
| Integration Of Through Glass Via (tgv) Filter And Acoustic Filter App 20190132942 - YUN; Changhan Hobie ; et al. | 2019-05-02 |
| Shaped Circuit Wafers App 20190035621 - YUN; Changhan Hobie ; et al. | 2019-01-31 |
| Bread maker Grant 9,339,040 - Yu , et al. May 17, 2 | 2016-05-17 |
| Bread Maker App 20130319254 - Yu; Xiaoju ; et al. | 2013-12-05 |
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