Yu; Shan-Pu

Patent Applications and Registrations

Patent applications and USPTO patent grants for Yu; Shan-Pu.The latest application filed is for "wafer leveled chip packaging structure and method thereof".

Company Profile

0.14.17

Yu; Shan-Pu - Chiayi TW
Yu; Shan-Pu - Chiayi City TW
Yu; Shan-Pu - Hsinchu TW
Yu; Shan-Pu - Taoyeng TW
Yu; Shan-Pu - Taoyuan County TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Electrically stackable semiconductor wafer and chip packages Grant 9,601,474 - Chen , et al. March 21, 2	2017-03-21
Wafer Leveled Chip Packaging Structure and Method Thereof App 20150364457 - Chen; Shou-Lung ; et al.	2015-12-17
Wafer leveled chip packaging structure and method thereof Grant 9,059,181 - Chen , et al. June 16, 2	2015-06-16
Wafer Leveled Chip Packaging Structure and Method Thereof App 20140217587 - Chen; Shou-Lung ; et al.	2014-08-07
Wafer-leveled chip packaging structure and method thereof Grant 8,587,091 - Chen , et al. November 19, 2	2013-11-19
Semiconductor package device Grant 8,314,482 - Chen , et al. November 20, 2	2012-11-20
Wafer-leveled Chip Packaging Structure And Method Thereof App 20120267765 - CHEN; Shou-Lung ; et al.	2012-10-25
Structure for reducing stress for vias and fabricating method thereof Grant 7,754,599 - Hsu , et al. July 13, 2	2010-07-13
Packaging structure and method of an image sensor module Grant 7,572,676 - Leu , et al. August 11, 2	2009-08-11
Structure for reducing stress for vias and fabricating method thereof App 20090156001 - Hsu; Yung-Yu ; et al.	2009-06-18
Image sensor packaging structure and method of manufacturing the same Grant 7,544,529 - Chen , et al. June 9, 2	2009-06-09
Structure for reducing stress for vias and fabricating method thereof Grant 7,545,039 - Hsu , et al. June 9, 2	2009-06-09
Wafer-leveled chip packaging structure and method thereof Grant 7,528,009 - Chen , et al. May 5, 2	2009-05-05
Method And Device For Enhancing Solderability App 20090050470 - Chang; Tao-Chih ; et al.	2009-02-26
Image sensor packaging structure Grant 7,417,293 - Chen , et al. August 26, 2	2008-08-26
Packaging structure and method of an image sensor module Grant 7,411,306 - Leu , et al. August 12, 2	2008-08-12
Wafer-leveled chip packaging structure and method thereof App 20080029870 - Chen; Shou-Lung ; et al.	2008-02-07
Wafer-leveled chip packaging structure and method thereof Grant 7,294,920 - Chen , et al. November 13, 2	2007-11-13
Packaging structure and method of an image sensor module App 20070195188 - Leu; Fang-Jun ; et al.	2007-08-23
Wafer-leveled chip packaging structure and method thereof App 20070197018 - Chen; Shou-Lung ; et al.	2007-08-23
Image Sensor Packaging Structure And Method Of Manufacturing The Same App 20070190687 - CHEN; Shou-Lung ; et al.	2007-08-16
Structure for reducing stress for vias and fabricating method thereof App 20070108572 - Hsu; Yung-Yu ; et al.	2007-05-17
Method And Device For Enhancing Solderability App 20070036952 - Chang; Tao-Chih ; et al.	2007-02-15
Stacked package for electronic elements App 20060220212 - Chen; Shou-Lung ; et al.	2006-10-05
Stacked package for electronic elements and packaging method thereof Grant 7,091,592 - Chen , et al. August 15, 2	2006-08-15
Packaging structure and method of an image sensor module App 20060030070 - Leu; Fang-Jun ; et al.	2006-02-09
Image sensor packaging structure and method of manufacturing the same App 20060022290 - Chen; Shou-Lung ; et al.	2006-02-02
Wafer-leveled chip packaging structure and method thereof App 20060019484 - Chen; Shou-Lung ; et al.	2006-01-26
Image sensor packaging structure and method App 20050236684 - Chen, Shou-Lung ; et al.	2005-10-27
Stacked package for electronic elements and packaging method thereof App 20040238933 - Chen, Shou-Lung ; et al.	2004-12-02

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.