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Integrated Electronic Chip And Interconnect Device And Process For Making The Same App 20070252287 - Pogge; H. Bernhard ;   et al. | 2007-11-01 |
Integrated electronic chip and interconnect device and process for making the same App 20060278998 - Pogge; H. Bernhard ;   et al. | 2006-12-14 |
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Three-dimensional device fabrication method App 20060121690 - Pogge; H Bernhard ;   et al. | 2006-06-08 |
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Method Of Fabricating Integrated Electronic Chip With An Interconnect Device App 20050056942 - Pogge, H. Bernhard ;   et al. | 2005-03-17 |
Method of fabricating integrated electronic chip with an interconnect device Grant 6,864,165 - Pogge , et al. March 8, 2 | 2005-03-08 |
Chip and wafer integration process using vertical connections Grant 6,856,025 - Pogge , et al. February 15, 2 | 2005-02-15 |
Three-dimensional integrated CMOS-MEMS device and process for making the same Grant 6,835,589 - Pogge , et al. December 28, 2 | 2004-12-28 |
Three-dimensional integrated CMOS-MEMS device and process for making the same App 20040097002 - Pogge, H. Bernhard ;   et al. | 2004-05-20 |
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Thin film transfer join process and multilevel thin film module App 20040097078 - Danielson, Jeffrey B. ;   et al. | 2004-05-20 |
Process for making fine pitch connections between devices and structure made by the process Grant 6,737,297 - Pogge , et al. May 18, 2 | 2004-05-18 |
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Chip and wafer integration process using vertical connections App 20030215984 - Pogge, H. Bernhard ;   et al. | 2003-11-20 |
Fabrication of a hybrid integrated circuit device including an optoelectronic chip Grant 6,640,021 - Pogge , et al. October 28, 2 | 2003-10-28 |
Chip and wafer integration process using vertical connections Grant 6,599,778 - Pogge , et al. July 29, 2 | 2003-07-29 |
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Fabrication of a hybrid integrated circuit device including an optoelectronic chip App 20030108269 - Pogge, H. Bernhard ;   et al. | 2003-06-12 |
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