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Fingerprint recognition chip packaging structure and packaging method
Grant 10,133,907 - Wang , et al. November 20, 2 | 2018-11-20 |
Wafer-level chip package structure and packaging method
Grant 10,126,151 - Wang , et al. November 13, 2 | 2018-11-13 |
Fingerprint recognition chip packaging structure and packaging method
Grant 10,108,837 - Wang , et al. October 23, 2 | 2018-10-23 |
Fingerprint recognition chip packaging structure and packaging method
Grant 10,096,643 - Wang , et al. October 9, 2 | 2018-10-09 |
Chip packaging method and package structure
Grant 10,090,217 - Wang , et al. October 2, 2 | 2018-10-02 |
Chip Packaging Structure And Packaging Method
App 20180129848 - Wang; Zhiqi ; et al. | 2018-05-10 |
Chip Packaging Method And Chip Packaging Structure
App 20180114048 - Wang; Zhiqi ; et al. | 2018-04-26 |
Chip Packaging Structure And Packaging Method
App 20180108585 - Wang; Zhiqi ; et al. | 2018-04-19 |
Packaging Method And Packaging Structure
App 20180047772 - Wang; Zhiqi ; et al. | 2018-02-15 |
Chip Packaging Method And Package Structure
App 20170287797 - Wang; Zhiqi ; et al. | 2017-10-05 |
Wafer-level Chip Package Structure And Packaging Method
App 20170284837 - Wang; Zhiqi ; et al. | 2017-10-05 |
Chip to wafer package with top electrodes and method of forming
Grant 9,748,162 - Wang , et al. August 29, 2 | 2017-08-29 |
Fingerprint Recognition Chip Packaging Structure And Packaging Method
App 20170162620 - WANG; Zhiqi ; et al. | 2017-06-08 |
Fingerprint Recognition Chip Packaging Structure And Packaging Method
App 20170147851 - Wang; Zhiqi ; et al. | 2017-05-25 |
Fingerprint Recognition Chip Packaging Structure And Packaging Method
App 20170140195 - Wang; Zhiqi ; et al. | 2017-05-18 |
Wafer-level packaging structure for image sensors with packaging cover dike structures corresponding to scribe line regions
Grant 9,601,531 - Wang , et al. March 21, 2 | 2017-03-21 |
Wafer-level packaging method of BSI image sensors having different cutting processes
Grant 9,455,298 - Wang , et al. September 27, 2 | 2016-09-27 |
Wafer-level Packaging Method Of Bsi Image Sensors Having Different Cutting Processes
App 20160148972 - WANG; Zhi-Qi ; et al. | 2016-05-26 |
Wafer-level packaging method of BSI image sensors having different cutting processes
Grant 9,305,961 - Wang , et al. April 5, 2 | 2016-04-05 |
Image sensor package structure and method
Grant 9,299,735 - Wang , et al. March 29, 2 | 2016-03-29 |
Wafer level packaging structure for image sensors and wafer level packaging method for image sensors
Grant 9,231,018 - Wang , et al. January 5, 2 | 2016-01-05 |
Chip Package And Method For Forming The Same
App 20150200153 - Wang; Zhiqi ; et al. | 2015-07-16 |
Image Sensor Package Structure And Method
App 20150137294 - Wang; Zhiqi ; et al. | 2015-05-21 |
Wafer Level Packaging Structure For Image Sensors And Wafer Level Packaging Method For Image Sensors
App 20150054108 - Wang; Zhiqi ; et al. | 2015-02-26 |
Wafer Level Packaging Structure For Image Sensors And Wafer Level Packaging Method For Image Sensors
App 20150054109 - Wang; Zhiqi ; et al. | 2015-02-26 |
Wafer-level Packaging Method Of Bsi Image Sensors Having Different Cutting Processes
App 20140191352 - WANG; Zhi-Qi ; et al. | 2014-07-10 |
Process for producing aldehydes or ketones by oxidizing alcohols with oxygen
Grant 8,748,669 - Ma , et al. June 10, 2 | 2014-06-10 |
Process For Producing Aldehydes Or Ketones By Oxidizing Alcohols With Oxygen
App 20120220792 - Ma; Shengming ; et al. | 2012-08-30 |
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