Patent | Date |
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Structure And Formation Method Of Semiconductor Device With Backside Contact App 20220310804 - SU; Huan-Chieh ;   et al. | 2022-09-29 |
Semiconductor device structure and methods of forming the same Grant 11,456,246 - Huang , et al. September 27, 2 | 2022-09-27 |
Spacers for semiconductor devices including a backside power rails Grant 11,456,209 - Yu , et al. September 27, 2 | 2022-09-27 |
Integrated circuit structure with backside via rail Grant 11,450,751 - Su , et al. September 20, 2 | 2022-09-20 |
Contact Via Formation App 20220293521 - Huang; Lin-Yu ;   et al. | 2022-09-15 |
Semiconductor device structure with salicide layer and method for forming the same Grant 11,444,173 - Shen , et al. September 13, 2 | 2022-09-13 |
Selective Liner On Backside Via And Method Thereof App 20220285494 - Huang; Lin-Yu ;   et al. | 2022-09-08 |
Using A Liner Layer To Enlarge Process Window For A Contact Via App 20220285206 - Yu; Li-Zhen ;   et al. | 2022-09-08 |
Method for fabricating a semiconductor device Grant 11,437,279 - Chen , et al. September 6, 2 | 2022-09-06 |
Backside Vias in Semiconductor Device App 20220278213 - Yu; Li-Zhen ;   et al. | 2022-09-01 |
Method For Fabricating A Semiconductor Device App 20220270929 - CHEN; Chun-Yuan ;   et al. | 2022-08-25 |
Backside Gate Contact App 20220271138 - Su; Huan-Chieh ;   et al. | 2022-08-25 |
Semiconductor Device With Backside Gate Isolation Structure And Method For Forming The Same App 20220271139 - Su; Huan-Chieh ;   et al. | 2022-08-25 |
Gap spacer for backside contact structure Grant 11,424,332 - Yu , et al. August 23, 2 | 2022-08-23 |
Semiconductor Device With Gate Cut Feature And Method For Forming The Same App 20220262915 - Su; Huan-Chieh ;   et al. | 2022-08-18 |
Method For Forming Via Structure Having Low Interface Resistance App 20220262727 - YU; Li-Zhen ;   et al. | 2022-08-18 |
Semiconductor device with air gaps and method of fabrication thereof Grant 11,410,876 - Chang , et al. August 9, 2 | 2022-08-09 |
Semiconductor Device Structure And Methods Of Forming The Same App 20220246464 - HUANG; Lin-Yu ;   et al. | 2022-08-04 |
Dumbbell Shaped Self-aligned Capping Layer Over Source/drain Contacts And Method Thereof App 20220246740 - Huang; Lin-Yu ;   et al. | 2022-08-04 |
Capacitance reduction for backside power rail device Grant 11,404,548 - Yu , et al. August 2, 2 | 2022-08-02 |
Enlarging contact area and process window for a contact via Grant 11,387,140 - Yu , et al. July 12, 2 | 2022-07-12 |
Semiconductor device structure and methods of forming the same Grant 11,374,093 - Huang , et al. June 28, 2 | 2022-06-28 |
Using a liner layer to enlarge process window for a contact via Grant 11,361,986 - Yu , et al. June 14, 2 | 2022-06-14 |
Backside Connection Structures For Nanostructures And Methods Of Forming The Same App 20220181250 - YU; Li-Zhen ;   et al. | 2022-06-09 |
Self-aligned Contact Structures App 20220173223 - Yu; Li-Zhen ;   et al. | 2022-06-02 |
Backside vias in semiconductor device Grant 11,349,004 - Yu , et al. May 31, 2 | 2022-05-31 |
Semiconductor Device Structure And Methods Of Forming The Same App 20220165846 - HUANG; Lin-Yu ;   et al. | 2022-05-26 |
Gap Spacer For Backside Contact Structure App 20220165856 - Yu; Li-Zhen ;   et al. | 2022-05-26 |
Interconnect Structure App 20220165659 - Huang; Lin-Yu ;   et al. | 2022-05-26 |
Selective liner on backside via and method thereof Grant 11,342,413 - Huang , et al. May 24, 2 | 2022-05-24 |
Semiconductor Device Having Backside Via And Method Of Fabricating Thereof App 20220157949 - HUANG; Lin-Yu ;   et al. | 2022-05-19 |
Via structure having a metal hump for low interface resistance Grant 11,328,990 - Yu , et al. May 10, 2 | 2022-05-10 |
Semiconductor Device With Backside Power Rail And Methods Of Fabrication Thereof App 20220130991 - YU; Li-Zhen ;   et al. | 2022-04-28 |
Backside Power Rail And Methods Of Forming The Same App 20220130823 - Su; Huan-Chieh ;   et al. | 2022-04-28 |
Dumbbell shaped self-aligned capping layer over source/drain contacts and method thereof Grant 11,316,023 - Huang , et al. April 26, 2 | 2022-04-26 |
Semiconductor device structure and methods of forming the same Grant 11,309,212 - Huang , et al. April 19, 2 | 2022-04-19 |
Capacitance Reduction For Backside Power Rail Device App 20220115510 - YU; Li-Zhen ;   et al. | 2022-04-14 |
Integrated Circuit Structure With Backside Interconnection Structure Having Air Gap App 20220093448 - YU; Li-Zhen ;   et al. | 2022-03-24 |
Semiconductor Devices With Backside Power Rail And Method Thereof App 20220069076 - Yu; Li-Zhen ;   et al. | 2022-03-03 |
Backside Contact App 20220069117 - Yu; Li-Zhen ;   et al. | 2022-03-03 |
Contact via formation Grant 11,264,326 - Huang , et al. March 1, 2 | 2022-03-01 |
Backside connection structures for nanostructures and methods of forming the same Grant 11,257,758 - Yu , et al. February 22, 2 | 2022-02-22 |
Self-aligned contact structures Grant 11,257,926 - Yu , et al. February 22, 2 | 2022-02-22 |
Method for Forming Source/Drain Contacts Utilizing an Inhibitor App 20220052167 - Huang; Lin-Yu ;   et al. | 2022-02-17 |
Fin field effect transistor device structure and method for forming the same Grant 11,251,305 - Huang , et al. February 15, 2 | 2022-02-15 |
Semiconductor Device Structure And Methods Of Forming The Same App 20220037191 - HUANG; Lin-Yu ;   et al. | 2022-02-03 |
Spacers for Semiconductor Devices Including Backside Power Rails App 20220037192 - Yu; Li-Zhen ;   et al. | 2022-02-03 |
Semiconductor Device Structure And Methods Of Forming The Same App 20220037190 - HUANG; Lin-Yu ;   et al. | 2022-02-03 |
Spacers for Semiconductor Devices Including a Backside Power Rails App 20220037193 - Yu; Li-Zhen ;   et al. | 2022-02-03 |
Semiconductor Structures And Methods Of Forming The Same App 20220037486 - Huang; Lin-Yu ;   et al. | 2022-02-03 |
Semiconductor device having backside via and method of fabricating thereof Grant 11,239,325 - Huang , et al. February 1, 2 | 2022-02-01 |
Semiconductor Device Structure And Methods Of Forming The Same App 20220028780 - HUANG; Lin-Yu ;   et al. | 2022-01-27 |
Semiconductor Device With L-Shape Conductive Feature And Methods Of Forming The Same App 20220028743 - Chuang; Cheng-Chi ;   et al. | 2022-01-27 |
Backside power rail and methods of forming the same Grant 11,222,892 - Su , et al. January 11, 2 | 2022-01-11 |
Semiconductor Device and Method of Forming Thereof App 20210408249 - Yu; Li-Zhen ;   et al. | 2021-12-30 |
Backside Connection Structures For Nanostructures And Methods Of Forming The Same App 20210407900 - YU; Li-Zhen ;   et al. | 2021-12-30 |
Source/drain Contacts And Methods Of Forming Same App 20210408247 - Yu; Li-Zhen ;   et al. | 2021-12-30 |
Connector Via Structures For Nanostructures And Methods Of Forming The Same App 20210408274 - YU; Li-Zhen ;   et al. | 2021-12-30 |
Integrated Circuit Structure With Backside Via Rail App 20210399109 - SU; Huan-Chieh ;   et al. | 2021-12-23 |
Backside Power Rail And Methods Of Forming The Same App 20210391325 - Su; Huan-Chieh ;   et al. | 2021-12-16 |
Dumbbell Shaped Self-aligned Capping Layer Over Source/drain Contacts And Method Thereof App 20210391431 - Huang; Lin-Yu ;   et al. | 2021-12-16 |
Methods of Forming Contact Features in Field-Effect Transistors App 20210384352 - Yu; Li-Zhen ;   et al. | 2021-12-09 |
Self-aligned Contact Structures App 20210384316 - Yu; Li-Zhen ;   et al. | 2021-12-09 |
Structure and method for bi-layer self-aligned contact Grant 11,195,934 - Huang , et al. December 7, 2 | 2021-12-07 |
Semiconductor Device with Air Gaps and Method of Fabrication Thereof App 20210375664 - Chang; Chia-Hao ;   et al. | 2021-12-02 |
Contact Via Formation App 20210375758 - Huang; Lin-Yu ;   et al. | 2021-12-02 |
Semiconductor Device And Manufacturing Method Thereof App 20210376092 - YU; Li-Zhen ;   et al. | 2021-12-02 |
Method For Forming Long Channel Back-side Power Rail Device App 20210351079 - Su; Huan-Chieh ;   et al. | 2021-11-11 |
Semiconductor Device Having Backside Via And Method Of Fabricating Thereof App 20210336012 - HUANG; Lin-Yu ;   et al. | 2021-10-28 |
Selective Liner on Backside Via and Method Thereof App 20210336004 - Huang; Lin-Yu ;   et al. | 2021-10-28 |
Backside Vias in Semiconductor Device App 20210336020 - Yu; Li-Zhen ;   et al. | 2021-10-28 |
Butted Contacts and Methods of Fabricating the Same in Semiconductor Devices App 20210328032 - Yu; Li-Zhen ;   et al. | 2021-10-21 |
Method for forming source/drain contacts utilizing an inhibitor Grant 11,152,475 - Huang , et al. October 19, 2 | 2021-10-19 |
Semiconductor device and method of forming same Grant 11,145,728 - Huang , et al. October 12, 2 | 2021-10-12 |
Contact Formation Method And Related Structure App 20210305382 - HUANG; Lin-Yu ;   et al. | 2021-09-30 |
Enlarging Contact Area And Process Window For A Contact Via App 20210296162 - Yu; Li-Zhen ;   et al. | 2021-09-23 |
Using A Liner Layer To Enlarge Process Window For A Contact Via App 20210280454 - Yu; Li-Zhen ;   et al. | 2021-09-09 |
Method for Forming Source/Drain Contacts Utilizing an Inhibitor App 20210273062 - Huang; Lin-Yu ;   et al. | 2021-09-02 |
Methods of forming contact features in field-effect transistors Grant 11,107,925 - Yu , et al. August 31, 2 | 2021-08-31 |
Semiconductor device and manufacturing method thereof Grant 11,094,788 - Yu , et al. August 17, 2 | 2021-08-17 |
Slot Contacts and Method Forming Same App 20210175125 - Huang; Lin-Yu ;   et al. | 2021-06-10 |
Semiconductor Device And Method Of Forming Same App 20210134969 - Huang; Lin-Yu ;   et al. | 2021-05-06 |
Isolation Structure For Metal Interconnect App 20210134669 - HUANG; Lin-Yu ;   et al. | 2021-05-06 |
Fin Field Effect Transistor Device Structure And Method For Forming The Same App 20210126129 - HUANG; Lin-Yu ;   et al. | 2021-04-29 |
Contact Features and Methods of Fabricating the Same in Semiconductor Devices App 20210098364 - Yu; Li-Zhen ;   et al. | 2021-04-01 |
Via Structure Having Low Interface Resistance And Method For Forming The Same App 20210098368 - YU; Li-Zhen ;   et al. | 2021-04-01 |
Slot contacts and method forming same Grant 10,943,829 - Huang , et al. March 9, 2 | 2021-03-09 |
Structure And Method For Bi-layer Self-aligned Contact App 20210066470 - Huang; Lin-Yu ;   et al. | 2021-03-04 |
Semiconductor Device And Manufacturing Method Thereof App 20210057530 - YU; Li-Zhen ;   et al. | 2021-02-25 |
Semiconductor device structure with epitaxial structure and method for forming the same Grant 10,868,000 - Yu , et al. December 15, 2 | 2020-12-15 |
Semiconductor Device Structure With Epitaxial Structure And Method For Forming The Same App 20200243519 - YU; Li-Zhen ;   et al. | 2020-07-30 |
Slot Contacts and Method Forming Same App 20200126865 - Huang; Lin-Yu ;   et al. | 2020-04-23 |
Methods of Forming Contact Features in Field-Effect Transistors App 20200105937 - Yu; Li-Zhen ;   et al. | 2020-04-02 |
Semiconductor Device Structure With Salicide Layer And Method For Forming The Same App 20190131421 - SHEN; Hsiang-Ku ;   et al. | 2019-05-02 |