Yu; Li-Chih

Patent Applications and Registrations

Patent applications and USPTO patent grants for Yu; Li-Chih.The latest application filed is for "multi-layer printed circuit boards with dimensional stability".

Company Profile

0.13.16

Yu; Li-Chih - Taoyuan TW
Yu; Li-Chih - Tao-Yuan Hsien TW
YU; Li-Chih - Taoyuan County TW
Yu, Li Chih - Taipei TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Multi-layer printed circuit boards with dimensional stability Grant 9,955,569 - Kuo , et al. April 24, 2	2018-04-24
Halogen-free resin composition, copper clad laminate using the same, and printed circuit board using the same Grant 9,650,512 - Wang , et al. May 16, 2	2017-05-16
Multi-layer Printed Circuit Boards With Dimensional Stability App 20170079134 - KUO; Ya-Wen ; et al.	2017-03-16
Multi-layer printed circuit boards with dimensional stability Grant 9,545,018 - Kuo , et al. January 10, 2	2017-01-10
Halogen-free resin composition and copper clad laminate and printed circuit board using same Grant 9,422,412 - Yu , et al. August 23, 2	2016-08-23
Resin composition, copper-clad laminate and printed circuit board for use therewith Grant 9,394,438 - Yu , et al. July 19, 2	2016-07-19
Multi-layer printed circuit boards having properties suitable for layer reduction design Grant 9,392,683 - Chang , et al. July 12, 2	2016-07-12
Multi-layer Printed Circuit Boards With Low Warpage App 20160165714 - CHEN; Ocean ; et al.	2016-06-09
Multi-layer Printed Circuit Boards With Dimensional Stability App 20160128180 - KUO; Ya-Wen ; et al.	2016-05-05
Multi-layer Printed Circuit Boards Suitable For Layer Reduction Design App 20160120018 - CHANG; Ming-Chuan ; et al.	2016-04-28
Halogen-free resin composition, copper clad laminate using the same, and printed circuit board using the same Grant 9,288,904 - Wang , et al. March 15, 2	2016-03-15
Halogen-free resin composition, and copper clad laminate and printed circuit board using same Grant 9,279,051 - Yu , et al. March 8, 2	2016-03-08
Halogen-free resin composition Grant 9,238,733 - Li , et al. January 19, 2	2016-01-19
Halogen-free resin composition, copper clad laminate using the same, and printed circuit board using the same Grant 9,185,801 - Li , et al. November 10, 2	2015-11-10
Halogen-free Resin Composition, Copper Clad Laminate Using The Same, And Printed Circuit Board Using The Same App 20140322541 - WANG; RONG-TAO ; et al.	2014-10-30
Halogen-free Resin Composition, Copper Clad Laminate Using The Same, And Printed Circuit Board Using The Same App 20140178697 - LI; CHANG-YUAN ; et al.	2014-06-26
Resin Composition, Copper-clad Laminate And Printed Circuit Board For Use Therewith App 20140178696 - YU; LI-CHIH ; et al.	2014-06-26
Halogen-free Resin Composition, Copper Clad Laminate Using The Same, And Printed Circuit Board Using The Same App 20140023839 - WANG; RONG-TAO ; et al.	2014-01-23
Halogen-free Resin Composition App 20130316155 - LI; CHANG-YUAN ; et al.	2013-11-28
Halogen-free Resin Composition, And Copper Clad Laminate And Printed Circuit Board Using Same App 20130115472 - YU; Li-Chih ; et al.	2013-05-09
Halogen-free Resin Composition And Copper Clad Laminate And Printed Circuit Board Using Same App 20130075138 - YU; Li-Chih ; et al.	2013-03-28
Resin Composition And Prepreg, Laminate And Circuit Board Thereof App 20130075136 - YU; Li-Chih ; et al.	2013-03-28
Resin composition and prepreg, laminate and circuit board thereof Grant 8,404,764 - Yu , et al. March 26, 2	2013-03-26
Method For Manufacturing Metal Base Laminate App 20110274877 - Yu; Li-Chih ; et al.	2011-11-10
Suspension device for displaying wheel rims App 20020088912 - Yu, Li Chih	2002-07-11

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