| Patent | Date |
|---|
Platform and method of operating for integrated end-to-end fully self-aligned interconnect process
Grant 11,456,212 - Clark , et al. September 27, 2 | 2022-09-27 |
Method For Filling Recessed Features In Semiconductor Devices With A Low-resistivity Metal
App 20220301930 - Yu; Kai-Hung ; et al. | 2022-09-22 |
Method of bottom-up metallization in a recessed feature
Grant 11,450,562 - Yu , et al. September 20, 2 | 2022-09-20 |
Method For Filling Recessed Features In Semiconductor Devices With A Low-resistivity Metal
App 20220139776 - Yu; Kai-Hung ; et al. | 2022-05-05 |
Method For Filling Recessed Features In Semiconductor Devices With A Low-resistivity Metal
App 20210287936 - Yu; Kai-Hung ; et al. | 2021-09-16 |
Selective Deposition Of Conductive Cap For Fully-aligned-via (fav)
App 20210242074 - Lu; Yen-Tien ; et al. | 2021-08-05 |
Method for filling recessed features in semiconductor devices with a low-resistivity metal
Grant 11,024,535 - Yu , et al. June 1, 2 | 2021-06-01 |
Platform And Method Of Operating For Integrated End-to-end Fully Self-aligned Interconnect Process
App 20210125863 - CLARK; Robert ; et al. | 2021-04-29 |
Platform And Method Of Operating For Integrated End-to-end Fully Self-aligned Interconnect Process
App 20210118730 - CLARK; Robert ; et al. | 2021-04-22 |
Method Of Bottom-up Metallization In A Recessed Feature
App 20210082750 - YU; Kai-Hung ; et al. | 2021-03-18 |
Metal hard mask layers for processing of microelectronic workpieces
Grant 10,950,444 - Lu , et al. March 16, 2 | 2021-03-16 |
Interconnect structure and method of forming the same
Grant 10,923,392 - Chae , et al. February 16, 2 | 2021-02-16 |
Platform and method of operating for integrated end-to-end fully self-aligned interconnect process
Grant 10,923,394 - Clark , et al. February 16, 2 | 2021-02-16 |
Method For Using Ultra Thin Ruthenium Metal Hard Mask For Etching Profile Control
App 20210028017 - Lu; Yen-Tien ; et al. | 2021-01-28 |
Platform and method of operating for integrated end-to-end fully self-aligned interconnect process
Grant 10,886,173 - Clark , et al. January 5, 2 | 2021-01-05 |
Platform and method of operating for integrated end-to-end CMP-less interconnect process
Grant 10,861,744 - Trickett , et al. December 8, 2 | 2020-12-08 |
Three-dimensional device and method of forming the same
Grant 10,770,479 - Smith , et al. Sep | 2020-09-08 |
Ruthenium metal feature fill for interconnects
Grant 10,700,009 - Yu , et al. | 2020-06-30 |
Method For Filling Recessed Features In Semiconductor Devices With A Low-resistivity Metal
App 20200118871 - Yu; Kai-Hung ; et al. | 2020-04-16 |
Method of integrated circuit fabrication with dual metal power rail
Grant 10,580,691 - Chae , et al. | 2020-03-03 |
Interconnect structure and method of forming the same
Grant 10,541,174 - Chae , et al. Ja | 2020-01-21 |
Interconnect Structure And Method Of Forming The Same
App 20200006129 - CHAE; Soo Doo ; et al. | 2020-01-02 |
Multipath clock and data recovery
Grant 10,498,523 - Wang , et al. De | 2019-12-03 |
Removal method and processing method
Grant 10,460,988 - Itatani , et al. Oc | 2019-10-29 |
Platform And Method Of Operating For Integrated End-to-end Cmp-less Interconnect Process
App 20190295887 - Trickett; Ying ; et al. | 2019-09-26 |
Platform And Method Of Operating For Integrated End-to-end Fully Self-aligned Interconnect Process
App 20190295891 - Clark; Robert ; et al. | 2019-09-26 |
Platform And Method Of Operating For Integrated End-to-end Fully Self-aligned Interconnect Process
App 20190295890 - Clark; Robert ; et al. | 2019-09-26 |
Repeaters with fast transitions from low-power standby to low-frequency signal transmission
Grant 10,425,124 - Wang , et al. Sept | 2019-09-24 |
Three-dimensional Device And Method Of Forming The Same
App 20190288004 - SMITH; Jeffrey ; et al. | 2019-09-19 |
Repeaters With Fast Transitions From Low-power Standby To Low-frequency Signal Transmission
App 20190288743 - Wang; Jin-sheng ; et al. | 2019-09-19 |
Method For Protecting Cobalt Plugs
App 20190259650 - Han; Sang Cheol ; et al. | 2019-08-22 |
Selective deposition with surface treatment
Grant 10,378,105 - Yu , et al. A | 2019-08-13 |
Metal Hard Mask Layers For Processing Of Microelectronic Workpieces
App 20190237331 - Lu; Yen-Tien ; et al. | 2019-08-01 |
Removal Method And Processing Method
App 20190198390 - ITATANI; Takeshi ; et al. | 2019-06-27 |
Referenceless clock and data recovery circuits
Grant 10,291,241 - Wang , et al. | 2019-05-14 |
Ruthenium Metal Feature Fill For Interconnects
App 20190103363 - Yu; Kai-Hung ; et al. | 2019-04-04 |
Referenceless Clock And Data Recovery Circuits
App 20190089361 - Wang; Jin-sheng ; et al. | 2019-03-21 |
Integration of a self-forming barrier layer and a ruthenium metal liner in copper metallization
Grant 10,157,784 - Yu , et al. Dec | 2018-12-18 |
Method Of Integrated Circuit Fabrication With Dual Metal Power Rail
App 20180350665 - Chae; Soo Doo ; et al. | 2018-12-06 |
Ruthenium metal feature fill for interconnects
Grant 10,056,328 - Yu , et al. August 21, 2 | 2018-08-21 |
Interconnect Structure And Method Of Forming The Same
App 20180211870 - CHAE; Soo Doo ; et al. | 2018-07-26 |
Referenceless clock and data recovery circuits
Grant 10,027,332 - Wang , et al. July 17, 2 | 2018-07-17 |
Selective bottom-up metal feature filling for interconnects
Grant 10,014,213 - Yu , et al. July 3, 2 | 2018-07-03 |
Method Of Metal Filling Recessed Features In A Substrate
App 20180053688 - Yu; Kai-Hung ; et al. | 2018-02-22 |
Selective Deposition With Surface Treatment
App 20170342553 - Yu; Kai-Hung ; et al. | 2017-11-30 |
Ruthenium Metal Feature Fill For Interconnects
App 20170317022 - Yu; Kai-Hung ; et al. | 2017-11-02 |
Ruthenium Metal Deposition Method For Electrical Connections
App 20170241014 - Yu; Kai-Hung ; et al. | 2017-08-24 |
Ruthenium metal feature fill for interconnects
Grant 9,711,449 - Yu , et al. July 18, 2 | 2017-07-18 |
Metal Filling And Planarization Of Recessed Features
App 20170194192 - Yu; Kai-Hung | 2017-07-06 |
Selective Bottom-up Metal Feature Filling For Interconnects
App 20170110368 - Yu; Kai-Hung ; et al. | 2017-04-20 |
Integration of ALD barrier layer and CVD Ru liner for void-free Cu filling
Grant 9,607,888 - Yu , et al. March 28, 2 | 2017-03-28 |
Ruthenium Metal Feature Fill For Interconnects
App 20160358815 - Yu; Kai-Hung ; et al. | 2016-12-08 |
Copper wiring forming method, film forming system, and storage medium
Grant 9,425,093 - Ishizaka , et al. August 23, 2 | 2016-08-23 |
Copper Wiring Forming Method, Film Forming System, And Storage Medium
App 20160163591 - ISHIZAKA; Tadahiro ; et al. | 2016-06-09 |
INTEGRATION OF ALD BARRIER LAYER AND CVD Ru LINER FOR VOID-FREE Cu FILLING
App 20150221550 - Yu; Kai-Hung ; et al. | 2015-08-06 |
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