| Patent | Date |
|---|
Tin Oxide Films In Semiconductor Device Manufacturing
App 20220270877 - Yu; Jengyi ; et al. | 2022-08-25 |
Photoresist Development With Halide Chemistries
App 20220244645 - Tan; Samantha SiamHwa ; et al. | 2022-08-04 |
Atomic Layer Etch And Selective Deposition Process For Extreme Ultraviolet Lithography Resist Improvement
App 20220216050 - Yu; Jengyi ; et al. | 2022-07-07 |
Alternating Etch And Passivation Process
App 20220208551 - Heo; Seongjun ; et al. | 2022-06-30 |
Tin oxide mandrels in patterning
Grant 11,355,353 - Yu , et al. June 7, 2 | 2022-06-07 |
Tin Oxide Films In Semiconductor Device Manufacturing
App 20220165571 - Yu; Jengyi ; et al. | 2022-05-26 |
Tin oxide films in semiconductor device manufacturing
Grant 11,322,351 - Yu , et al. May 3, 2 | 2022-05-03 |
Underlayer for photoresist adhesion and dose reduction
Grant 11,314,168 - Tan , et al. April 26, 2 | 2022-04-26 |
Eliminating Yield Impact Of Stochastics In Lithography
App 20220122846 - Shamma; Nader ; et al. | 2022-04-21 |
Selective Etch Using A Sacrificial Mask
App 20220122848 - PETER; Daniel ; et al. | 2022-04-21 |
Eliminating yield impact of stochastics in lithography
Grant 11,257,674 - Shamma , et al. February 22, 2 | 2022-02-22 |
Underlayer For Photoresist Adhesion And Dose Reduction
App 20220043334 - Tan; Samantha S.H. ; et al. | 2022-02-10 |
Removing Metal Contamination From Surfaces Of A Processing Chamber
App 20220037132 - YU; Jengyi ; et al. | 2022-02-03 |
Underlayer For Photoresist Adhesion And Dose Reduction
App 20220035247 - Tan; Samantha S.H. ; et al. | 2022-02-03 |
Tin Oxide Films In Semiconductor Device Manufacturing
App 20210265163 - Yu; Jengyi ; et al. | 2021-08-26 |
Tin Oxide Mandrels In Patterning
App 20210265173 - Yu; Jengyi ; et al. | 2021-08-26 |
Eliminating Yield Impact Of Stochastics In Lithography
App 20200402801 - Shamma; Nader ; et al. | 2020-12-24 |
Eliminating yield impact of stochastics in lithography
Grant 10,796,912 - Shamma , et al. October 6, 2 | 2020-10-06 |
Etching substrates using ALE and selective deposition
Grant 10,685,836 - Tan , et al. | 2020-06-16 |
Tin Oxide Films In Semiconductor Device Manufacturing
App 20200083044 - Yu; Jengyi ; et al. | 2020-03-12 |
Tin oxide films in semiconductor device manufacturing
Grant 10,546,748 - Yu , et al. Ja | 2020-01-28 |
Etching Substrates Using Ale And Selective Deposition
App 20190244805 - Tan; Samantha ; et al. | 2019-08-08 |
Tin Oxide Mandrels In Patterning
App 20190237341 - Yu; Jengyi ; et al. | 2019-08-01 |
Etching substrates using ale and selective deposition
Grant 10,269,566 - Tan , et al. | 2019-04-23 |
Eliminating Yield Impact Of Stochastics In Lithography
App 20180337046 - Shamma; Nader ; et al. | 2018-11-22 |
Tin Oxide Films In Semiconductor Device Manufacturing
App 20180240667 - Yu; Jengyi ; et al. | 2018-08-23 |
Atomic layer etching for enhanced bottom-up feature fill
Grant 9,837,312 - Tan , et al. December 5, 2 | 2017-12-05 |
Etching Substrates Using Ale And Selective Deposition
App 20170316935 - Tan; Samantha ; et al. | 2017-11-02 |
Metal And Silicon Containing Capping Layers For Interconnects
App 20140216336 - Yu; Jengyi ; et al. | 2014-08-07 |
Metal and silicon containing capping layers for interconnects
Grant 8,753,978 - Yu , et al. June 17, 2 | 2014-06-17 |
Metal And Silicon Containing Capping Layers For Interconnects
App 20130143401 - Yu; Jengyi ; et al. | 2013-06-06 |
Interfacial capping layers for interconnects
Grant 8,268,722 - Yu , et al. September 18, 2 | 2012-09-18 |
Interfacial Capping Layers For Interconnects
App 20100308463 - Yu; Jengyi ; et al. | 2010-12-09 |
Stress profile modulation in STI gap fill
Grant 7,482,245 - Yu , et al. January 27, 2 | 2009-01-27 |
Biased H.sub.2 etch process in deposition-etch-deposition gap fill
Grant 7,163,896 - Zhu , et al. January 16, 2 | 2007-01-16 |
Methods of filling constrained spaces with insulating materials and/or of forming contact holes and/or contacts in an integrated circuit
Grant 6,822,333 - Yu November 23, 2 | 2004-11-23 |
Systems and methods to retard copper diffusion and improve film adhesion for a dielectric barrier on copper
Grant 6,764,952 - Yu , et al. July 20, 2 | 2004-07-20 |
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