Yu; Hung-Tien
Patent Applications and Registrations
Patent applications and USPTO patent grants for Yu; Hung-Tien.The latest application filed is for "multiple stage deposition process for filling trenches".
- Yu; Hung-Tien - I-Lan TW
| Patent | Date |
|---|---|
| Sequential deposition process for gap filling Grant 6,943,091 - Yu , et al. September 13, 2 | 2005-09-13 |
| Multiple stage deposition process for filling trenches Grant 6,617,224 - Yu , et al. September 9, 2 | 2003-09-09 |
| Multiple stage deposition process for filling trenches App 20020055268 - Yu, Hung-Tien ; et al. | 2002-05-09 |
| Deposition method for filling recesses in a substrate App 20020052128 - Yu, Hung-Tien ; et al. | 2002-05-02 |
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