YU; Hui-Chang

Patent Applications and Registrations

Patent applications and USPTO patent grants for YU; Hui-Chang.The latest application filed is for "structure and formation method of chip package with protective lid".

Company Profile

0.1.9

YU; Hui-Chang - Hsinchu County TW
Yu; Hui-Chang - Chu-Nan TW
Yu; Hui-Chang - Hsin-chu TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Structure And Formation Method Of Chip Package With Protective Lid App 20220278069 - KUO; Meng-Tsung ; et al.	2022-09-01
Semiconductor Device And Manufacturing Method Thereof App 20220270949 - Yeh; Shu-Shen ; et al.	2022-08-25
Semiconductor Package And Method Of Manufacturing The Same App 20220148979 - Ching; Kai-Ming ; et al.	2022-05-12
Electrode arrangement of organic light emitting diode App 20070126340 - Chang Chien; Chin Chung ; et al.	2007-06-07
Organic electroluminescent device for preventing long distance short App 20060243968 - Chang Chien; Chin Chung ; et al.	2006-11-02
Organic electroluminescent device with improved lifetime and method for fabricating the same App 20060208633 - Cheng; Chi-Ming ; et al.	2006-09-21
Electrode structure of organic electroluminescent display panel and method of manufacturing the same App 20060040133 - Lan; Wen-Jeng ; et al.	2006-02-23
Organic electroluminescent device and method for manufacturing the same App 20050264178 - Lan, Wen-Jeng ; et al.	2005-12-01
In-situ discharge to avoid arcing during plasma etch processes Grant 6,914,007 - Ma , et al. July 5, 2	2005-07-05
In-situ discharge to avoid arcing during plasma etch processes App 20040161930 - Ma, Ching-Hui ; et al.	2004-08-19

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