YU; Guoqing

Patent Applications and Registrations

Patent applications and USPTO patent grants for YU; Guoqing.The latest application filed is for "semiconductor packaging method and semiconductor package device".

Company Profile

3.9.23

YU; Guoqing - Nantong CN
Yu; Guoqing - Shanghai CN
Yu; Guoqing - Tianjin CN
Yu; Guoqing - Jiang Su Province CN
Yu; Guoqing - Jiang Su N/A CN
Yu; Guoqing - SuZhou Industrial Park CN
Yu; Guoqing - Suzhou CN
Yu; Guoqing - Jiangsu Province CN

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor Packaging Method And Semiconductor Package Device App 20210343763 - YU; Guoqing	2021-11-04
Semiconductor Packaging Method And Semiconductor Package Device App 20210343775 - YU; Guoqing	2021-11-04
Semiconductor Packaging Method And Semiconductor Package Device App 20210265252 - YU; Guoqing	2021-08-26
Semiconductor Packaging Method And Semiconductor Package Device App 20210265294 - YU; Guoqing	2021-08-26
Semiconductor Packaging Method And Semiconductor Package Device App 20210257334 - YU; Guoqing	2021-08-19
Method For Recycling Continuous Alcoholysis Of Waste Polyester Material App 20210040287 - Fang; Huayu ; et al.	2021-02-11
Method For Recycling Waste Polyester App 20210024718 - Fang; Huayu ; et al.	2021-01-28
Method For Recycling Waste Polyester With Continuous Alcoholysis And Transesterification App 20210024717 - Fang; Huayu ; et al.	2021-01-28
Therapeutic Methods and Compositions App 20160128933 - Shang; Tiangang ; et al.	2016-05-12
Wafer-level package structure of light emitting diode and manufacturing method thereof Grant 8,952,512 - Li , et al. February 10, 2	2015-02-10
Wafer-level Package Structure Of Light Emitting Diode And Manufacturing Method Thereof App 20130228817 - LI; Junjie ; et al.	2013-09-05
Wafer-level package structure of light emitting diode and manufacturing method thereof Grant 8,445,919 - Li , et al. May 21, 2	2013-05-21
Packaging structure Grant 8,174,090 - Wang , et al. May 8, 2	2012-05-08
Wafer-level Package Structure Of Light Emitting Diode And Manufacturing Method Thereof App 20110006322 - LI; Junjie ; et al.	2011-01-13
WLCSP target and method for forming the same Grant 7,795,074 - Shao , et al. September 14, 2	2010-09-14
Wafer level chip size package for MEMS devices and method for fabricating the same Grant 7,781,250 - Wang , et al. August 24, 2	2010-08-24
Packaging structure and method for fabricating the same Grant 7,755,155 - Yu , et al. July 13, 2	2010-07-13
Optical Converter And Manufacturing Method Thereof And Light Emitting Diode App 20100171134 - Shao; Mingda ; et al.	2010-07-08
Packaging Method And Packaging Structure App 20100133640 - Wang; Zhiqi ; et al.	2010-06-03
Packaging Structure, Packaging Method And Photosensitive Device App 20100065956 - WANG; Zhiqi ; et al.	2010-03-18
Wlcsp Target And Method For Forming The Same App 20100044857 - Shao; Mingda ; et al.	2010-02-25
Wafer level chip size packaged chip device with a double-layer lead structure and method of fabricating the same Grant 7,663,213 - Yu , et al. February 16, 2	2010-02-16
Packaging Structure And Method For Fabricating The Same App 20090289317 - YU; Guoping ; et al.	2009-11-26
Patterned Leads For WLCSP And Method For Fabricating The Same App 20090102056 - Yu; Guoping ; et al.	2009-04-23
Optical Waveguide And Method For Manufacturing The Same App 20090080847 - SHAO; Mingda ; et al.	2009-03-26
Optical Waveguide and Method for Manufacturing the Same App 20090080846 - Shao; Mingda ; et al.	2009-03-26
Wafer Level Chip Size Package For MEMS Devices And Method For Fabricating The Same App 20090057868 - Wang; Zhiqi ; et al.	2009-03-05
Wafer level chip size packaged chip device with an N-shape junction inside and method of fabricating the same Grant 7,394,152 - Yu , et al. July 1, 2	2008-07-01
Wafer Level Chip Size Packaged Chip Device With A Double-Layer Lead Structure And Method Of Fabricating The Same App 20080111223 - Yu; Guoqing ; et al.	2008-05-15
Wafer Level Chip Size Packaged Chip Device With An N-Shape Junction Inside And Method Of Fabricating The Same App 20080111228 - Yu; Guoqing ; et al.	2008-05-15

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