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Patent applications and USPTO patent grants for Yu; Fu-Yang.The latest application filed is for "wafer pressure regulation system for polishing machine".
Patent | Date |
---|---|
Pressure suppression device for chemical mechanical polishing machine and method thereof Grant 6,676,801 - Lai , et al. January 13, 2 | 2004-01-13 |
Wafer pressure regulation system for polishing machine Grant 6,648,729 - Lai , et al. November 18, 2 | 2003-11-18 |
Wafer pressure regulation system for polishing machine App 20030022595 - Lai, Chien-Hsin ;   et al. | 2003-01-30 |
Pressure suppression device for chemical mechanical polishing machine and method thereof App 20020153347 - Lai, Chien-Hsin ;   et al. | 2002-10-24 |
Auxiliary gasline-heating unit in chemical vapor deposition App 20010042930 - Lin, Juen-Kuen ;   et al. | 2001-11-22 |
Chemical-mechanical polishing pad Grant 6,120,366 - Lin , et al. September 19, 2 | 2000-09-19 |
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