Yu; Enchao
Patent Applications and Registrations
Patent applications and USPTO patent grants for Yu; Enchao.The latest application filed is for "electronic module with flexible portion".
- Yu; Enchao - Irvine CA
| Patent | Date |
|---|---|
| Electronic module with flexible portion Grant 8,864,500 - Bhakta , et al. October 21, 2 | 2014-10-21 |
| Heat dissipation for electronic modules Grant 8,705,239 - Yu , et al. April 22, 2 | 2014-04-22 |
| Memory module having thermal conduits Grant 8,488,325 - Yu July 16, 2 | 2013-07-16 |
| Circuit with flexible portion Grant 8,287,291 - Bhakta , et al. October 16, 2 | 2012-10-16 |
| Circuit with flexible portion Grant 8,033,836 - Bhakta , et al. October 11, 2 | 2011-10-11 |
| Heat dissipation for electronic modules Grant 8,018,723 - Yu , et al. September 13, 2 | 2011-09-13 |
| Heat spreader for memory modules Grant 7,839,643 - Yu November 23, 2 | 2010-11-23 |
| Circuit with flexible portion Grant 7,811,097 - Bhakta , et al. October 12, 2 | 2010-10-12 |
| Heat spreader for electronic modules Grant 7,619,893 - Yu November 17, 2 | 2009-11-17 |
| Circuit card with flexible connection for memory module with heat spreader Grant 7,442,050 - Bhakta , et al. October 28, 2 | 2008-10-28 |
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