Yu; Chun-Hui
Patent Applications and Registrations
Patent applications and USPTO patent grants for Yu; Chun-Hui.The latest application filed is for "semiconductor structure".
Company Profile
20.44.67
- Yu; Chun-Hui - Hsinchu County TW
- Yu; Chun Hui - Zhubei City TW
- Yu; Chun-Hui - Zhubei TW
- Yu; Chun-Hui - Tainan TW
- Yu; Chun-Hui - Tainan City TW
- Yu; Chun-Hui - Tainan County TW
- Yu; Chun-Hui - US
- Yu; Chun-Hui - Hsinchu TW
Patent Activity
| Patent | Date |
|---|---|
| Package Having Redistribution Layer Structure With Protective Layer App 20220302038 - Yu; Chen-Hua ; et al. | 2022-09-22 |
| 3d Semiconductor Packages App 20220302100 - Yu; Chen-Hua ; et al. | 2022-09-22 |
| Semiconductor Structure App 20220302068 - Yu; Chen-Hua ; et al. | 2022-09-22 |
| Package Structure And Manufacturing Method Thereof App 20220262703 - Yu; Chen-Hua ; et al. | 2022-08-18 |
| Semiconductor Device App 20220238408 - Yu; Chen-Hua ; et al. | 2022-07-28 |
| 3D semiconductor packages Grant 11,393,805 - Yu , et al. July 19, 2 | 2022-07-19 |
| Semiconductor structure comprising at least one system-on-integrated-circuit component Grant 11,380,645 - Yu , et al. July 5, 2 | 2022-07-05 |
| Package structure and manufacturing method thereof Grant 11,355,418 - Yu , et al. June 7, 2 | 2022-06-07 |
| Semiconductor device Grant 11,328,975 - Yu , et al. May 10, 2 | 2022-05-10 |
| Semiconductor Device App 20210407887 - Yu; Chen-Hua ; et al. | 2021-12-30 |
| Integrated fan-out package and method for fabricating the same Grant 11,211,336 - Yu , et al. December 28, 2 | 2021-12-28 |
| Package Structure And Method Of Forming The Same App 20210343666 - Yu; Chen-Hua ; et al. | 2021-11-04 |
| Semiconductor device and manufacturing method thereof Grant 11,139,223 - Yu , et al. October 5, 2 | 2021-10-05 |
| Package Having Redistribution Layer Structure With Protective Layer And Method Of Fabricating The Same App 20210296252 - Yu; Chen-Hua ; et al. | 2021-09-23 |
| Semiconductor package and method of fabricating semiconductor package Grant 11,075,184 - Yu , et al. July 27, 2 | 2021-07-27 |
| Package structure and method of forming the same Grant 11,069,636 - Yu , et al. July 20, 2 | 2021-07-20 |
| Semiconductor Package Structure App 20210217728 - HUNG; JENG-NAN ; et al. | 2021-07-15 |
| Semiconductor Packages And Methods Of Forming The Same App 20210202389 - Hsieh; Cheng-Yen ; et al. | 2021-07-01 |
| Package having redistribution layer structure with protective layer and method of fabricating the same Grant 11,031,344 - Yu , et al. June 8, 2 | 2021-06-08 |
| Semiconductor Structure App 20210159201 - Yu; Chen-Hua ; et al. | 2021-05-27 |
| Semiconductor Device App 20210159139 - Yu; Chen-Hua ; et al. | 2021-05-27 |
| Semiconductor package structure Grant 10,971,475 - Hung , et al. April 6, 2 | 2021-04-06 |
| Package Structure And Manufacturing Method Thereof App 20210098335 - Yu; Chen-Hua ; et al. | 2021-04-01 |
| Semiconductor packages with electromagnetic interference shielding layer and methods of forming the same Grant 10,950,554 - Yu , et al. March 16, 2 | 2021-03-16 |
| Semicondcutor Packages App 20210066279 - Yu; Chen-Hua ; et al. | 2021-03-04 |
| Semiconductor Package And Manufacturing Method Thereof App 20210035890 - Yu; Chen-Hua ; et al. | 2021-02-04 |
| Semiconductor Device and Method App 20200411469 - Yu; Chen-Hua ; et al. | 2020-12-31 |
| Chip package structure Grant 10,879,153 - Yu , et al. December 29, 2 | 2020-12-29 |
| Package-on-package structure and manufacturing method thereof Grant 10,879,220 - Yu , et al. December 29, 2 | 2020-12-29 |
| Semiconductor package and manufacturing method thereof Grant 10,861,773 - Yu , et al. December 8, 2 | 2020-12-08 |
| Semiconductor device and method Grant 10,770,428 - Yu , et al. Sep | 2020-09-08 |
| Methods and apparatus for sensor module Grant 10,714,525 - Yee , et al. | 2020-07-14 |
| Semiconductor Device And Manufacturing Method Thereof App 20200176357 - Yu; Chen-Hua ; et al. | 2020-06-04 |
| Semiconductor Package And Method Of Fabricating Semiconductor Package App 20200126940 - Yu; Chen-Hua ; et al. | 2020-04-23 |
| Package Structure And Method Of Forming The Same App 20200118953 - Yu; Chen-Hua ; et al. | 2020-04-16 |
| Package And Method Of Fabricating The Same App 20200075496 - Yu; Chen-Hua ; et al. | 2020-03-05 |
| Integrated Fan-out Package And Method For Fabricating The Same App 20200066642 - Yu; Chen-Hua ; et al. | 2020-02-27 |
| Semicondcutor Packages With Electromagnetic Interference Shielding Layer And Methods Of Forming The Same App 20200020643 - Yu; Chen-Hua ; et al. | 2020-01-16 |
| Semiconductor Device and Method App 20190393189 - Yu; Chen-Hua ; et al. | 2019-12-26 |
| Semiconductor package and method of fabricating semiconductor package Grant 10,515,921 - Yu , et al. Dec | 2019-12-24 |
| Package-on-package Structure And Manufacturing Method Thereof App 20190385989 - Yu; Chen-Hua ; et al. | 2019-12-19 |
| Package structure and method of forming the same Grant 10,510,695 - Yu , et al. Dec | 2019-12-17 |
| Semiconductor Package Structure App 20190363066 - HUNG; JENG-NAN ; et al. | 2019-11-28 |
| Integrated fan-out package and method for fabricating the same Grant 10,475,747 - Yu , et al. Nov | 2019-11-12 |
| Methods and Apparatus for Sensor Module App 20190244997 - Yee; Kuo-Chung ; et al. | 2019-08-08 |
| Semiconductor package structure and method of manufacturing the same Grant 10,373,931 - Hung , et al. | 2019-08-06 |
| Semiconductor device and method Grant 10,340,249 - Yu , et al. | 2019-07-02 |
| Chip Package Structure App 20190139865 - YU; Chen-Hua ; et al. | 2019-05-09 |
| Package Structure And Manufacturing Method Thereof App 20190139925 - Yu; Chen-Hua ; et al. | 2019-05-09 |
| Package structure and manufacturing method thereof Grant 10,283,473 - Yu , et al. | 2019-05-07 |
| Methods and apparatus for sensor module Grant 10,269,851 - Yee , et al. | 2019-04-23 |
| Package Structure And Method Of Forming The Same App 20190115311 - Yu; Chen-Hua ; et al. | 2019-04-18 |
| Semicondcutor Package And Manufacturing Method Thereof App 20190067169 - Yu; Chen-Hua ; et al. | 2019-02-28 |
| Integrated Fan-out Package And Method For Fabricating The Same App 20190051604 - Yu; Chen-Hua ; et al. | 2019-02-14 |
| Semiconductor Package And Method Of Fabricating Semiconductor Package App 20190035757 - Yu; Chen-Hua ; et al. | 2019-01-31 |
| Method for forming chip package structure Grant 10,177,078 - Yu , et al. J | 2019-01-08 |
| Package structure and method of forming the same Grant 10,157,864 - Yu , et al. Dec | 2018-12-18 |
| Chip Package Structure And Method For Forming The Same App 20180151477 - YU; Chen-Hua ; et al. | 2018-05-31 |
| Semiconductor Package Structure And Method Of Manufacturing The Same App 20180151538 - HUNG; JENG-NAN ; et al. | 2018-05-31 |
| Semiconductor package and manufacturing method thereof Grant 9,966,360 - Yu , et al. May 8, 2 | 2018-05-08 |
| Semicondcutor Package And Manufacturing Method Thereof App 20180012863 - Yu; Chen-Hua ; et al. | 2018-01-11 |
| Method of fabricating three dimensional integrated circuit Grant 9,761,513 - Yee , et al. September 12, 2 | 2017-09-12 |
| Method of multi-chip wafer level packaging Grant 9,679,882 - Tung , et al. June 13, 2 | 2017-06-13 |
| Method of forming interconnects for three dimensional integrated circuit Grant 9,583,365 - Yu , et al. February 28, 2 | 2017-02-28 |
| Method of Multi-Chip Wafer Level Packaging App 20160155731 - Tung; Chih-Hang ; et al. | 2016-06-02 |
| Methods and Apparatus for Sensor Module App 20160013235 - Yee; Kuo-Chung ; et al. | 2016-01-14 |
| Methods and apparatus for sensor module Grant 9,136,293 - Yee , et al. September 15, 2 | 2015-09-15 |
| Method of Fabricating Three Dimensional Integrated Circuit App 20140231991 - Yee; Kuo-Chung ; et al. | 2014-08-21 |
| Multi-chip wafer level package Grant 8,754,514 - Yu , et al. June 17, 2 | 2014-06-17 |
| Method of fabricating three dimensional integrated circuit Grant 8,741,691 - Yee , et al. June 3, 2 | 2014-06-03 |
| Methods and Apparatus for Sensor Module App 20140070348 - Yee; Kuo-Chung ; et al. | 2014-03-13 |
| Method of Forming Interconnects for Three Dimensional Integrated Circuit App 20130313121 - Yu; Chun Hui ; et al. | 2013-11-28 |
| Molded chip interposer structure and methods Grant 8,581,402 - Yu , et al. November 12, 2 | 2013-11-12 |
| Method of Fabricating Three Dimensional Integrated Circuit App 20130277829 - Yee; Kuo-Chung ; et al. | 2013-10-24 |
| Molded Chip Interposer Structure and Methods App 20130099377 - Yu; Chen-Hua ; et al. | 2013-04-25 |
| Multi-Chip Wafer Level Package App 20130037950 - Yu; Chun Hui ; et al. | 2013-02-14 |
| Method of Multi-Chip Wafer Level Packaging App 20130040423 - Tung; Chih-Hang ; et al. | 2013-02-14 |
| Molded chip interposer structure and methods Grant 8,338,945 - Yu , et al. December 25, 2 | 2012-12-25 |
| Molded Chip Interposer Structure and Methods App 20120098123 - Yu; Chen-Hua ; et al. | 2012-04-26 |
| Cooling Mechanism For Stacked Die Package And Method Of Manufacturing The Same App 20120063090 - HSIAO; Yi-Li ; et al. | 2012-03-15 |
| Cooling Mechanism For Stacked Die Package And Method Of Manufacturing The Same App 20120061059 - HSIAO; Yi-Li ; et al. | 2012-03-15 |
| RF module package for releasing stress Grant 7,911,044 - Yang , et al. March 22, 2 | 2011-03-22 |
| System-in-package and manufacturing method of the same Grant 7,884,461 - Hu , et al. February 8, 2 | 2011-02-08 |
| System-in-package and manufacturing method of the same App 20090321915 - Hu; Dyi-Chung ; et al. | 2009-12-31 |
| Method for forming filling paste structure of WL package Grant 7,476,565 - Yang , et al. January 13, 2 | 2009-01-13 |
| Structure of dielectric layers in built-up layers of wafer level package Grant 7,453,148 - Yang , et al. November 18, 2 | 2008-11-18 |
| Structure of Memory Card and the Method of the Same App 20080174008 - Yang; Wen-Kun ; et al. | 2008-07-24 |
| Packaging structure with coplanar filling paste and dice and with patterned glue for WL-CSP Grant 7,400,037 - Yang , et al. July 15, 2 | 2008-07-15 |
| RF module package App 20080157341 - Yang; Wen-Kun ; et al. | 2008-07-03 |
| RF module package App 20080157340 - Yang; Wen-Kun ; et al. | 2008-07-03 |
| Structure Of Dielectric Layers In Built-up Layers Of Wafer Level Package App 20080150130 - Yang; Wen-Kun ; et al. | 2008-06-26 |
| Tools Structure For Chip Redistribution And Method Of The Same App 20080142939 - Yang; Wen-Kun ; et al. | 2008-06-19 |
| Multi-chip Package Structure And Method Of Forming The Same App 20080136004 - Yang; Wen-Kun ; et al. | 2008-06-12 |
| Semiconductor Packaging Method By Using Large Panel Size App 20080085572 - Yang; Wen-Kun ; et al. | 2008-04-10 |
| Filling paste structure and process for WL-CSP App 20080044945 - Yang; Wen-Kun ; et al. | 2008-02-21 |
| Method For Separating Package Of Wlp App 20080029877 - Yang; Wen-Kun ; et al. | 2008-02-07 |
| FBGA and COB package structure for image sensor Grant 7,279,782 - Yang , et al. October 9, 2 | 2007-10-09 |
| Method for separating package of WLP App 20070072338 - Yang; Wen-Kun ; et al. | 2007-03-29 |
| Method for determining restored scanning position App 20070064284 - Chen; Cheng-Kuei ; et al. | 2007-03-22 |
| Filling paste structure and process for WL-CSP App 20060145364 - Yang; Wen-Kun ; et al. | 2006-07-06 |
| FBGA and COB package structure for image sensor App 20060145325 - Yang; Wen-Kun ; et al. | 2006-07-06 |
| Method for determining restored position App 20040042051 - Chen, Cheng-Kuei ; et al. | 2004-03-04 |
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