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Patent applications and USPTO patent grants for YU; CHIH-WEI.The latest application filed is for "cutting device for cutting composite material".
Patent | Date |
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Cutting Device For Cutting Composite Material App 20220274208 - LIN; SHIH-SHENG ;   et al. | 2022-09-01 |
Programming System For Tire Pressure Monitoring Sensor And Method For Programming App 20220253296 - LIN; SHIH-YAO ;   et al. | 2022-08-11 |
Multi-antenna Tire-pressure Monitoring System With Automatically Positioning Function App 20220234398 - YU; CHIH-WEI | 2022-07-28 |
Cutting device for thin semiconductor wafer and cutting method thereof Grant 11,020,821 - Liao , et al. June 1, 2 | 2021-06-01 |
Systems and methods for flexible HDD/SSD storage support Grant 10,691,628 - Lin , et al. | 2020-06-23 |
Cutting Device For Cutting Composite Material App 20200039004 - LIN; SHIH-SHENG ;   et al. | 2020-02-06 |
Server casing Grant 10,455,723 - Yu Oc | 2019-10-22 |
Cutting Device For Thin Semiconductor Wafer And Cutting Method Thereof App 20190126394 - LIAO; CHIEN-SHOU ;   et al. | 2019-05-02 |
Server Casing App 20180317338 - Yu; Chih-Wei | 2018-11-01 |
System and method for smart power clamping of a redundant power supply Grant 10,101,799 - Huang , et al. October 16, 2 | 2018-10-16 |
Chassis with lock mechanism Grant 9,933,821 - Huang , et al. April 3, 2 | 2018-04-03 |
Systems And Methods For Flexible Hdd/ssd Storage Support App 20170322898 - LIN; Fa-Da ;   et al. | 2017-11-09 |
System And Method For Smart Power Clamping Of A Redundant Power Supply App 20170285728 - HUANG; Jen-Hsuen ;   et al. | 2017-10-05 |
Chassis With Lock Mechanism App 20170235696 - HUANG; Jen-Hsuen ;   et al. | 2017-08-17 |
Dynamic power supply management Grant 9,588,571 - Huang , et al. March 7, 2 | 2017-03-07 |
Dynamic Power Supply Management App 20170010652 - HUANG; Jen-Hsuen ;   et al. | 2017-01-12 |
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