Yu; Chih-Kuang

Patent Applications and Registrations

Patent applications and USPTO patent grants for Yu; Chih-Kuang.The latest application filed is for "wafer level photonic device dies structure and method of making the same".

Company Profile

1.50.40

Yu; Chih-Kuang - Chiayi TW
Yu; Chih-Kuang - Hsinchu TW
YU; Chih-Kuang - Chiayi City TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Wafer level photonic devices dies structure and method of making the same Grant 9,502,627 - Yu , et al. November 22, 2	2016-11-22
Dicing-free LED fabrication Grant 9,472,714 - Hsia , et al. October 18, 2	2016-10-18
LED device with improved thermal performance Grant 9,379,299 - Hsia , et al. June 28, 2	2016-06-28
Doubled substrate multi-junction light emitting diode array structure Grant 9,349,712 - Yu , et al. May 24, 2	2016-05-24
Wafer Level Photonic Device Dies Structure And Method Of Making The Same App 20160118562 - YU; Chih-Kuang ; et al.	2016-04-28
Method and apparatus for accurate die-to-wafer bonding Grant 9,287,478 - Chern , et al. March 15, 2	2016-03-15
Wafer level photonic device die structure and method of making the same Grant 9,224,932 - Yu , et al. December 29, 2	2015-12-29
LED structure Grant 9,184,334 - Hsia , et al. November 10, 2	2015-11-10
Light emitting diode emitter substrate with highly reflective metal bonding Grant 9,099,632 - Chern , et al. August 4, 2	2015-08-04
Doubled Substrate Multi-junction Light Emitting Diode Array Structure App 20150162315 - Yu; Chih-Kuang ; et al.	2015-06-11
Led Device With Improved Thermal Performance App 20150140703 - Hsia; Hsing-Kuo ; et al.	2015-05-21
Dicing-free Led Fabrication App 20150093844 - Hsia; Hsing-Kuo ; et al.	2015-04-02
LED device with improved thermal performance Grant 8,993,447 - Hsia , et al. March 31, 2	2015-03-31
Double substrate multi-junction light emitting diode array structure Grant 8,962,358 - Yu , et al. February 24, 2	2015-02-24
Dicing-free LED fabrication Grant 8,912,033 - Hsia , et al. December 16, 2	2014-12-16
LED Structure App 20140339579 - Hsia; Shouli Steve ; et al.	2014-11-20
Method and Apparatus for Accurate Die-to-Wafer Bonding App 20140239323 - Chern; Chyi Shyuan ; et al.	2014-08-28
LED structure Grant 8,809,899 - Hsia , et al. August 19, 2	2014-08-19
Micro-Interconnects for Light-Emitting Diodes App 20140159096 - Hsia; Hsing-Kuo ; et al.	2014-06-12
Method and apparatus for accurate die-to-wafer bonding Grant 8,722,436 - Chern , et al. May 13, 2	2014-05-13
Wafer Level Photonic Device Die Structure and Method of Making the Same App 20140084244 - Yu; Chih-Kuang ; et al.	2014-03-27
Method and Apparatus for Accurate Die-to-Wafer Bonding App 20140065741 - Chern; Chyi Shyuan ; et al.	2014-03-06
LED Structure App 20140061688 - Hsia; Shouli Steve ; et al.	2014-03-06
Micro-interconnects for light-emitting diodes Grant 8,653,542 - Hsia , et al. February 18, 2	2014-02-18
Method and apparatus for accurate die-to-wafer bonding Grant 8,609,446 - Chern , et al. December 17, 2	2013-12-17
Wafer level photonic device die structure and method of making the same Grant 8,604,491 - Yu , et al. December 10, 2	2013-12-10
Methods of fabricating light emitting diode packages Grant 8,598,617 - Yu , et al. December 3, 2	2013-12-03
LED structure having embedded zener diode Grant 8,587,018 - Hsia , et al. November 19, 2	2013-11-19
Package structures for integrating thermoelectric components with stacking chips Grant 8,546,924 - Yu , et al. October 1, 2	2013-10-01
Led Device With Improved Thermal Performance App 20130230935 - HSIA; HSING-KUO ; et al.	2013-09-05
Light emitting diode components integrated with thermoelectric devices Grant 8,519,409 - Yu , et al. August 27, 2	2013-08-27
Laser etch via formation Grant 8,519,538 - Hsia , et al. August 27, 2	2013-08-27
Method And Apparatus For Accurate Die-to-wafer Bonding App 20130089937 - Chern; Chyi Shyuan ; et al.	2013-04-11
Wafer level conformal coating for LED devices Grant 8,415,183 - Hsia , et al. April 9, 2	2013-04-09
LED device with improved thermal performance Grant 8,415,684 - Hsia , et al. April 9, 2	2013-04-09
Wafer Level Photonic Device Die Structure And Method Of Making The Same App 20130020589 - Yu; Chih-Kuang ; et al.	2013-01-24
Led Structure App 20120326198 - HSIA; Shouli Steve ; et al.	2012-12-27
Methods of Fabricating Light Emitting Diode Packages App 20120286240 - Yu; Chih-Kuang ; et al.	2012-11-15
Double Substrate Multi-junction Light Emitting Diode Array Structure App 20120256187 - Yu; Chih-Kuang ; et al.	2012-10-11
Light Emitting Diode Emitter Substrate with Highly Reflective Metal Bonding App 20120228650 - Chern; Chyi Shyuan ; et al.	2012-09-13
Method Of Forming A Light Emitting Diode Emitter Substrate With Highly Reflective Metal Bonding App 20120205694 - Chern; Chyi Shyuan ; et al.	2012-08-16
Methods of fabricating light emitting diode packages Grant 8,241,932 - Yu , et al. August 14, 2	2012-08-14
Thermally conductive, electrically insulating composite film and stack chip package structure utilizing the same Grant 8,242,372 - Leu , et al. August 14, 2	2012-08-14
Method of forming a light emitting diode emitter substrate with highly reflective metal bonding Grant 8,236,584 - Chem , et al. August 7, 2	2012-08-07
Micro-interconnects For Light-emitting Diodes App 20120181568 - Hsia; Hsing-Kuo ; et al.	2012-07-19
Active solid heatsink device and fabricating method thereof Grant 8,222,728 - Yu , et al. July 17, 2	2012-07-17
Stacked-chip packaging structure and fabrication method thereof Grant 8,193,625 - Liu , et al. June 5, 2	2012-06-05
Thermoelectric conversion device Grant 8,188,360 - Feng , et al. May 29, 2	2012-05-29
Wafer Level Conformal Coating For Led Devices App 20120129282 - Hsia; Hsing-Kuo ; et al.	2012-05-24
Light Emitting Diode Components Integrated With Thermoelectric Devices App 20120119246 - Yu; Chih-Kuang ; et al.	2012-05-17
Led Device With Improved Thermal Performance App 20120119228 - Hsia; Hsing-Kuo ; et al.	2012-05-17
Dicing-free Led Fabrication App 20120088322 - Hsia; Hsing-Kuo ; et al.	2012-04-12
Apparatus and method for measuring characteristic and chip temperature of LED Grant 8,075,182 - Dai , et al. December 13, 2	2011-12-13
Laser Etch Via Formation App 20110266674 - Hsia; Hsing-Kuo ; et al.	2011-11-03
Integrated package structure having solar cell and thermoelectric element and method of fabricating the same Grant 8,008,573 - Dai , et al. August 30, 2	2011-08-30
Flexible thermoelectric device Grant 7,999,172 - Yu , et al. August 16, 2	2011-08-16
Fabricating method of light emitting diode package Grant 7,972,877 - Dai , et al. July 5, 2	2011-07-05
Thermally Conductive, Electrically Insulating Composite Film And Stack Chip Package Structure Utilizing The Same App 20110149521 - Leu; Ming-Sheng ; et al.	2011-06-23
Package Structures For Integrating Thermoelectric Components With Stacking Chips App 20110042805 - Yu; Chih-Kuang ; et al.	2011-02-24
Light emitting diode package structure Grant 7,855,396 - Dai , et al. December 21, 2	2010-12-21
Stacked-chip packaging structure and fabrication method thereof App 20100290193 - Liu; Chun-Kai ; et al.	2010-11-18
Thermoelectric Conversion Device App 20100224226 - Feng; Suh-Yun ; et al.	2010-09-09
Encapsulation and methods thereof Grant 7,633,154 - Dai , et al. December 15, 2	2009-12-15
Fabricating Method Of Light Emitting Diode Package App 20090258449 - Dai; Ming-Ji ; et al.	2009-10-15
Active Solid Heatsink Device And Fabricating Method Thereof App 20090245308 - YU; Chih-Kuang ; et al.	2009-10-01
Light emitting diode package structure and fabricating method thereof Grant 7,586,125 - Dai , et al. September 8, 2	2009-09-08
Apparatus And Method For Measuring Characteristic And Chip Temperature Of Led App 20090154525 - Dai; Ming-Ji ; et al.	2009-06-18
Lighting devices Grant 7,517,114 - Tain , et al. April 14, 2	2009-04-14
Flexible Thermoelectric Device And Manufacturing Method Thereof App 20090014046 - Yu; Chih-Kuang ; et al.	2009-01-15
Integrated Package Structure Having Solar Cell And Thermoelectric Element And Method Of Fabricating The Same App 20080295878 - Dai; Ming-Ji ; et al.	2008-12-04
Lighting Devices App 20080013320 - Tain; Ra-Min ; et al.	2008-01-17
Light Emitting Diode Package Structure And Fabricating Method Thereof App 20080006843 - Dai; Ming-Ji ; et al.	2008-01-10
Light Emitting Diode Package Structure And Fabricating Method Thereof App 20070194465 - Dai; Ming-Ji ; et al.	2007-08-23
Encapsulation and methods thereof App 20070187815 - Dai; Ming-Ji ; et al.	2007-08-16
Light-emitting-diode packaging structure having thermal-electric element App 20070012938 - Yu; Chih-Kuang ; et al.	2007-01-18