Yu; Chia-Lin

Patent Applications and Registrations

Patent applications and USPTO patent grants for Yu; Chia-Lin.The latest application filed is for "neural network processing unit for hybrid and mixed precision computing".

Company Profile

4.50.46

Yu; Chia-Lin - Hsinchu TW
YU; Chia-Lin - Sigang Township TW
Yu; Chia-Lin - Tainan County TW
Yu; Chia-Lin - New Taipei TW
Yu; Chia-Lin - Sigang TW
Yu; Chia-Lin - New Taipei City TW
Yu; Chia-Lin - Tainan N/A TW
Yu; Chia-Lin - Sigang Township, Tainan County N/A TW
Yu; Chia-Lin - Singang Township TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Neural Network Processing Unit For Hybrid And Mixed Precision Computing App 20220156567 - Lin; Chien-Hung ; et al.	2022-05-19
Semiconductor Component Having Through-silicon Vias App 20210005515 - YU; Chen-Hua ; et al.	2021-01-07
Method of making a semiconductor component having through-silicon vias Grant 10,784,162 - Yu , et al. Sept	2020-09-22
Method of manufacturing a semiconductor device including through silicon plugs Grant 10,497,619 - Yu , et al. De	2019-12-03
Method Of Making A Semiconductor Component Having Through-silicon Vias App 20190067107 - YU; Chen-Hua ; et al.	2019-02-28
Method Of Manufacturing A Semiconductor Device Including Through Silicon Plugs App 20180350678 - YU; Chen-Hua ; et al.	2018-12-06
Semiconductor component having through-silicon vias and method of manufacture Grant 10,115,634 - Yu , et al. October 30, 2	2018-10-30
Light-emitting device Grant 10,062,821 - Chen , et al. August 28, 2	2018-08-28
Method of manufacturing a semiconductor device including through silicon plugs Grant 10,049,931 - Yu , et al. August 14, 2	2018-08-14
Screwing accessory device Grant 9,827,653 - Cheng , et al. November 28, 2	2017-11-28
Light-emitting Device App 20170271568 - CHEN; Ding-Yuan ; et al.	2017-09-21
Light-emitting device including reflective layer Grant 9,698,325 - Chen , et al. July 4, 2	2017-07-04
Semiconductor Component Having Through-silicon Vias And Method Of Manufacture App 20160329245 - YU; Chen-Hua ; et al.	2016-11-10
Clamping structure, electronic device and clamping component Grant 9,448,585 - Cheng , et al. September 20, 2	2016-09-20
Semiconductor component having through-silicon vias and method of manufacture Grant 9,418,923 - Yu , et al. August 16, 2	2016-08-16
Method Of Manufacturing A Semiconductor Device Including Through Silicon Plugs App 20160197014 - YU; Chen-Hua ; et al.	2016-07-07
Light-emitting diodes on concave texture substrate Grant 9,373,755 - Yu , et al. June 21, 2	2016-06-21
Through silicon via (TSV) isolation structures for noise reduction in 3D integrated circuit Grant 9,305,864 - Horng , et al. April 5, 2	2016-04-05
Method of manufacturing a semiconductor device including through silicon plugs Grant 9,287,440 - Yu , et al. March 15, 2	2016-03-15
Light-emitting Device App 20160064632 - CHEN; Ding-Yuan ; et al.	2016-03-03
Method of forming light-generating device including reflective layer Grant 9,214,613 - Chen , et al. December 15, 2	2015-12-15
Light-emitting diode with textured substrate Grant 9,130,115 - Yu , et al. September 8, 2	2015-09-08
Clamping Structure, Electronic Device And Clamping Component App 20150245521 - Cheng; Jui-Kai ; et al.	2015-08-27
Screwing Accessory Device App 20150158158 - Cheng; Jui-Kai ; et al.	2015-06-11
Novel Semiconductor Package With Through Silicon Vias App 20150147834 - Yu; Chen-Hua ; et al.	2015-05-28
Semiconductor package with through silicon vias Grant 8,946,742 - Yu , et al. February 3, 2	2015-02-03
III-V compound semiconductor epitaxy from a non-III-V substrate Grant 8,878,252 - Yu , et al. November 4, 2	2014-11-04
Reflective Layer for Light-Emitting Diodes App 20140235001 - Chen; Ding-Yuan ; et al.	2014-08-21
III-V compound semiconductor epitaxy using lateral overgrowth Grant 8,803,189 - Yu , et al. August 12, 2	2014-08-12
Stress-alleviation layer for LED structures Grant 8,779,445 - Yu , et al. July 15, 2	2014-07-15
Light-Emitting Diode with Textured Substrate App 20140166979 - Yu; Chen-Hua ; et al.	2014-06-19
III-V Compound Semiconductor Epitaxy From a Non-III-V Substrate App 20140159208 - Yu; Chia-Lin ; et al.	2014-06-12
Reflective layer between light-emitting diodes Grant 8,716,723 - Chen , et al. May 6, 2	2014-05-06
III-V compound semiconductor epitaxy from a non-III-V substrate Grant 8,686,474 - Chen , et al. April 1, 2	2014-04-01
Light-Emitting Diodes on Concave Texture Substrate App 20140087505 - Yu; Chen-Hua ; et al.	2014-03-27
Light-emitting diode with textured substrate Grant 8,659,033 - Yu , et al. February 25, 2	2014-02-25
Semiconductor Component Having Through-silicon Vias And Method Of Manufacture App 20140015146 - YU; Chen-Hua ; et al.	2014-01-16
Light-emitting diodes on concave texture substrate Grant 8,629,465 - Yu , et al. January 14, 2	2014-01-14
Through Silicon Via (tsv) Isolation Structures For Noise Reduction In 3d Integrated Circuit App 20140008817 - HORNG; Jaw-Juinn ; et al.	2014-01-09
Method Of Manufacturing A Semiconductor Device Including Through Silicon Plugs App 20130302979 - YU; Chen-Hua ; et al.	2013-11-14
Through-silicon vias for semicondcutor substrate and method of manufacture Grant 8,575,725 - Yu , et al. November 5, 2	2013-11-05
Through silicon via (TSV) isolation structures for noise reduction in 3D integrated circuit Grant 8,546,953 - Horng , et al. October 1, 2	2013-10-01
III-nitride based semiconductor structure with multiple conductive tunneling layer Grant 8,519,414 - Yu , et al. August 27, 2	2013-08-27
Heat dissipation by through silicon plugs Grant 8,507,940 - Yu , et al. August 13, 2	2013-08-13
Through-silicon Vias For Semicondcutor Substrate And Method Of Manufacture App 20130193578 - YU; Chen-Hua ; et al.	2013-08-01
Through-silicon vias for semicondcutor substrate and method of manufacture Grant 8,487,410 - Yu , et al. July 16, 2	2013-07-16
Realizing N-face III-nitride semiconductors by nitridation treatment Grant 8,486,807 - Yu , et al. July 16, 2	2013-07-16
Through Silicon Via (tsv) Isolation Structures For Noise Reduction In 3d Integrated Circuit App 20130147057 - HORNG; Jaw-Juinn ; et al.	2013-06-13
III-V Compound Semiconductor Epitaxy From a Non-III-V Substrate App 20130126946 - Yu; Chia-Lin ; et al.	2013-05-23
III-V compound semiconductor epitaxy from a non-III-V substrate Grant 8,377,796 - Yu , et al. February 19, 2	2013-02-19
Through-silicon Vias For Semicondcutor Substrate And Method Of Manufacture App 20120261827 - YU; Chen-Hua ; et al.	2012-10-18
Method for thinning a wafer Grant 8,252,682 - Yang , et al. August 28, 2	2012-08-28
Light-Emitting Diodes on Concave Texture Substrate App 20120119236 - Yu; Chen-Hua ; et al.	2012-05-17
Group-III nitride for reducing stress caused by metal nitride reflector Grant 8,154,038 - Yu , et al. April 10, 2	2012-04-10
Carbon-containing semiconductor substrate Grant 8,148,732 - Yu , et al. April 3, 2	2012-04-03
Thermally Efficient Packaging For A Photonic Device App 20120068218 - Chang; Hung-Pin ; et al.	2012-03-22
MOSFETs having stacked metal gate electrodes and method Grant 8,138,076 - Lin , et al. March 20, 2	2012-03-20
Light-emitting diodes on concave texture substrate Grant 8,134,163 - Yu , et al. March 13, 2	2012-03-13
Light-Emitting Diode with Textured Substrate App 20120025234 - Yu; Chen-Hua ; et al.	2012-02-02
III-Nitride Based Semiconductor Structure with Multiple Conductive Tunneling Layer App 20120007048 - Yu; Chia-Lin ; et al.	2012-01-12
Light-emitting diode with textured substrate Grant 8,058,082 - Yu , et al. November 15, 2	2011-11-15
III-nitride based semiconductor structure with multiple conductive tunneling layer Grant 8,044,409 - Yu , et al. October 25, 2	2011-10-25
Heat Dissipation By Through Silicon Plugs App 20110241061 - YU; Chen-Hua ; et al.	2011-10-06
Novel Semiconductor Package With Through Silicon Vias App 20110241040 - YU; Chen-Hua ; et al.	2011-10-06
Method For Thinning A Wafer App 20110198721 - YANG; Ku-Feng ; et al.	2011-08-18
Realizing N-Face III-Nitride Semiconductors by Nitridation Treatment App 20110189837 - Yu; Chen-Hua ; et al.	2011-08-04
Structure and method for a CMOS device with doped conducting metal oxide as the gate electrode Grant 7,947,588 - Yu , et al. May 24, 2	2011-05-24
Realizing N-face III-nitride semiconductors by nitridation treatment Grant 7,875,534 - Yu , et al. January 25, 2	2011-01-25
III-V Compound Semiconductor Epitaxy From a Non-III-V Substrate App 20100068866 - Yu; Chia-Lin ; et al.	2010-03-18
Structure And Method For A Cmos Device With Doped Conducting Metal Oxide As The Gate Electrode App 20100052066 - Yu; Chen-Hua ; et al.	2010-03-04
Carbon-Containing Semiconductor Substrate App 20100051965 - Yu; Chen-Hua ; et al.	2010-03-04
III-V Compound Semiconductor Epitaxy Using Lateral Overgrowth App 20100044719 - Yu; Chen-Hua ; et al.	2010-02-25
Reflective Layer for Light-Emitting Diodes App 20100038655 - Chen; Ding-Yuan ; et al.	2010-02-18
III-Nitride Based Semiconductor Structure with Multiple Conductive Tunneling Layer App 20100032718 - Yu; Chia-Lin ; et al.	2010-02-11
Light-Emitting Diode with Textured Substrate App 20100032696 - Yu; Chen-Hua ; et al.	2010-02-11
Light-Emitting Diodes on Concave Texture Substrate App 20100032700 - Yu; Chen-Hua ; et al.	2010-02-11
Vertical III-Nitride Light Emitting Diodes on Patterned Substrates with Embedded Bottom Electrodes App 20100012954 - Yu; Chen-Hua ; et al.	2010-01-21
Realizing N-Face III-Nitride Semiconductors by Nitridation Treatment App 20100015787 - Yu; Chen-Hua ; et al.	2010-01-21
Group-III Nitride for Reducing Stress Caused by Metal Nitride Reflector App 20100001302 - Yu; Chen-Hua ; et al.	2010-01-07
Stress-Alleviation Layer for LED Structures App 20100001257 - Yu; Chen-Hua ; et al.	2010-01-07
MOSFETS Having Stacked Metal Gate Electrodes and Method App 20090280632 - Lin; Cheng-Tung ; et al.	2009-11-12
Poly-Crystalline Layer Structure for Light-Emitting Diodes App 20090272975 - Chen; Ding-Yuan ; et al.	2009-11-05