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Method of inserting dummy boundary cells for macro/IP and IC
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Method Of Forming Power Grid Structures
App 20220093513 - BISWAS; Hiranmay ; et al. | 2022-03-24 |
Power grid structures and method of forming the same
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Via Rail Solution For High Power Electromigration
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Via rail solution for high power electromigration
Grant 11,088,092 - Sio , et al. August 10, 2 | 2021-08-10 |
Via rail solution for high power electromigration
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Method Of Inserting Dummy Boundary Cells For Macro/ip And Ic
App 20210042461 - HU; Wei-Yi ; et al. | 2021-02-11 |
Power strap structure for high performance and low current density
Grant 10,861,790 - Chen , et al. December 8, 2 | 2020-12-08 |
Via Rail Solution For High Power Electromigration
App 20200083182 - Sio; Kam-Tou ; et al. | 2020-03-12 |
Via rail solution for high power electromigration
Grant 10,510,688 - Sio , et al. Dec | 2019-12-17 |
Power Strap Structure For High Performance And Low Current Density
App 20190122987 - Chen; Chih-Liang ; et al. | 2019-04-25 |
Power strap structure for high performance and low current density
Grant 10,170,422 - Chen , et al. J | 2019-01-01 |
Via Rail Solution For High Power Electromigration
App 20180358309 - Sio; Kam-Tou ; et al. | 2018-12-13 |
Power Strap Structure For High Performance And Low Current Density
App 20180174967 - Chen; Chih-Liang ; et al. | 2018-06-21 |
Power Grid Structures And Method Of Forming The Same
App 20180151496 - BISWAS; Hiranmay ; et al. | 2018-05-31 |
Power strap structure for high performance and low current density
Grant 9,911,697 - Chen , et al. March 6, 2 | 2018-03-06 |
Switch cell structure and method
Grant 9,900,005 - Chen , et al. February 20, 2 | 2018-02-20 |
Duplicate layering and routing
Grant 9,893,009 - Chen , et al. February 13, 2 | 2018-02-13 |
Switch Cell Structure and Method
App 20170346485 - Chen; Chih-Liang ; et al. | 2017-11-30 |
Power Strap Structure For High Performance And Low Current Density
App 20170317027 - Chen; Chih-Liang ; et al. | 2017-11-02 |
Via Rail Solution for High Power Electromigration
App 20170117272 - Sio; Kam-Tou ; et al. | 2017-04-27 |
System for and method of checking joule heating of an integrated circuit design
Grant 9,619,599 - Yu , et al. April 11, 2 | 2017-04-11 |
Power rail for preventing DC electromigration
Grant 9,405,883 - Lin , et al. August 2, 2 | 2016-08-02 |
System and method of electromigration avoidance for automatic place-and-route
Grant 9,311,440 - Kao , et al. April 12, 2 | 2016-04-12 |
System For And Method Of Checking Joule Heating Of An Integrated Circuit Design
App 20160063160 - YU; Chi-Yeh ; et al. | 2016-03-03 |
Power Rail For Preventing Dc Electromigration
App 20160004809 - LIN; Chin-Shen ; et al. | 2016-01-07 |
System and method of electromigration mitigation in stacked IC designs
Grant 9,223,919 - Yu , et al. December 29, 2 | 2015-12-29 |
Method for forming through-silicon via (TSV) with diffused isolation well
Grant 9,214,390 - Yu December 15, 2 | 2015-12-15 |
Power rail for preventing DC electromigration
Grant 9,165,882 - Lin , et al. October 20, 2 | 2015-10-20 |
Duplicate Layering And Routing
App 20150200159 - Chen; Huang-Yu ; et al. | 2015-07-16 |
Generating database for cells routable in pin layer
Grant 9,064,081 - Hsu , et al. June 23, 2 | 2015-06-23 |
Generating Database For Cells Routable In Pin Layer
App 20150161319 - HSU; MENG-KAI ; et al. | 2015-06-11 |
Power Rail For Preventing Dc Electromigration
App 20150095864 - LIN; Chin-Shen ; et al. | 2015-04-02 |
Method For Forming Through-silicon Via (tsv) With Diffused Isolation Well
App 20140295655 - YU; Chi-Yeh | 2014-10-02 |
Method and structure for through-silicon via (TSV) with diffused isolation well
Grant 8,766,409 - Yu July 1, 2 | 2014-07-01 |
System and method for across-chip thermal and power management in stacked IC designs
Grant 8,701,073 - Fu , et al. April 15, 2 | 2014-04-15 |
System And Method Of Electromigration Mitigation In Stacked Ic Designs
App 20140101626 - YU; Chi-Yeh ; et al. | 2014-04-10 |
System And Method For Across-chip Thermal And Power Management In Stacked Ic Designs
App 20140096102 - FU; Chung-min ; et al. | 2014-04-03 |
3D-IC interposer testing structure and method of testing the structure
Grant 8,680,882 - Tseng , et al. March 25, 2 | 2014-03-25 |
System and method of electromigration mitigation in stacked IC designs
Grant 8,631,372 - Yu , et al. January 14, 2 | 2014-01-14 |
System And Method Of Electromigration Avoidance For Automatic Place-and- Route
App 20130304449 - KAO; Jerry ; et al. | 2013-11-14 |
System And Method Of Electromigration Mitigation In Stacked Ic Designs
App 20130212544 - YU; Chi-Yeh ; et al. | 2013-08-15 |
3d-ic Interposer Testing Structure And Method Of Testing The Structure
App 20130106459 - TSENG; Nan-Hsin ; et al. | 2013-05-02 |
Method of scaling input data and mobile device utilizing the same
Grant 8,374,295 - Yu , et al. February 12, 2 | 2013-02-12 |
Method And Structure For Through-silicon Via (tsv) With Diffused Isolation Well
App 20120326319 - YU; Chi-Yeh | 2012-12-27 |
Three-dimensional Size Measuring System And Three-dimensional Size Measuring Method
App 20120120198 - Yu; Chi-Yeh ; et al. | 2012-05-17 |
Mobile communication device and data reception method
Grant 7,937,643 - Chang , et al. May 3, 2 | 2011-05-03 |
Timing synchronization in wireless communication system
Grant 7,936,856 - Kuo , et al. May 3, 2 | 2011-05-03 |
Method Of Scaling Input Data And Mobile Device Utilizing The Same
App 20080069269 - Yu; Chi-Yeh ; et al. | 2008-03-20 |
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